Core Viewpoint - The semiconductor industry in China is experiencing significant growth, with many companies reporting substantial increases in their H1 2025 performance and a surge in IPO applications across various stock markets [2][3][6]. Group 1: Company Performance - Several semiconductor companies have reported impressive H1 2025 earnings forecasts, including: - Rockchip expects revenue of approximately 204.5 million yuan, a year-on-year increase of about 64%, and a net profit of 52 million to 54 million yuan, representing a growth of 185% to 195% [3]. - Chipone anticipates H1 revenue of around 63 million yuan, up about 38%, with a net profit of approximately 9 million yuan, reflecting a 104% increase [3]. - Allwinner Technology forecasts a net profit of 156 million to 171 million yuan, a growth of 31.02% to 43.62% [4]. - Dinglong Co. expects revenue of about 1.727 billion yuan, a 14% increase, with a net profit of 290 million to 320 million yuan, marking a growth of 33.12% to 46.9% [4]. - Jingfang Technology anticipates a net profit of 150 million to 175 million yuan, a year-on-year increase of 36.28% to 58.99% [4]. - Haoshanghao expects a net profit of 28 million to 35 million yuan, a growth of 42.49% to 78.11% [4]. - Hanjin Technology forecasts a net profit of 13 million to 18 million yuan, a decline of 45.42% to 60.58% [4]. - Demingli expects revenue of 3.8 billion to 4.2 billion yuan, a growth of 74.63% to 93.01%, but anticipates a net loss of 80 million to 120 million yuan [5]. Group 2: IPO Activity - The capital market is witnessing a surge in IPO applications from semiconductor companies, with 21 firms submitting applications to A-shares in H1 2025, aiming to raise a total of 46.5 billion yuan [6][9]. - The Sci-Tech Innovation Board is the most favored listing platform, accounting for over 50% of the applications, reflecting its alignment with the semiconductor industry's focus on "hard technology" [6]. - Notable companies among the applicants include: - Moer Thread, seeking to raise 8 billion yuan, focusing on GPU and related products [8]. - Shanghai Super Silicon, aiming for 4.965 billion yuan, specializing in semiconductor wafers [8]. - Zhaoxin Integrated Circuit, targeting 4.169 billion yuan, focusing on high-end general-purpose processors [8]. - The ChiNext Board attracted four companies, planning to raise approximately 5.84 billion yuan, while the Beijing Stock Exchange received five applications from smaller semiconductor firms [9].

Group 1 - The company expects a net profit attributable to shareholders for the first half of 2025 to be between 150 million and 175 million yuan, representing a year-on-year growth of 36.28% to 58.99% [1][2] - The net profit, excluding non-recurring gains and losses, is estimated to be approximately 135 million to 155 million yuan, with a year-on-year increase of 49.54% to 71.69% [1][2] - The previous year's net profit attributable to shareholders for the first half of 2024 was 110.07 million yuan, with a net profit of 90.28 million yuan after excluding non-recurring gains and losses [1] Group 2 - The significant increase in profit is primarily driven by the rapid development of automotive intelligence, leading to a notable growth in demand for automotive-grade CIS chips, where the company has a leading position in packaging business and technology [1] - The company continues to innovate and develop advanced packaging technologies to meet the technical needs of new business and products from customers, while also optimizing production processes and management models to enhance operational efficiency [1]

