Group 1 - Lianqi Technology (澜起科技) debuted on the Hong Kong Stock Exchange on February 9, 2023, with a closing price of HKD 175 per share, marking a 63.72% increase on its first day of trading [1] - The company focuses on providing innovative, reliable, and high-efficiency interconnect solutions for cloud computing and AI infrastructure, with IPO proceeds aimed at R&D, commercialization, strategic investments, and general corporate purposes [1] - The strong market response reflects the company's technological barriers and the benefits of its sector, aligning with the demand for computing infrastructure upgrades [1] Group 2 - Tongcheng New Materials (彤程新材) has submitted a listing application to the Hong Kong Stock Exchange, with Cathay Pacific Securities as the exclusive sponsor [2] - The company is a leading comprehensive new materials service provider in China, focusing on advanced chemical products, including electronic materials and biodegradable materials [2] - The listing is expected to enhance R&D investment and global production capacity expansion, leveraging its first-mover advantage in domestic photolithography resin [2] Group 3 - China Nuclear International (中核国际) announced a positive earnings forecast, expecting revenue to reach at least HKD 2.46 billion and gross profit to increase to at least HKD 260 million in 2025 [3] - This represents a significant increase from the 2024 expected revenue of approximately HKD 1.841 billion and gross profit of HKD 234 million, driven by increased uranium trading volumes [3] - The company's growth is supported by its unique position within the China National Nuclear Corporation and the rigid demand from domestic nuclear power expansion [3] Group 4 - Hong Kong Telecommunications (香港电讯) reported a 5% year-on-year increase in total revenue for 2025, reaching HKD 36.553 billion [4] - EBITDA grew by 4% to HKD 14.234 billion, while profit attributable to shareholders increased by 4% to HKD 5.286 billion [4] - The steady growth is attributed to robust performance in 5G and data services, reinforcing its position as a leading utility provider in Hong Kong [4] Group 5 - The Hang Seng Index closed at 27,027.16, up 1.76% on February 9, 2023 [5] - The Hang Seng Tech Index rose by 1.34% to 5,417.60, while the Hang Seng Composite Index increased by 1.52% to 9,168.33 [5]

香港交易及結算所有限公司及香港聯合交易所有限公司對本公告的內容概不負責，對其準確性 或完整性亦不發表任何聲明，並明確表示概不對因本公告全部或任何部分內容而產生或因倚賴 該等內容而引致的任何損失承擔任何責任。 Montage Technology Co., Ltd. 瀾起科技股份有限公司 （於中華人民共和國註冊成立的股份有限公司） （股份代號：6809） 海外監管公告 本公告乃根據《香港聯合交易所有限公司證券上市規則》第13.10B條而作出。 茲載列瀾起科技股份有限公司在上海證券交易所網站刊登的《關於持股5%以上股 東權益變動觸及1%刻度的提示性公告》，僅供參閱。 承董事會命 瀾起科技股份有限公司 楊崇和 董事會主席、執行董事兼首席執行官 香港，2026年2月9日 於本公告日期，本公司董事為：(i)執行董事楊崇和博士及Stephen Kuong-Io Tai先 生；(ii)非執行董事Wang Rui博士及方周婕女士；及(iii)獨立非執行董事李若山博 士、高秉強教授、Yuhua Cheng博士及單海玲博士。 证券代码：688008 证券简称：澜起科技 公告编号：2026-011 | 权益变动方向 | 比例增加□ ...

格隆汇2月9日丨澜起科技(06809.HK)公告，澜起科技股份有限公司(以下简称"公司")正在进行发行境外 上市股份(H股)并在香港联合交易所有限公司(以下简称"香港联交所")主板挂牌上市(以下简称"本次发行 上市")的相关工作。 经香港联交所批准，公司本次发行的65,890,000股H股股票(行使超额配售权前)于2026年2月9日在香港联 交所主板挂牌并上市交易。公司H股股票中文简称为"澜起科技"，英文简称为"MONTAGETECH"，股 份代号为"6809"。 公司本次全球发售H股总数为65,890,000股(行使超额配售权前)，其中，香港公开发售6,589,000股，约占 全球发售总数的10%(行使超额配售权前)；国际发售59,301,000股，约占全球发售总数的90%(行使超额 配售权前)。根据每股H股发售价106.89港元计算，经扣除全球发售相关包销佣金、费用及估计开支后， 在超额配售权行使前，公司将收取的全球发售所得款项净额估计约为69.05亿港元。 ...

