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晶方科技(603005) - 2024 Q2 - 季度财报
2024-08-23 08:35
Financial Performance - The company's operating revenue for the first half of 2024 reached ¥535,143,429.05, an increase of 11.08% compared to ¥481,761,633.82 in the same period last year[10]. - The net profit attributable to shareholders of the listed company was ¥110,069,127.19, representing a 43.67% increase from ¥76,611,382.13 in the previous year[10]. - The net profit after deducting non-recurring gains and losses was ¥90,279,542.66, up 52.39% from ¥59,243,936.07 year-on-year[10]. - The basic earnings per share increased to ¥0.17, a rise of 41.67% compared to ¥0.12 in the same period last year[11]. - The weighted average return on net assets was 2.67%, an increase of 0.76 percentage points from 1.91% in the previous year[12]. - The total operating revenue for the first half of 2024 reached ¥393,854,946.44, an increase from ¥347,051,646.24 in the same period of 2023, representing a growth of approximately 13.5%[78]. - The net profit for the first half of 2024 was ¥114,671,139.53, compared to ¥70,230,848.16 in the first half of 2023, indicating a significant increase of about 63.4%[79]. - The total comprehensive income for the first half of 2024 was ¥112,394,706.89, compared to ¥69,515,173.68 in the first half of 2023, showing an increase of about 61.5%[79]. Cash Flow and Assets - The net cash flow from operating activities was ¥123,066,198.66, down 5.55% from ¥130,300,545.84 in the same period last year[10]. - The company reported a net cash flow from investing activities of ¥343,663,414.87, a significant improvement compared to a net outflow of ¥1,491,594,817.20 in the previous year[29]. - The total assets at the end of the reporting period were ¥4,606,502,871.85, a decrease of 4.51% from ¥4,824,122,558.00 at the end of the previous year[10]. - Total current assets decreased to ¥2,605,330,982.38 from ¥2,780,440,577.98, a decline of approximately 6.3%[69]. - Cash and cash equivalents decreased to ¥2,304,522,560.25 from ¥2,554,605,772.26, representing a decrease of about 9.8%[69]. - Accounts receivable increased to ¥140,961,738.11 from ¥93,960,044.15, an increase of approximately 49.9%[69]. - Total liabilities decreased to ¥414,653,404.97 from ¥702,589,480.10, a significant reduction of about 41.0%[71]. - The company's overseas assets amounted to ¥614,138,174.68, accounting for 13.33% of total assets[32]. Research and Development - Research and development expenses increased by 27.90% to ¥70,912,231.77 from ¥55,444,608.29 year-on-year[29]. - The company aims to enhance its advanced packaging technology capabilities, particularly in automotive applications, and expand its market share in intelligent sensors and MEMS[26]. - The company has established a competitive advantage in wafer-level chip size packaging (WLCSP) technology, focusing on miniaturization, low power consumption, and high integration[18]. - The company is implementing a semiconductor technology innovation industrial park project with a total investment of ¥410 million, covering an area of 90 acres and a construction area of approximately 120,000 square meters[34]. Market Outlook - The global semiconductor sales are projected to reach $611.2 billion in 2024, a year-on-year increase of 15.8%[17]. - The global packaging market is expected to reach $89.9 billion in 2024, with a growth rate of 9.4%[17]. - The intelligent sensor market is recovering, with the global image sensor market projected to grow to $28.8 billion by 2028, with a compound annual growth rate of 5.1% from 2022 to 2028[24]. - The advanced packaging market is expected to grow at a compound annual growth rate of 11% from 2023 to 2029, reaching $69.5 billion[17]. Strategic Initiatives - The company has outlined its future growth strategy focusing on expanding its market presence and enhancing product offerings in the semiconductor industry[13]. - The company is establishing a global production and R&D layout, including a manufacturing base in Penang, Malaysia, to better meet overseas customer demands[28]. - The company is actively pursuing mergers and acquisitions to enhance its technological capabilities and market position, including the acquisition of Anteryon and VisIC[19]. Environmental Compliance - The company strictly adheres to environmental laws and regulations, ensuring that pollutant emissions meet national and local standards, with no significant environmental incidents reported during the reporting period[44]. - The company has obtained ISO 14001 environmental management certification, demonstrating its commitment to integrating environmental protection into its operations[51]. - Measures to reduce carbon emissions include improvements in energy management processes through ISO 50001, equipment upgrades, and the use of clean energy[52]. - The company has completed an emergency response plan for environmental incidents, which has been filed with local environmental authorities, and regular emergency drills are conducted to enhance response capabilities[47]. Shareholder Information - The company has a total of 162,208 common stock shareholders as of the end of the reporting period[62]. - The largest shareholder, Suzhou Industrial Park Venture Capital Co., Ltd., holds 115,849,766 shares, representing 17.75% of the total shares[62]. - The company did not propose any profit distribution or capital reserve transfer plan for the first half of 2024[42]. Governance and Compliance - There were no significant lawsuits or arbitration matters during the reporting period[58]. - The company has not engaged in any non-operational fund occupation by controlling shareholders or related parties during the reporting period[58]. - The company has not reported any changes in the audit opinion from the previous annual report[58]. Accounting Policies - The company adheres to the accounting standards and principles set forth by the relevant authorities, ensuring accurate financial reporting[110]. - The company’s financial statements reflect its financial position, operating results, changes in equity, and cash flows accurately[110]. - The company recognizes expected credit losses for financial assets measured at amortized cost and those measured at fair value with changes recognized in other comprehensive income[146].