[Current Period Performance Forecast](index=1&type=section&id=Item%20I.%20Current%20Period%20Performance%20Forecast) The company forecasts H1 2025 net profit attributable to shareholders to be RMB 150-175 million, with non-recurring net profit at RMB 135-155 million, reflecting significant year-on-year growth Performance Forecast Summary | Indicator | Estimated Amount (RMB Million) | Year-on-Year Growth Rate | | :--- | :--- | :--- | | **Net Profit Attributable to Shareholders** | 150 to 175 | 36.28% to 58.99% | | **Net Profit Excluding Non-Recurring Items** | 135 to 155 | 49.54% to 71.69% | - The performance forecast period is from January 1, 2025, to June 30, 2025[3](index=3&type=chunk) - This performance forecast has not been audited by a certified public accountant[3](index=3&type=chunk) [Prior Period Performance Overview](index=2&type=section&id=Item%20II.%20Prior%20Period%20Performance%20Overview) The company's H1 2024 performance, including RMB 110 million net profit attributable to shareholders and RMB 0.17 basic EPS, serves as the comparative base for the current forecast H1 2024 Performance | Indicator | H1 2024 Amount | | :--- | :--- | | **Net Profit Attributable to Shareholders** | RMB 110.07 Million | | **Net Profit Excluding Non-Recurring Items** | RMB 90.28 Million | | **Earnings Per Share** | RMB 0.17 | [Primary Reasons for Current Period Performance Increase](index=2&type=section&id=Item%20III.%20Primary%20Reasons%20for%20Current%20Period%20Performance%20Increase) The anticipated performance growth is primarily driven by increased demand for automotive-grade CIS chips due to automotive intelligence and the company's continuous operational efficiency improvements - The core driver is the significant growth in market demand for automotive-grade CIS chips, propelled by automotive intelligence development, leading to continuous enhancement of the company's related packaging business scale and technological advantages[6](index=6&type=chunk) - Internal optimization includes the company's continuous innovation in advanced packaging technology and optimization of production processes and management models, enhancing overall operational efficiency[6](index=6&type=chunk) [Risk Warning](index=2&type=section&id=Item%20IV.%20Risk%20Warning) The company confirms the absence of significant uncertainties that could impact the accuracy of the current performance forecast - The company states there are no significant uncertainties that could affect the accuracy of this performance forecast[7](index=7&type=chunk) [Other Explanatory Matters](index=2&type=section&id=Item%20V.%20Other%20Explanatory%20Matters) Investors are reminded that the forecast data is preliminary, and final accurate financial figures will be based on the officially disclosed 2025 semi-annual report - The data in this announcement is preliminary, and the final data will be subject to the company's officially disclosed 2025 semi-annual report[8](index=8&type=chunk)

Core Viewpoint - The company, Jingfang Technology, expects to achieve a net profit attributable to shareholders of 150 million to 175 million yuan for the first half of 2025, representing a year-on-year growth of 36.28% to 58.99% [1] - After excluding non-recurring gains and losses, the company anticipates a net profit of approximately 135 million to 155 million yuan for the same period, indicating a year-on-year increase of 49.54% to 71.69% [1] Financial Projections - Expected net profit for H1 2025: 150 million to 175 million yuan [1] - Year-on-year growth for net profit: 36.28% to 58.99% [1] - Expected net profit after non-recurring items: 135 million to 155 million yuan [1] - Year-on-year growth after non-recurring items: 49.54% to 71.69% [1]

Core Viewpoint - The company expects to achieve a net profit attributable to shareholders of 150 million to 175 million yuan for the first half of 2025, representing a year-on-year growth of 36.28% to 58.99% [1] - After excluding non-recurring gains and losses, the expected net profit is approximately 135 million to 155 million yuan, with a year-on-year increase of 49.54% to 71.69% [1] Company Performance - The company is experiencing significant growth in the automotive intelligent sector, particularly in the automotive CIS chip market [1] - The scale and technological advantages of the company's packaging business in the automotive CIS field are continuously improving [1]

