Core Viewpoint - The company, Jingfang Technology, expects to achieve a net profit attributable to shareholders of 150 million to 175 million yuan for the first half of 2025, representing a year-on-year growth of 36.28% to 58.99% [1] - After excluding non-recurring gains and losses, the company anticipates a net profit of approximately 135 million to 155 million yuan for the same period, indicating a year-on-year increase of 49.54% to 71.69% [1] Financial Projections - Expected net profit for H1 2025: 150 million to 175 million yuan [1] - Year-on-year growth for net profit: 36.28% to 58.99% [1] - Expected net profit after non-recurring items: 135 million to 155 million yuan [1] - Year-on-year growth after non-recurring items: 49.54% to 71.69% [1]

Core Viewpoint - The company expects to achieve a net profit attributable to shareholders of 150 million to 175 million yuan for the first half of 2025, representing a year-on-year growth of 36.28% to 58.99% [1] - After excluding non-recurring gains and losses, the expected net profit is approximately 135 million to 155 million yuan, with a year-on-year increase of 49.54% to 71.69% [1] Company Performance - The company is experiencing significant growth in the automotive intelligent sector, particularly in the automotive CIS chip market [1] - The scale and technological advantages of the company's packaging business in the automotive CIS field are continuously improving [1]

Group 1 - The core index of the CSI 1000 Information Technology Index is reported at 9130.36 points, with a one-month increase of 6.25%, a three-month increase of 11.71%, and a year-to-date increase of 7.69% [1] - The CSI 1000 Index series selects liquid and representative securities from each industry, forming 10 industry indices to provide diversified investment targets [1] - The top ten holdings of the CSI 1000 Information Technology Index include: O-film (2.69%), Huahong Semiconductor (1.54%), Heertai (1.42%), Siwei Tuxin (1.39%), Sifang Jichuang (1.33%), Jingfang Technology (1.27%), Chipone (1.25%), Weining Health (1.24%), Anji Technology (1.24%), and Tuobang Co. (1.2%) [1] Group 2 - The market share of the CSI 1000 Information Technology Index holdings is 57.12% from the Shenzhen Stock Exchange and 42.88% from the Shanghai Stock Exchange [1] - The industry composition of the index holdings includes: Software Development (24.50%), Integrated Circuits (19.58%), Optical Electronics (14.73%), IT Services (12.38%), Semiconductor Materials and Equipment (9.51%), Electronic Components (7.54%), Electronic Terminals and Components (7.10%), Other Electronics (2.08%), Electronic Chemicals (1.84%), and Discrete Devices (0.73%) [2] - The index sample is adjusted every six months, with adjustments implemented on the next trading day after the second Friday of June and December, and temporary adjustments may occur under special circumstances [2]

Industry Overview - The CMOS image sensor (CIS) is a crucial component that converts photons into electrons for digital processing, primarily used in digital cameras and surveillance systems [3][11] - The global CMOS image sensor market is projected to grow from $21.79 billion in 2023 to $28.6 billion by 2029, with a compound annual growth rate (CAGR) of 4.29% from 2017 to 2023 [13][19] - In China, the CMOS image sensor market is expected to reach approximately 52.68 billion yuan in 2024, driven by trends in multi-camera smartphones, smart electric vehicles, and increased demand for security monitoring [1][17] Market Dynamics - The global CMOS image sensor shipment volume increased from 5.254 billion units in 2017 to 6.76 billion units in 2023, with an estimated 7.206 billion units in 2024 [13][15] - The smartphone sector is the largest application area for CMOS image sensors, accounting for over 60% of the market share [11][15] - The Chinese smartphone market is projected to recover in 2024, with an estimated shipment volume of 286 million units, reflecting a year-on-year growth of 5.6% [11][19] Technological Advancements - The three major upgrade directions for CMOS image sensors are high pixel count, high frame rate, and improved imaging quality [5][25] - Key performance indicators for evaluating CMOS image sensor quality include optical size, pixel size, pixel count, frame rate, signal-to-noise ratio, and dynamic range [5][25] - The industry is moving towards high-resolution sensors to meet the demands of 4K/8K video and AI image analysis applications [25][27] Competitive Landscape - The global CMOS image sensor market is dominated by major players such as Sony, Samsung Electronics, and Hynix, with Sony being the market leader [19][21] - Domestic companies like Rockchip, SmartSens, and OmniVision are emerging as significant players in the Chinese market, benefiting from increased R&D investment and industry collaboration [19][21] Key Companies - Rockchip Electronics Co., Ltd. focuses on the design and development of smart application processors and is expected to achieve a revenue of 3.136 billion yuan in 2024, representing a growth of 46.95% [21] - SmartSens Technology Co., Ltd. specializes in high-performance CMOS image sensors and anticipates a revenue of 5.968 billion yuan in 2024, reflecting a growth of 108.89% [23]