晶方科技:晶方科技关于公司高级管理人员辞职的公告
2024-08-13 07:35
苏州晶方半导体科技股份有限公司 关于公司高级管理人员辞职的公告 证券代码:603005 证券简称:晶方科技 公告编号:临 2024-039 特此公告。 苏州晶方半导体科技股份有限公司董事会 2024 年 8 月 14 日 本公司董事会及全体董事保证本公告内容不存在任何虚假记载、误导性陈述 或者重大遗漏,并对其内容的真实性、准确性和完整性承担个别及连带责任。 苏州晶方半导体科技股份有限公司(以下简称"公司")董事会于近日收到 副总经理刘宏钧先生提交的书面辞职报告。刘宏钧先生因个人原因申请辞去公司 副总经理的职务,辞职后刘宏钧先生将不再担任公司任何职务。 根据《公司法》、《上海证券交易所股票上市规则》、《公司章程》等的有关规 定,刘宏钧先生辞去公司副总经理职务自辞职报告送达董事会之日起生效,其辞 职不会对公司的生产经营工作产生影响。 公司及董事会对刘宏钧先生在任职期间的勤勉工作和为公司做出的贡献表 示衷心的感谢! ...
晶方科技:晶方科技关于股份回购实施结果暨股份变动的公告
2024-07-30 09:56
证券代码:603005 证券简称:晶方科技 公告编号:临 2024-038 苏州晶方半导体科技股份有限公司 关于股份回购实施结果暨股份变动的公告 本公司董事会及全体董事保证本公告内容不存在任何虚假记载、误导性陈述 或者重大遗漏,并对其内容的真实性、准确性和完整性承担个别及连带责任。 一、回购审批情况和回购方案内容 三、回购期间相关主体买卖股票情况 2024 年 2 月 29 日,公司首次披露了本次回购股份事项,具体内容详见公司 于上海证券交易所网站(www.sse.com.cn)披露的《关于以集中竞价交易方式回 购公司股份方案的公告》(公告编号:临 2024-002)。 截至本公告披露前,公司高级管理人员在此期间回购注销公司股票的情况如 下: 苏州晶方半导体科技股份有限公司(以下简称"公司")于 2024 年 2 月 28 召开了第五届董事会第十二次临时会议,审议通过了《关于以集中竞价交易方式 回购公司股份方案的议案》,同意公司以集中竞价交易方式通过自有资金回购公 司股份,回购资金总额不低于人民币 1,500 万元(含)且不超过人民币 2,500 万 元(含),回购价格不超过人民币 25.93 元/股(含), ...
晶方科技:晶方科技第五届董事会第十五次临时会议决议公告
2024-07-30 09:56
二、董事会会议审议情况 本次会议审议表决,通过了相关议案,形成决议如下: (一)会议审议通过了《关于公司完成以集中竞价交易方式回购公司股份方 案的议案》 证券代码:603005 证券简称:晶方科技 公告编号:临 2024-036 苏州晶方半导体科技股份有限公司 第五届董事会第十五次临时会议决议公告 本公司董事会及全体董事保证本公告内容不存在任何虚假记载、误导性陈述 或者重大遗漏,并对其内容的真实性、准确性和完整性承担个别及连带责任。 一、董事会会议召开情况 苏州晶方半导体科技股份有限公司(以下简称"公司")第五届董事会第十 五次临时会议于 2024 年 7 月 26 日以通讯和邮件方式发出通知,于 2024 年 7 月 30 日在公司会议室召开。会议应到董事 7 人,实际出席 7 人。会议的召集和召 开符合《公司法》和《公司章程》。 苏州晶方半导体科技股份有限公司董事会 2024 年 7 月 31 日 《晶方科技关于股份回购实施结果暨股份变动的公告》详见上海证券交易所 网站:http://www.sse.com.cn。 表决结果:同意 7 票,反对 0 票,弃权 0 票。 特此公告。 ...