Montage Technology Co., Ltd. 瀾起科技股份有限公司 （於中華人民共和國註冊成立的股份有限公司） 香港交易及結算所有限公司及香港聯合交易所有限公司對本公告的內容概不負責，對其準確性 或完整性亦不發表任何聲明，並明確表示概不對因本公告全部或任何部分內容而產生或因倚賴 該等內容而引致的任何損失承擔任何責任。 （股份代號：6809） 海外監管公告 本公告乃根據《香港聯合交易所有限公司證券上市規則》第13.10B條而作出。 茲載列瀾起科技股份有限公司在上海證券交易所網站刊登的《關於H股掛牌並上市 交易的公告》，僅供參閱。 承董事會命 瀾起科技股份有限公司 楊崇和 董事會主席、執行董事兼首席執行官 香港，2026年2月9日 於本公告日期，本公司董事為：(i)執行董事楊崇和博士及Stephen Kuong-Io Tai先 生；(ii)非執行董事Wang Rui博士及方周婕女士；及(iii)獨立非執行董事李若山博 士、高秉強教授、Yuhua Cheng博士及單海玲博士。 澜起科技股份有限公司（以下简称"公司"）正在进行发行境外上市股份（H 股）并在香港联合交易所有限公司（以下简称"香港联交所"）主 ...

Core Viewpoint - The successful IPO of Lanqi Technology on the Hong Kong Stock Exchange marks a significant milestone for the company and its founder, Yang Chonghe, who is recognized as a leading figure in IC design. The company has achieved a dominant position in the memory interconnect chip market, driven by the growing demand for AI and data center technologies [1][5][10]. Company Overview - Yang Chonghe, known as the "first returnee in IC design," has led Lanqi Technology through three IPOs, including its recent listing on the Hong Kong Stock Exchange [1][3]. - Lanqi Technology started with set-top box chips and has grown to dominate the memory interconnect chip market, achieving a market share of 36.8% in 2024 [1][6]. IPO Details - The IPO was priced at HKD 106.89 per share, raising a net amount of HKD 6.905 billion, with a subscription rate of 707.3 times [1][8]. - The company attracted significant cornerstone investors, including JPMIMI, UBS AM, and others, who collectively subscribed to 32.828 million shares, accounting for 49.82% of the total offering [1][8]. Market Performance - On its first trading day, Lanqi Technology's stock surged by 63.72%, closing at HKD 175.00 per share, resulting in a market capitalization exceeding HKD 212.155 billion [1][9]. - The company's A-share performance has also been strong, with a 74.61% increase in 2025 and a further 47.24% rise in early 2026 [10]. Financial Performance - Lanqi Technology's revenue and net profit have shown significant growth, with projected net profits for 2025 expected to reach between RMB 2.15 billion and RMB 2.35 billion, representing a year-on-year increase of 52.29% to 66.46% [10]. - The company anticipates a substantial increase in demand for its interconnect chips due to the AI industry's growth, particularly as the focus shifts from training to inference [10]. Industry Outlook - The global high-speed interconnect chip market is projected to grow from USD 15.4 billion in 2024 to USD 49 billion by 2030, with a compound annual growth rate of 21.2% [11].

Core Viewpoint - 澜起科技股份有限公司 (06809.HK) successfully listed on the Hong Kong Stock Exchange, closing at 175.00 HKD, representing a 63.72% increase from its initial offering price of 106.89 HKD [1][2]. Group 1: Company Overview - 澜起科技 is a fabless integrated circuit design company focused on providing innovative, reliable, and energy-efficient interconnect solutions for cloud computing and AI infrastructure [1]. - The company issued a total of 65,890,000 shares, with 6,589,000 shares allocated for public offering in Hong Kong and 59,301,000 shares for international offering [2]. Group 2: Financial Details - The total amount raised from the offering, before the exercise of the over-allotment option, was 7,043.0 million HKD, with net proceeds amounting to 6,904.6 million HKD after deducting estimated listing expenses of 138.4 million HKD [3]. - 澜起科技 plans to utilize the net proceeds for research and development in interconnect chips, enhancing commercialization capabilities, strategic investments and/or acquisitions, working capital, and general corporate purposes [3]. Group 3: Key Investors - The cornerstone investors in this offering include JPMIMI, UBS AM, Yunfeng Capital, and several others, collectively holding significant stakes in the company [4]. Group 4: Historical Context - 澜起科技 was previously listed on the Shanghai Stock Exchange's STAR Market on July 22, 2019, raising a total of 280,193.84 million CNY, with a net amount of 274,655.81 million CNY after expenses [7]. - The company’s initial public offering in 2019 aimed to raise funds for projects related to next-generation memory interface chips, server CPU technology upgrades, and AI chip development [7].

