证券代码：603005 证券简称：晶方科技 公告编号：临 2025-032 苏州晶方半导体科技股份有限公司 第六届董事会第一次会议决议公告 本公司董事会及全体董事保证本公告内容不存在任何虚假记载、误导性陈述 或者重大遗漏，并对其内容的真实性、准确性和完整性承担个别及连带责任。 一、董事会会议召开情况 苏州晶方半导体科技股份有限公司（以下简称"公司"）第六届董事会第一 次会议于 2025 年 12 月 16 日以通讯和邮件方式发出通知，于 2025 年 12 月 26 日在公司会议室召开。会议应到董事 7 人，实际出席 7 人。会议的召集和召开符 合《公司法》和《公司章程》。 表决结果：同意 6 票，反对 0 票，弃权 0 票。关联董事王蔚先生回避表决， 本议案已经公司董事会审计委员会及公司独立董事专门会议审议通过。《关于 2026 年 日 常 关 联 交 易 预 计 情 况 的 公 告 》 详 见 上 海 证 券 交 易 所 网 站 ： www.sse.com.cn。 （三）会议审议通过了《关于公司以闲置自有资金购买理财产品的议案》 表决结果：同意 7 票，反对 0 票，弃权 0 票。本议案尚需提交股东会审议 ...

每经AI快讯，12月26日，晶方科技(603005.SH)公告称，近年来，全球政治格局形势剧变，集成电路产 业链正在发生重构整合。为有效应对产业重构趋势，公司积极推进国际化发展战略，进行市场、供应 链、生产制造能力的全球布局。公司拟与关联方王蔚共同投资设立WaferWise Semiconductor Sdn. Bhd.， 投资规模为1.5亿元林吉特。WaferWise的股权架构包括马来西亚产业、政府背景投资人合计持股50%、 WaferWise核心团队8%、晶方科技持股19.9%、公司董事长兼总经理王蔚持股22.1%，各方均以现金出 资。WaferWise经营范围包括集成电路产品制造与加工等。 ...

晶方科技公告称，为应对产业重构，公司推进国际化战略。2023年5月在新加坡设海外总部平台，2024 年6月在马来西亚成立WaferTek。截至目前，WaferTek土地厂房购买完成，进入施工阶段。现拟将参股 设立的WaferWise规划投资额优化调整为1.5亿林吉特，股权架构为马来西亚产业、政府背景投资人合计 持股50%、WaferWise核心团队8%、晶方科技持股19.9%、公司董事长兼总经理王蔚持股22.1%。该事项 构成关联交易，不构成重大资产重组。 ...

Group 1 - The "Suhua Chip Bay" conference highlighted the rapid growth of the smart software industry in Putuo, with software information service revenue exceeding 110 billion yuan, a year-on-year increase of 141.2%, ranking first among Shanghai's central districts [1] - Leading companies in Putuo's smart software sector are driving innovation in digital life, cybersecurity, integrated circuit R&D, online gaming, and the metaverse, creating a robust industrial chain [2] - The collaboration model involving industry departments, leading enterprises, and state-owned companies is fostering innovation and enterprise clustering in the digital life sector [2] Group 2 - The "Suhua Chip Bay" integrated circuit industrial cluster and "Cybersecurity Smart Valley" incubator are key platforms for innovation and entrepreneurship in Putuo [3] - The establishment of the East China Normal University Integrated Circuit Industry College and the focus on high-performance, customizable integrated circuit IP cores are enhancing the region's technological capabilities [3] - Putuo's supportive policies for hosting influential events and providing financial assistance are attracting companies like KX Technology, which is building a comprehensive cybersecurity business system [4] Group 3 - Putuo is optimizing industrial policies and enhancing service platforms, with 51 smart software-related companies receiving nearly 40 million yuan in funding support in 2025 [5] - The collaboration between Putuo and Nantong aims to break down regional barriers and promote deep integration of production, education, research, and application in the semiconductor industry [5]