Group 1 - The core index of the CSI 1000 Information Technology Index is reported at 9130.36 points, with a one-month increase of 6.25%, a three-month increase of 11.71%, and a year-to-date increase of 7.69% [1] - The CSI 1000 Index series selects liquid and representative securities from each industry, forming 10 industry indices to provide diversified investment targets [1] - The top ten holdings of the CSI 1000 Information Technology Index include: O-film (2.69%), Huahong Semiconductor (1.54%), Heertai (1.42%), Siwei Tuxin (1.39%), Sifang Jichuang (1.33%), Jingfang Technology (1.27%), Chipone (1.25%), Weining Health (1.24%), Anji Technology (1.24%), and Tuobang Co. (1.2%) [1] Group 2 - The market share of the CSI 1000 Information Technology Index holdings is 57.12% from the Shenzhen Stock Exchange and 42.88% from the Shanghai Stock Exchange [1] - The industry composition of the index holdings includes: Software Development (24.50%), Integrated Circuits (19.58%), Optical Electronics (14.73%), IT Services (12.38%), Semiconductor Materials and Equipment (9.51%), Electronic Components (7.54%), Electronic Terminals and Components (7.10%), Other Electronics (2.08%), Electronic Chemicals (1.84%), and Discrete Devices (0.73%) [2] - The index sample is adjusted every six months, with adjustments implemented on the next trading day after the second Friday of June and December, and temporary adjustments may occur under special circumstances [2]

Industry Overview - The CMOS image sensor (CIS) is a crucial component that converts photons into electrons for digital processing, primarily used in digital cameras and surveillance systems [3][11] - The global CMOS image sensor market is projected to grow from $21.79 billion in 2023 to $28.6 billion by 2029, with a compound annual growth rate (CAGR) of 4.29% from 2017 to 2023 [13][19] - In China, the CMOS image sensor market is expected to reach approximately 52.68 billion yuan in 2024, driven by trends in multi-camera smartphones, smart electric vehicles, and increased demand for security monitoring [1][17] Market Dynamics - The global CMOS image sensor shipment volume increased from 5.254 billion units in 2017 to 6.76 billion units in 2023, with an estimated 7.206 billion units in 2024 [13][15] - The smartphone sector is the largest application area for CMOS image sensors, accounting for over 60% of the market share [11][15] - The Chinese smartphone market is projected to recover in 2024, with an estimated shipment volume of 286 million units, reflecting a year-on-year growth of 5.6% [11][19] Technological Advancements - The three major upgrade directions for CMOS image sensors are high pixel count, high frame rate, and improved imaging quality [5][25] - Key performance indicators for evaluating CMOS image sensor quality include optical size, pixel size, pixel count, frame rate, signal-to-noise ratio, and dynamic range [5][25] - The industry is moving towards high-resolution sensors to meet the demands of 4K/8K video and AI image analysis applications [25][27] Competitive Landscape - The global CMOS image sensor market is dominated by major players such as Sony, Samsung Electronics, and Hynix, with Sony being the market leader [19][21] - Domestic companies like Rockchip, SmartSens, and OmniVision are emerging as significant players in the Chinese market, benefiting from increased R&D investment and industry collaboration [19][21] Key Companies - Rockchip Electronics Co., Ltd. focuses on the design and development of smart application processors and is expected to achieve a revenue of 3.136 billion yuan in 2024, representing a growth of 46.95% [21] - SmartSens Technology Co., Ltd. specializes in high-performance CMOS image sensors and anticipates a revenue of 5.968 billion yuan in 2024, reflecting a growth of 108.89% [23]