Market Overview - The Hong Kong stock market experienced a strong rebound, with the Hang Seng Index closing at 27,027.16 points, up 1.76% or 467.21 points, and a total trading volume of 255.14 billion HKD [1] - The Hang Seng Tech Index rose 1.34% to 5,417.6 points, while the Hang Seng China Enterprises Index increased by 1.52% to 9,168.33 points [1] - Analysts from Galaxy Securities noted a significant "Spring Festival effect" in the market, driven by optimistic sentiment and early capital allocation [1] Blue-Chip Stocks Performance - Innovent Biologics (01801) led the blue-chip stocks, surging 7.42% to 85.4 HKD, contributing 15.57 points to the Hang Seng Index [2] - The company announced a strategic partnership with Eli Lilly to advance global R&D in oncology and immunology, receiving an upfront payment of 350 million USD and potential milestone payments up to 8.5 billion USD [2] - Other notable blue-chip movements included Pop Mart (09992) up 5.76%, Zijin Mining (02899) up 5.58%, while China Telecom (00728) and China Mobile (00941) saw declines of 2.96% and 2.12%, respectively [2] Sector Highlights - Major technology stocks showed positive performance, with Baidu rising over 3%, Tencent up over 2%, and Alibaba increasing by 1.87% [3] - AI application stocks were particularly strong, with Zhipu AI soaring over 36% to a new high [3] - The gold sector rebounded significantly, with spot gold returning to 5,000 USD per ounce, leading to gains in gold stocks [3][6] AI and Technology Developments - Recent financial reports from Meta, Amazon, Google, and Microsoft indicated a potential capital expenditure of 660 billion USD in AI infrastructure this year [4] - Zhipu AI's stock rose 36.22% to 276.8 HKD, reflecting strong market interest in AI applications [4] - The Chinese government is focusing on building a national computing power interconnection node system, which may further stimulate the AI sector [4] New Market Entrants - Lanqi Technology (06809) debuted with a remarkable 63.72% increase, closing at 175 HKD, following its IPO pricing at 106.89 HKD per share [9] - The company specializes in integrated circuit design for cloud computing and AI infrastructure [9] - Additionally,兆易创新 (03986) saw an 11.43% rise to 314 HKD, supported by its inclusion in the Hong Kong Stock Connect program and positive earnings forecasts [10]

每经AI快讯，港股芯片股今日回暖。截至发稿，澜起科技(06809.HK)涨52.31%，报162.8港元；兆易创 新(03986.HK)涨10.5%，报311.4港元；华虹半导体(01347.HK)涨5.89%，报105.1港元；中芯国际 (00981.HK)涨4.29%，报70.5港元。 ...

Core Viewpoint - The semiconductor sector is experiencing a rebound, with significant stock price increases for various companies, driven by strong demand for AI computing power and upcoming earnings reports from major players in the wafer foundry industry [1] Group 1: Stock Performance - Lanke Technology (06809) increased by 52.31%, reaching HKD 162.8 [1] - Zhaoyi Innovation (03986) rose by 10.5%, reaching HKD 311.4 [1] - Huahong Semiconductor (01347) gained 5.89%, reaching HKD 105.1 [1] - SMIC (00981) saw a rise of 4.29%, reaching HKD 70.5 [1] Group 2: Upcoming Earnings Reports - SMIC is scheduled to release its financial report on February 10 [1] - Huahong Semiconductor will publish its earnings on February 12 [1] Group 3: Industry Growth - The global wafer foundry industry remains robust, driven by rapid growth in AI computing demand [1] - TSMC is projected to achieve a revenue of NT$1.05 trillion in Q4 2025, marking a year-on-year increase of 20.45% and setting a record for quarterly revenue [1] - TSMC's annual revenue is expected to grow by 31.60%, reaching NT$3.81 trillion [1] Group 4: Price Increases in Chip Industry - A price increase trend is spreading across the semiconductor supply chain, with domestic chip manufacturers like Guokewai, Zhongwei Semiconductor, and Yinjixin announcing price hikes of up to 80% [1] - The price increase covers key areas such as memory, MCU, and analog chips [1] - Analysts predict that the upward price trend for domestic chips will continue into the first half of 2026, with potential for more companies to follow suit [1]

Group 1 - The core viewpoint of the article is that Lanqi Technology, a leading global memory interconnect chip company, successfully listed on the Hong Kong Stock Exchange, raising approximately HKD 6.905 billion through the issuance of 65.89 million H-shares at an issue price of HKD 106.89 per share [1] - The company experienced significant demand during its public offering, with a subscription rate of 707.3 times for the Hong Kong public offering and 37.67 times for international placement, attracting around 260,600 valid applications [1] - On its first trading day, Lanqi Technology opened at HKD 168, representing a more than 57% increase from the issue price [1] Group 2 - Founded in Shanghai in 2004, Lanqi Technology became one of the first companies to list on the Sci-Tech Innovation Board in 2019, focusing on cloud computing and AI infrastructure interconnect solutions [1] - The company is projected to hold a 36.8% market share in the global memory interconnect chip market in 2024, positioning it as the leading supplier in this sector [1] - For 2025, Lanqi Technology anticipates a year-on-year increase of 52.29% in net profit attributable to shareholders, reaching approximately HKD 66.46 million, driven by the surge in demand for interconnect chips due to the AI industry boom [1]