Core Insights - The global automotive CMOS image sensor (CIS) market is projected to grow from $1.377 billion in 2020 to $2.499 billion in 2024, with a compound annual growth rate (CAGR) of 16.1% [7] - The Chinese automotive CIS market is expected to reach approximately 7.83 billion yuan in 2024, reflecting a year-on-year growth of 19.7% [7] - The automotive CIS industry is characterized by high technical barriers and market concentration, with the top three companies holding over 80% of the global market share in 2024 [7] Automotive CIS Industry Overview - CMOS image sensors (CIS) are semiconductor devices that convert optical images into digital signals, widely used in consumer electronics, security monitoring, and intelligent driving [2][4] - In automotive applications, CIS is a core component of camera modules, crucial for light perception and image quality [2][4] - The cost structure of automotive camera modules shows that CIS, packaging, and optical lenses account for nearly 75% of total costs, with CIS alone representing 40% [6][7] Market Dynamics - The demand for automotive cameras is increasing exponentially due to the trend of automotive intelligence, with CIS benefiting directly from this growth [7] - The number of cameras per vehicle is rising, alongside demands for higher resolution and enhanced low-light performance, which increases the average value of individual camera modules [7] Competitive Landscape - The automotive CIS market is dominated by a few key players, with OmniVision leading at a 32.9% market share, followed by ON Semiconductor and Sony [7] - Chinese companies like SmartSens and Geke Micro are also gaining market share, reflecting the increasing competitiveness of domestic firms [7] Future Trends - The automotive CIS industry is expected to continue benefiting from the trend of automotive intelligence, with leading companies likely to strengthen their positions through technological advancements and brand advantages [8] - Future developments in automotive CIS will focus on higher resolutions (over 8 million pixels), functional safety (ASIL-B/D), and multi-spectral integration (visible light + infrared) to meet diverse needs [8]

Group 1 - The core viewpoint of the news is that Jingfang Technology has shown significant financial performance with a notable increase in revenue and net profit, while also experiencing fluctuations in stock trading and financing activities [1][2]. Group 2 - As of November 20, Jingfang Technology's stock price decreased by 0.70%, with a trading volume of 349 million yuan. The financing buy-in amount was 28.37 million yuan, while the financing repayment was 44.06 million yuan, resulting in a net financing outflow of 15.69 million yuan [1]. - The total financing and securities balance for Jingfang Technology reached 1.287 billion yuan, with the financing balance accounting for 7.33% of the circulating market value, indicating a high level compared to the past year [1]. - The company repaid 7,100 shares in securities lending on November 20, with a remaining securities lending balance of 263,420 yuan, which is below the 30th percentile level over the past year [1]. - For the period from January to September 2025, Jingfang Technology achieved an operating income of 1.066 billion yuan, representing a year-on-year growth of 28.48%, and a net profit attributable to shareholders of 274 million yuan, reflecting a 48.40% increase [2]. - The company has distributed a total of 496 million yuan in dividends since its A-share listing, with 130 million yuan distributed over the past three years [2]. Group 3 - As of September 30, 2025, the number of shareholders for Jingfang Technology reached 147,700, an increase of 7.82% from the previous period, while the average circulating shares per person decreased by 7.26% to 4,416 shares [2]. - Among the top ten circulating shareholders, Dongwu Mobile Internet Mixed A ranked as the second-largest shareholder with 9.6 million shares, a decrease of 4.8575 million shares from the previous period [3]. - Hong Kong Central Clearing Limited became the third-largest shareholder with 8.9788 million shares, an increase of 489,320 shares, while several ETFs entered the top ten circulating shareholders list [3].

Core Viewpoint - The stock of Jingfang Technology has experienced a decline, with a notable drop in both share price and trading volume, indicating potential concerns among investors regarding the company's performance and market position [1][2]. Financial Performance - For the period from January to September 2025, Jingfang Technology reported a revenue of 1.066 billion yuan, representing a year-on-year growth of 28.48% [2]. - The net profit attributable to shareholders for the same period was 274 million yuan, showing a significant increase of 48.40% compared to the previous year [2]. - Cumulatively, the company has distributed 496 million yuan in dividends since its A-share listing, with 130 million yuan distributed over the last three years [2]. Stock Market Activity - As of November 14, the stock price of Jingfang Technology was 27.73 yuan per share, with a market capitalization of 18.085 billion yuan [1]. - The stock has seen a year-to-date decline of 1.55%, with a 3.61% drop over the last five trading days and a 7.81% decline over the past 60 days [1]. - The net outflow of main funds was 24.0633 million yuan, with significant selling pressure observed [1]. Shareholder Structure - As of September 30, 2025, the number of shareholders increased to 147,700, up by 7.82% from the previous period [2][3]. - The second-largest shareholder, Dongwu Mobile Internet Mixed A, reduced its holdings by 4.8575 million shares, while Hong Kong Central Clearing Limited increased its holdings by 489,320 shares [3]. - New entrants among the top ten shareholders include Guolian An Semiconductor ETF and GF Zhongzheng 1000 ETF [3].

