证券代码：603005 证券简称：晶方科技 公告编号：临 2024-042 苏州晶方半导体科技股份有限公司 第五届董事会第十六次临时会议决议公告 本公司董事会及全体董事保证本公告内容不存在任何虚假记载、误导性陈述 或者重大遗漏，并对其内容的真实性、准确性和完整性承担个别及连带责任。 一、董事会会议召开情况 苏州晶方半导体科技股份有限公司（以下简称"公司"）第五届董事会第十 六次临时会议于 2024 年 10 月 24 日以通讯和邮件方式发出通知，于 2024 年 10 月 29 日在公司会议室召开。会议应到董事 7 人，实际出席 7 人。会议的召集和 召开符合《公司法》和《公司章程》。 二、董事会会议审议情况 本次会议审议表决，通过了相关议案，形成决议如下： （一）会议审议通过了《关于公司 2024 年第三季度报告的议案》 《 晶 方 科 技 2024 年 第 三 季 度 报 告 》 详 见 上 海 证 券 交 易 所 网 站 ： http://www.sse.com.cn。 表决结果：同意 7 票，反对 0 票，弃权 0 票。 （二）会议审议通过了《关于对外投资进展及增加投资额度的议案》 根据马来西亚子公司 ...

Financial Performance - The company's operating revenue for Q3 2024 reached ¥294,549,519.53, representing a year-on-year increase of 47.31%[2] - Net profit attributable to shareholders for Q3 2024 was ¥74,393,970.00, a significant increase of 118.42% compared to the same period last year[2] - The net profit attributable to shareholders after deducting non-recurring gains and losses for Q3 2024 was ¥65,653,821.42, up 151.99% year-on-year[2] - Total operating revenue for the first three quarters of 2024 reached CNY 829,692,948.58, a 21.8% increase from CNY 681,712,535.73 in the same period of 2023[21] - The net profit for Q3 2024 was CNY 186,094,501.82, an increase of 62.4% compared to CNY 114,589,522.30 in Q3 2023[23] - The total comprehensive income for Q3 2024 reached CNY 189,317,858.15, up from CNY 112,860,842.52 in the same period last year, reflecting a growth of 67.5%[24] - Basic and diluted earnings per share for Q3 2024 were both CNY 0.28, compared to CNY 0.17 in Q3 2023, marking a 64.7% increase[24] Assets and Liabilities - The total assets at the end of the reporting period were ¥4,677,033,811.43, reflecting a decrease of 3.05% from the end of the previous year[4] - The company's total assets decreased to CNY 4,677,033,811.43 from CNY 4,824,122,558.00, a decline of approximately 3.1%[20] - Current liabilities totaled CNY 325,267,155.13, down from CNY 488,992,270.42, representing a decrease of 33.5%[19] - Non-current liabilities decreased to CNY 92,927,753.81 from CNY 213,597,209.68, a reduction of 56.5%[19] - The total equity attributable to shareholders increased to CNY 4,223,758,007.64 from CNY 4,088,742,566.33, reflecting a growth of 3.3%[19] Cash Flow - The company reported a net cash flow from operating activities of ¥231,069,094.33 for the year-to-date, an increase of 12.24%[4] - Cash flow from operating activities for the first three quarters of 2024 was CNY 231,069,094.33, compared to CNY 205,875,444.54 in the same period of 2023, representing an increase of 12.2%[26] - Cash flow from investing activities generated a net inflow of CNY 712,077,491.55 in the first three quarters of 2024, significantly up from CNY 82,290,581.79 in the previous year[26] - The company reported a significant increase in cash inflow from investment activities, totaling CNY 2,820,188,806.37 in the first three quarters of 2024, compared to CNY 1,590,089,140.31 in the same period of 2023[26] - The company reported cash and cash equivalents at the end of Q3 2024 amounting to CNY 1,184,491,825.17, compared to CNY 2,159,705,352.37 at the end of Q3 2023, indicating a decrease of 45%[27] Shareholder Information - The number of ordinary shareholders at the end of the reporting period was 144,179, with the largest shareholder holding 17.76% of the shares[10] - The company reported a significant increase in the number of shares held by major shareholders, with the top shareholder holding 115,849,766 shares[14] - The top 10 shareholders collectively hold a significant portion of the company's shares, with the largest single shareholder holding 1.54% of the total shares[16] - The company has not reported any changes in the relationships or actions among the top shareholders[14] Operational Insights - The company has not identified any significant changes in the operational status during the reporting period[17] - The financial statements for the quarter are unaudited, indicating that the figures may be subject to change upon final audit[17] - The company has not disclosed any new product developments or market expansion strategies in the current report[17] - The company is focusing on expanding its market presence and enhancing its product offerings through ongoing research and development initiatives[21] - Future guidance indicates a commitment to maintaining growth in revenue and profitability through strategic investments and operational efficiencies[21] Costs and Expenses - Total operating costs for the first three quarters of 2024 were CNY 609,500,772.92, up from CNY 546,133,876.58 in 2023, reflecting a 11.6% increase[21] - Research and development expenses for the first three quarters of 2024 amounted to CNY 109,447,840.81, compared to CNY 89,288,755.03 in 2023, indicating a 22.6% increase[21] - The company incurred a credit impairment loss of CNY -412,095.51 in Q3 2024, compared to CNY -3,744,722.05 in Q3 2023, showing an improvement[23]