Core Viewpoint - The advanced packaging market is expected to grow significantly, driven by trends in generative AI, high-performance computing (HPC), and the recovery of mobile and consumer markets, with a projected increase from $37.8 billion in 2023 to $69.5 billion by 2029, representing a compound annual growth rate (CAGR) of 12.9% [2][44]. Group 1: Overview of Advanced Packaging - Advanced packaging differs from traditional packaging in terms of equipment, materials, and technology, offering advantages such as miniaturization, lightweight, high density, low power consumption, and functional integration [6]. - The advanced packaging market in China has seen rapid growth, increasing from 42 billion yuan in 2019 to 79 billion yuan in 2023, with a projected market size of 134 billion yuan by 2029, reflecting a CAGR of 9% from 2024 to 2029 [8][10]. Group 2: Application Areas of Advanced Packaging - System-in-Package (SiP) is a key growth driver in the advanced packaging market, with the consumer electronics sector being the largest downstream application, accounting for 70% of SiP applications [14]. - High-Density Flip Chip (FC) packaging has significant growth potential in mobile and consumer markets, with the FC-CSP segment expected to exceed $10 billion by 2026 [17]. - The QFN/DFN packaging market is projected to grow from $13.65 billion in 2023 to $30.68 billion by 2032, with a CAGR of approximately 9.42% [22][24]. - MEMS packaging is also gaining attention, with a market size of around $2.7 billion in 2022 and a CAGR of 16.7% from 2016 to 2022 [25]. Group 3: Representative Technologies in Advanced Packaging - Wafer Level Chip Scale Packaging (WLCSP) is characterized by its ability to provide higher bandwidth, speed, and reliability, with a market size expected to grow from $18.45 billion in 2023 to $43.5 billion by 2032, reflecting a CAGR of around 10% [27][29]. - WLCSP is widely applied in various fields, including consumer electronics, automotive, telecommunications, and healthcare, driven by the rise of IoT devices and smart technologies [37]. Group 4: Market Space and Forecast - The advanced packaging market is projected to reach $80 billion by 2029, with a CAGR of 12.7%, driven by AI and HPC applications [68]. - Advanced packaging shipment volume is expected to increase from 70.9 billion units in 2023 to 97.6 billion units by 2029, with a CAGR of 5.5% [70]. - The total advanced packaging wafer output is anticipated to grow at a CAGR of 11.6% from 2023 to 2029, with 2.5D/3D packaging expected to see the highest growth rate of 32.1% [73]. Group 5: Related Companies in Advanced Packaging - Key players in the advanced packaging sector include companies like JCET, which focuses on sensor packaging and has established a leading position in the WLCSP market [50]. - Other notable companies include Taiwan Semiconductor Manufacturing Company (TSMC), which has developed advanced packaging technologies across various applications, and Huatian Technology, which specializes in advanced packaging solutions for automotive and consumer electronics [50].

地址：上海市长宁区仙霞路 99 号尚嘉中心 22 层、12 层 （200051） Add: 22F&12F, L'Avenue No.99 XianXia Rd, Changning District, Shanghai, PRC 电话 Tel: +86 21 23563298 传真Fax: +86 21 23563299 网址 Website：http://www.guantao.com 邮箱 Email: guantaosh@guantao.com 北京观韬（上海）律师事务所 关于苏州晶方半导体科技股份有限公司 差异化权益分派事项之 法律意见书 苏州晶方半导体科技股份有限公司： 根据《中华人民共和国公司法》（以下简称"《公司法》"）、《中华人民 共和国证券法》（以下简称"《证券法》"）、《上市公司股份回购规则》（以 下简称"《回购规则》"）、《上海证券交易所上市公司自律监管指引第 7 号 ——回购股份》（以下简称"《回购指引》"） 、《上海证券交易所上市公司 自律监管指南第 2 号——业务办理（2025 年 4 月修订）》（以下简称"《自律 监管指南 2 号》"）等有关法律、法规、规范性文件以及《苏州晶方 ...

证券代码：603005 证券简称：晶方科技 公告编号：临 2025-017 苏州晶方半导体科技股份有限公司 2024年年度权益分派实施公告 本公司董事会及全体董事保证本公告内容不存在任何虚假记载、误导性陈述或者重大遗 漏，并对其内容的真实性、准确性和完整性承担法律责任。 重要内容提示： 每股分配比例 A 股每股现金红利0.084元（含税） 相关日期 | 股份类别 | 股权登记日 | 最后交易日 | 除权（息）日 | 现金红利发放日 | | --- | --- | --- | --- | --- | | Ａ股 | 2025/7/3 | － | 2025/7/4 | 2025/7/4 | 差异化分红送转： 是 一、 通过分配方案的股东大会届次和日期 本次利润分配方案经苏州晶方半导体科技股份有限公司（以下简称"公司"）2025 年 5 月 16 日的2024年年度股东大会审议通过。 二、 分配方案 1. 发放年度：2024年年度 2. 分派对象： 截至股权登记日下午上海证券交易所收市后，在中国证券登记结算有限责任公司上海分 公司（以下简称"中国结算上海分公司"）登记在册的本公司全体股东。 根据《上市公司股份回购规则 ...