Core Viewpoint - Jingfang Technology's stock has experienced a decline, with a current price of 28.16 yuan per share and a market capitalization of 18.365 billion yuan, reflecting a challenging trading environment [1] Financial Performance - For the period from January to September 2025, Jingfang Technology reported a revenue of 1.066 billion yuan, representing a year-on-year growth of 28.48%, and a net profit attributable to shareholders of 274 million yuan, which is a 48.40% increase compared to the previous year [2] - The company has distributed a total of 496 million yuan in dividends since its A-share listing, with 130 million yuan distributed over the last three years [2] Shareholder Structure - As of September 30, 2025, the number of shareholders for Jingfang Technology increased by 7.82% to 147,700, while the average number of circulating shares per person decreased by 7.26% to 4,416 shares [2] - The top ten circulating shareholders include notable entities such as Dongwu Mobile Internet Mixed A and Hong Kong Central Clearing Limited, with changes in their holdings indicating shifts in institutional interest [3]

Core Viewpoint - The establishment of the Suzhou University-Jingfang Semiconductor Technology Research Institute aims to deepen the integration of industry and academia, promoting innovation in Suzhou's industrial landscape [1] Group 1: Collaboration and Innovation - Suzhou University and Jingfang Semiconductor Technology Co., Ltd. have jointly established a research institute focused on micro-nano packaging and intelligent systems [1] - The collaboration is expected to enhance personnel exchange, technology sharing, and the integration of innovation, industry, and talent chains [1] Group 2: Strategic Goals - The research institute will align with the strategic needs of the "14th Five-Year Plan" and address key industrial issues, aiming for significant outcomes that drive industrial development [1] - The initiative encourages exploration of innovative mechanisms to stimulate collaborative efforts and rapid transformation of research results into practical applications [1] Group 3: Supporting Infrastructure - The opening of the Juxin Industrial Park, operated by Jingfang Technology in collaboration with the Suzhou Automotive Semiconductor Industry Technology Research Institute, complements the establishment of the research institute [1]

Investment Rating - The report rates the advanced packaging industry as "stronger than the market" [1] Core Viewpoints - The advanced packaging technology is positioned as a key path to overcome the limitations of Moore's Law, driven by the exponential growth in computing power required for AI and large model training [2][14] - The global advanced packaging market is projected to exceed $79 billion by 2030, highlighting its role as a core growth engine in the semiconductor industry [2][23] - The demand for advanced packaging is surging due to the increasing need for high-performance AI chips, with TSMC's CoWoS technology becoming a critical support process for high-performance AI chips [2][17] Summary by Sections Chapter 1: Growing Demand for Intelligent Computing - The demand for intelligent computing is rapidly increasing, with significant growth in enterprise-level markets [5][9] - China's intelligent computing scale is expected to reach 725.3 EFLOPS in 2024, a year-on-year increase of 74.1% [9][10] Chapter 2: Diverse Packaging Paths - Advanced packaging technologies are evolving rapidly, with a focus on 2.5D/3D packaging solutions that are gaining popularity [2][18] - The global advanced packaging market is expected to grow from $46.1 billion in 2024 to $79.1 billion by 2030, with a compound annual growth rate (CAGR) of 21.71% for 2.5D/3D packaging [23][24] Chapter 3: Investment Recommendations - The report suggests focusing on key players in the advanced packaging sector, such as Changdian Technology, Tongfu Microelectronics, and JCET [2][24]