Core Viewpoint - The advanced packaging market is expected to grow significantly, driven by trends in generative AI, high-performance computing (HPC), and the recovery of mobile and consumer markets, with a projected increase from $37.8 billion in 2023 to $69.5 billion by 2029, representing a compound annual growth rate (CAGR) of 12.9% [2][44]. Group 1: Overview of Advanced Packaging - Advanced packaging differs from traditional packaging in terms of equipment, materials, and technology, offering advantages such as miniaturization, lightweight, high density, low power consumption, and functional integration [6]. - The advanced packaging market in China has seen rapid growth, increasing from 42 billion yuan in 2019 to 79 billion yuan in 2023, with a projected market size of 134 billion yuan by 2029, reflecting a CAGR of 9% from 2024 to 2029 [8][10]. Group 2: Application Areas of Advanced Packaging - System-in-Package (SiP) is a key growth driver in the advanced packaging market, with the consumer electronics sector being the largest downstream application, accounting for 70% of SiP applications [14]. - High-Density Flip Chip (FC) packaging has significant growth potential in mobile and consumer markets, with the FC-CSP segment expected to exceed $10 billion by 2026 [17]. - The QFN/DFN packaging market is projected to grow from $13.65 billion in 2023 to $30.68 billion by 2032, with a CAGR of approximately 9.42% [22][24]. - MEMS packaging is also gaining attention, with a market size of around $2.7 billion in 2022 and a CAGR of 16.7% from 2016 to 2022 [25]. Group 3: Representative Technologies in Advanced Packaging - Wafer Level Chip Scale Packaging (WLCSP) is characterized by its ability to provide higher bandwidth, speed, and reliability, with a market size expected to grow from $18.45 billion in 2023 to $43.5 billion by 2032, reflecting a CAGR of around 10% [27][29]. - WLCSP is widely applied in various fields, including consumer electronics, automotive, telecommunications, and healthcare, driven by the rise of IoT devices and smart technologies [37]. Group 4: Market Space and Forecast - The advanced packaging market is projected to reach $80 billion by 2029, with a CAGR of 12.7%, driven by AI and HPC applications [68]. - Advanced packaging shipment volume is expected to increase from 70.9 billion units in 2023 to 97.6 billion units by 2029, with a CAGR of 5.5% [70]. - The total advanced packaging wafer output is anticipated to grow at a CAGR of 11.6% from 2023 to 2029, with 2.5D/3D packaging expected to see the highest growth rate of 32.1% [73]. Group 5: Related Companies in Advanced Packaging - Key players in the advanced packaging sector include companies like JCET, which focuses on sensor packaging and has established a leading position in the WLCSP market [50]. - Other notable companies include Taiwan Semiconductor Manufacturing Company (TSMC), which has developed advanced packaging technologies across various applications, and Huatian Technology, which specializes in advanced packaging solutions for automotive and consumer electronics [50].

地址：上海市长宁区仙霞路 99 号尚嘉中心 22 层、12 层 （200051） Add: 22F&12F, L'Avenue No.99 XianXia Rd, Changning District, Shanghai, PRC 电话 Tel: +86 21 23563298 传真Fax: +86 21 23563299 网址 Website：http://www.guantao.com 邮箱 Email: guantaosh@guantao.com 北京观韬（上海）律师事务所 关于苏州晶方半导体科技股份有限公司 差异化权益分派事项之 法律意见书 苏州晶方半导体科技股份有限公司： 根据《中华人民共和国公司法》（以下简称"《公司法》"）、《中华人民 共和国证券法》（以下简称"《证券法》"）、《上市公司股份回购规则》（以 下简称"《回购规则》"）、《上海证券交易所上市公司自律监管指引第 7 号 ——回购股份》（以下简称"《回购指引》"） 、《上海证券交易所上市公司 自律监管指南第 2 号——业务办理（2025 年 4 月修订）》（以下简称"《自律 监管指南 2 号》"）等有关法律、法规、规范性文件以及《苏州晶方 ...

证券代码：603005 证券简称：晶方科技 公告编号：临 2025-017 苏州晶方半导体科技股份有限公司 2024年年度权益分派实施公告 本公司董事会及全体董事保证本公告内容不存在任何虚假记载、误导性陈述或者重大遗 漏，并对其内容的真实性、准确性和完整性承担法律责任。 重要内容提示： 每股分配比例 A 股每股现金红利0.084元（含税） 相关日期 | 股份类别 | 股权登记日 | 最后交易日 | 除权（息）日 | 现金红利发放日 | | --- | --- | --- | --- | --- | | Ａ股 | 2025/7/3 | － | 2025/7/4 | 2025/7/4 | 差异化分红送转： 是 一、 通过分配方案的股东大会届次和日期 本次利润分配方案经苏州晶方半导体科技股份有限公司（以下简称"公司"）2025 年 5 月 16 日的2024年年度股东大会审议通过。 二、 分配方案 1. 发放年度：2024年年度 2. 分派对象： 截至股权登记日下午上海证券交易所收市后，在中国证券登记结算有限责任公司上海分 公司（以下简称"中国结算上海分公司"）登记在册的本公司全体股东。 根据《上市公司股份回购规则 ...