晶方科技:晶方科技第五届监事会第十五次临时会议决议公告
2024-07-30 09:56
会议审议了以下议案: 一、《关于公司完成以集中竞价交易方式回购公司股份方案的议案》 表决结果:同意 3 票,反对 0 票,弃权 0 票。 特此公告。 证券代码:603005 证券简称:晶方科技 公告编号:临 2024-037 苏州晶方半导体科技股份有限公司 第五届监事会第十五次临时会议决议公告 本公司监事会及全体监事保证本公告内容不存在任何虚假记载、误导性陈述 或者重大遗漏,并对其内容的真实性、准确性和完整性承担个别及连带责任。 苏州晶方半导体科技股份有限公司(以下简称"公司")第五届监事会第十 五次临时会议于 2024 年 7 月 30 日以现场方式召开,应到监事 3 人,实到监事 3 人,会议由刘志华女士主持,符合《中华人民共和国公司法》和《公司章程》的 规定。 苏州晶方半导体科技股份有限公司监事会 2024 年 7 月 31 日 ...
晶方科技:晶方科技关于以集中竞价交易方式首次回购股份的公告
2024-07-25 07:46
2024 年 7 月 24 至 25 日,苏州晶方半导体科技股份有限公司(以下简称"公 司")通过上海证券交易所系统以集中竞价交易方式回购公司股份 50 万股, 已回购股份占公司总股本的比例为 0.08%。购买的最高价为 20.62 元/股、最 低价为 20.00 元/股,已支付的总金额为人民币 10,188,669 元(不含交易费 用)。 一、回购股份的基本情况 公司于 2024 年 2 月 28 召开了第五届董事会第十二次临时会议,审议通过了 《关于以集中竞价交易方式回购公司股份方案的议案》,并于 2024 年 3 月 28 日 披露了《关于以集中竞价交易方式回购公司股份的回购报告书》,同意公司以集 中竞价交易方式通过自有资金回购公司股份,回购资金总额不低于人民币 1,500 万元(含)且不超过人民币 2,500 万元(含),回购价格不超过人民币 25.93 元/ 股(含),回购股份将用于公司后续实施员工持股计划或股权激励计划,回购期 限为自董事会审议通过之日起 12 个月内。具体内容详见公司分别于 2024 年 2 月 29 日、2024 年 3 月 28 日在上海证券交易所网站(www.sse.com ...
晶方科技:晶方科技关于股东大宗交易减持股份计划公告
2024-07-23 08:51
证券代码:603005 证券简称:晶方科技 公告编号:临 2024-034 苏州晶方半导体科技股份有限公司 关于股东大宗交易减持股份计划公告 本公司董事会、全体董事及相关股东保证本公告内容不存在任何虚假记载、 误导性陈述或者重大遗漏,并对其内容的真实性、准确性和完整性承担法律责任。 重要内容提示: 上述减持主体无一致行动人。 1 二、减持计划的主要内容 股东名 称 计划减持 数量(股) 计划减 持比例 减持方式 减持期间 减持合理 价格区间 拟减持 股份来 源 拟减持 原因 中新创投 不超过: 13,043,400 不超过: 2% 大宗交易减持, 2024/8/15 ~ 2024/11/14 按市场价格 IPO 前 取 得 企业自身 资金需求 | 股 | | | | | --- | --- | --- | --- | | | 不 超 | 过 | : | | | 13,043,400 | | 股 | 预披露期间,若公司股票发生停牌情形的,实际开始减持的时间根据停牌时间相应顺延。 中新创投已向中国证券投资基金业协会申请了创业投资基金股东的相关减持政策,其减持比 例符合《上市公司创业投资基金股东减持股份的特别规定( ...