Market Performance - The lithography machine concept sector declined by 1.48%, ranking among the top losers in the market [1] - Within the sector, notable declines were observed in companies such as Wavelength Optoelectronics and *ST HeKe, while Baidao Chemical and Electric Science Digital saw increases of 1.66% and 0.68% respectively [1] Sector Comparison - The top-performing concept sectors included: - Armament restructuring concept: +8.73% - Electronic ID: +2.89% - Domestic aircraft carrier: +2.19% - Military information technology: +2.05% [2] Capital Flow - The lithography machine sector experienced a net outflow of 505 million yuan, with 27 stocks seeing net outflows, and 7 stocks exceeding 30 million yuan in outflows [2] - Wavelength Optoelectronics led the outflows with 79.09 million yuan, followed by Kaimete Gas and Crystal Technology with outflows of 63.41 million yuan and 53.61 million yuan respectively [2] Individual Stock Performance - Key stocks with significant outflows included: - Wavelength Optoelectronics: -5.79% with a turnover rate of 26.82% and a net outflow of 79.09 million yuan - Kaimete Gas: -2.59% with a turnover rate of 7.19% and a net outflow of 63.41 million yuan - Crystal Technology: -1.50% with a turnover rate of 4.54% and a net outflow of 53.61 million yuan [3]

Investment Rating - The report indicates a positive investment outlook for the optoelectronic device industry, driven by technological advancements and increasing demand across various sectors [1]. Core Insights - The optoelectronic device industry is experiencing a transformation due to technological upgrades and demand surges, positioning China to play a more central role in the global market [1]. - The industry is supported by government policies aimed at fostering innovation and industrialization, highlighting its strategic importance [5][6]. - The production capacity of optoelectronic devices in China is projected to exceed 20,000 billion units by 2025, reflecting a significant growth trajectory [9]. - Active optical devices account for approximately 83% of the optical communication system market, underscoring their critical role [11]. - The market for optical chips is expected to grow to approximately 15.914 billion yuan in 2025, driven by domestic replacements and technological advancements [13]. - The laser market is projected to reach 152.8 billion yuan in 2025, indicating robust growth [21]. Summary by Sections Industry Definition and Classification - Optoelectronic devices facilitate the conversion between optical and electrical signals and are categorized based on their functions and structures [3]. Industry Development Policies - The Chinese government has integrated the optoelectronic device industry into its strategic emerging industries, promoting technological innovation and industrialization through various policies [5][6][7]. Current Industry Status - The production of optoelectronic devices in China is expected to reach 18,479.7 billion units in 2024, marking a year-on-year growth of 28.51% [9]. - The optical communication device market is a core segment, with significant growth anticipated in optical chips and modules due to domestic technological advancements [13][15]. Key Enterprises - Notable companies in the industry include Sanan Optoelectronics, Huagong Technology, and Zhongji Xuchuang, which are leading in various segments such as LED, laser technology, and optical communication modules [30][31][38]. Future Industry Outlook - The industry is poised for growth driven by supportive government policies, technological innovations, and expanding application scenarios across telecommunications, consumer electronics, and medical fields [50][51][52].

证券代码：603005 证券简称：晶方科技 公告编号：临 2025-016 苏州晶方半导体科技股份有限公司 关于董事会、监事会延期换届的提示性公告 本公司董事会及全体董事保证本公告内容不存在任何虚假记载、误导性陈述 或者重大遗漏，并对其内容的真实性、准确性和完整性承担个别及连带责任。 苏州晶方半导体科技股份有限公司（以下简称"公司"）第五届董事会、监 事会于 2025 年 6 月 14 日任期届满。公司拟根据中国证券监督管理委员会最新修 订的《上市公司章程指引》《关于新<公司法>配套制度规则实施相关过渡期安排》 及上海证券交易所发布的配套规则制度等要求修订《苏州晶方半导体科技股份有 限公司章程》（以下简称"《公司章程》"）及相关内部制度并同时进行换届选举。 鉴于相关制度修订及换届工作尚在筹备中，为保证公司董事会、监事会相关 工作的连续性和稳定性，公司董事会、监事会的换届选举工作将适当延期，董事 会各专门委员会、高级管理人员的任期亦相应顺延。在董事会、监事会换届选举 工作完成前，公司第六届董事会、监事会全体成员、董事会各专门委员会成员及 高级管理人员将依照相关法律法规和《公司章程》等的规定，继续履行董事、监 事 ...