晶方科技:晶方科技股权激励限制性股票回购注销实施公告
2024-07-11 10:17
证券代码:603005 证券简称:晶方科技 公告编号:临 2024-033 苏州晶方半导体科技股份有限公司 股权激励限制性股票回购注销实施公告 本公司董事会及全体董事保证本公告内容不存在任何虚假记载、误导性陈述 或者重大遗漏,并对其内容的真实性、准确性和完整性承担个别及连带责任。 重要内容提示: | 回购股份数量 | 注销股份数量 | 注销日期 | | --- | --- | --- | | 443,520 | 443,520 | 2024年7月16日 | 一、本次限制性股票回购注销的决策与信息披露 苏州晶方半导体科技股份有限公司(以下简称"公司")于 2024 年 4 月 19 日召开了第五届董事会第四次会议及第五届监事会第四次会议,审议通过了《关 于回购注销已获授未解锁及 2021 年限制性股票激励计划第三个解锁期解除限售 条件未成就的限制性股票的议案》。公司于 2024 年 5 月 10 日召开了 2023 年年 度股东大会,审议通过了《关于回购注销已获授未解锁及 2021 年限制性股票激 励计划第三个解锁期解除限售条件未成就的限制性股票的议案》,同意对业绩不 达标的已获授但尚未解锁的限制性股票及离职人 ...
晶方科技:北京观韬中茂(上海)律师事务所关于晶方科技2021年限制性股票激励计划部分限制性股票回购注销实施的法律意见书
2024-07-11 10:14
北京观韬中茂(上海)律师事务所 关于苏州晶方半导体科技股份有限公司 2021 年限制性股票激励计划部分限制性股票回购注销实施 的 法律意见书 二零二四年七月 l 北京㿸韬中㤸δр海ε律师Ӂ务所 关于苏州晶方半导体科ᢶ股份ᴿ限ޢਮ 2021 年限制性股票激励计划部分限制性股票回购注䬶实施的 ޣȽ本所律师仅就ф本次回购注䬶ᴿ关的法律问题发表意㿷,而у对ޢਮ本 次激励计划所涉及的标的股票ԭ值Ƚ考Ṯ标准等方面的合理性以及会计Ƚ䍘务等 非法律专业Ӂ项发表意㿷Ⱦ 七Ƚ本法律意㿷书仅供ޢਮѰ本次回购注䬶之目的使用,у得用作任何ެ他 目的Ⱦ 法律意㿷书 㠪φ苏州晶方半导体科ᢶ股份ᴿ限ޢਮ 北京㿸韬中㤸δр海ε律师Ӂ务所接苏州晶方半导体科ᢶ股份ᴿ限ޢਮ的 委托,ṯ据Ʌޢਮ法ɆɅ证券法ɆɅ管理办法Ɇ等ᴿ关法律Ƚ法规和规㤹性文Ԭ 及Ʌޢਮ章程ɆɅ激励计划δ草案εɆ的ᴿ关规定,按照律师行业ޢ认的业务标 准Ƚ道德规㤹和勤ࣿ尽䍙精神,就ޢਮ部分限制性股票回购注䬶实施δ以с简称 ć本次回购注䬶Ĉε的相关Ӂ项出ޭ本法律意㿷书Ⱦ 第一节 律师声明Ӂ项 一Ƚ本所及经办律师依据Ʌ证券法ɆɅ律师Ӂ务所从Ӂ证券法律业务管理办 法Ɇ和Ʌ律师Ӂ务所证券法 ...
晶方科技(603005) - 2024 Q2 - 季度业绩预告
2024-07-08 09:49
Financial Performance - The company expects net profit attributable to shareholders in the first half of 2024 to be between RMB 108 million and RMB 117 million, a year-on-year increase of 40.97% to 52.72%[3][10] - Net profit attributable to shareholders after deducting non-recurring gains and losses is expected to be between RMB 87 million and RMB 97 million, a year-on-year increase of 46.85% to 63.73%[5][12] - The company's net profit attributable to shareholders in the first half of 2023 was RMB 76.61 million, and the net profit after deducting non-recurring gains and losses was RMB 59.24 million[7] Business Growth and Market Trends - The company's packaging business in the automotive CIS field has grown rapidly due to the increasing penetration of automotive intelligence, and its leading advantage continues to improve[7] - The packaging business in the consumer electronics sector has resumed growth as inventory levels in the smartphone market gradually return to normal and demand shows signs of recovery[15] Technological Development and Innovation - The company is continuously developing advanced packaging technologies and processes to meet customer needs and has begun commercial applications in new areas such as MEMS and RF filters[7] - The company is expanding the market application of micro-optical devices and WLO technology and steadily promoting the development of new application fields such as highly integrated headlights[15]