关于对外投资进展以及增加投资额度的公告 本公司董事会及全体董事保证本公告内容不存在任何虚假记载、误导性陈述 或者重大遗漏，并对其内容的真实性、准确性和完整性承担个别及连带责任。 证券代码：603005 证券简称：晶方科技 公告编号：临 2024-044 苏州晶方半导体科技股份有限公司 一、对外投资事项概述 苏州晶方半导体科技股份有限公司（以下简称"公司"）于 2024 年 6 月 27 日召开第五届董事会第十四次临时会议，审议通过了《关于公司拟对外投资的议 案》，公司将通过新加坡子公司 OPTIZ PIONEER HOLDING PTE. LTD（以下简 称"OPTIZ PIONEER"）在马来西亚投资成立子公司，旨在建设公司海外生产制 造基地，提升公司生产制造与技术服务能力，更好贴近海外市场与客户需求，实 现公司业务的持续性增长，有效推进公司国际市场拓展、技术研发、全球化生产 投资的战略布局，计划投资金额为 5,000 万美元。具体情况详见公司于 2024 年 6 月 28 日披露的《晶方科技关于投资设立全资孙公司的公告》（公告编号：临 2024-030）。 二、对外投资进展情况 马来西亚子公司已完成注册设 ...

证券代码：603005 证券简称：晶方科技 公告编号：临 2024-043 苏州晶方半导体科技股份有限公司 第五届监事会第十六次临时会议决议公告 本公司监事会及全体监事保证本公告内容不存在任何虚假记载、误导性陈述 或者重大遗漏，并对其内容的真实性、准确性和完整性承担个别及连带责任。 表决结果：同意 3 票，反对 0 票，弃权 0 票。 特此公告。 苏州晶方半导体科技股份有限公司监事会 2024 年 10 月 30 日 会议审议了以下议案： 一、《关于公司 2024 年第三季度报告的议案》 表决结果：同意 3 票，反对 0 票，弃权 0 票。 二、《关于对外投资进展以及增加投资额度的议案》 苏州晶方半导体科技股份有限公司（以下简称"公司"）第五届监事会第十 六次临时会议于 2024 年 10 月 29 日以现场方式召开，应到监事 3 人，实到监事 3 人，会议由刘志华女士主持，符合《中华人民共和国公司法》和《公司章程》 的规定。 ...

证券代码：603005 证券简称：晶方科技 公告编号：临 2024-041 苏州晶方半导体科技股份有限公司 关于变更签字注册会计师的公告 本公司董事会及全体董事保证本公告内容不存在任何虚假记载、误导性陈述 或者重大遗漏，并对其内容的真实性、准确性和完整性承担个别及连带责任。 苏州晶方半导体科技股份有限公司（以下简称"公司"）于 2024 年 4 月 19 日召开了第五届董事会第四次会议，审议通过了《关于续聘会计师事务所的议案》、 《关于续聘内部控制审计机构的议案》，同意续聘容诚会计师事务所（特殊普通 合伙）（以下简称"容诚"）为公司 2024 年度财务报表及内部控制审计机构。具 体内容详见公司于 2024 年 4 月 20 日 披 露 于 上 海 证 券 交 易 所 网 站 （www.sse.com.cn）的《晶方科技续聘会计师事务所公告》（公告编号：临 2024- 013）。 近日，公司收到容诚出具的《关于变更苏州晶方半导体科技股份有限公司签 字注册会计师的说明函》，相关情况如下： 一、本次签字注册会计师变更情况 容诚作为公司聘任的 2024 年度审计机构，原委派齐利平作为项目合伙人及 签字注册会计师，孙茂 ...

关于完成工商变更登记的公告 本公司董事会及全体董事保证本公告内容不存在任何虚假记载、误导性陈述 或者重大遗漏，并对其内容的真实性、准确性和完整性承担个别及连带责任。 苏州晶方半导体科技股份有限公司（以下简称"公司"）分别于 2024 年 4 月 19 日、2024 年 5 月 10 日召开了第五届董事会第四次会议、2023 年年度股东 大会，审议通过了《关于变更注册资本并修订<公司章程>的议案》。具体内容详 见公司于 2024 年 4 月 20 日、2024 年 5 月 11 日刊登在《上海证券报》、《中国证 券报》及上海证券交易所网站（www.sse.com.cn）的《关于变更注册资本并修订 <公司章程>及相关制度的公告》（公告编号：临 2024-016）、《2023 年年度股东大 会决议公告》（公告编号：临 2024-021）等相关文件。 近日，公司完成了上述事项的工商变更登记手续，并取得了江苏省市场监督 管理局换发的《营业执照》，变更后的相关工商登记信息如下： 证券代码：603005 证券简称：晶方科技 公告编号：临 2024-040 苏州晶方半导体科技股份有限公司 一般经营项目：研发、生产、制造、封装 ...

Financial Performance - The company's operating revenue for the first half of 2024 reached ¥535,143,429.05, an increase of 11.08% compared to ¥481,761,633.82 in the same period last year[10]. - The net profit attributable to shareholders of the listed company was ¥110,069,127.19, representing a 43.67% increase from ¥76,611,382.13 in the previous year[10]. - The net profit after deducting non-recurring gains and losses was ¥90,279,542.66, up 52.39% from ¥59,243,936.07 year-on-year[10]. - The basic earnings per share increased to ¥0.17, a rise of 41.67% compared to ¥0.12 in the same period last year[11]. - The weighted average return on net assets was 2.67%, an increase of 0.76 percentage points from 1.91% in the previous year[12]. - The total operating revenue for the first half of 2024 reached ¥393,854,946.44, an increase from ¥347,051,646.24 in the same period of 2023, representing a growth of approximately 13.5%[78]. - The net profit for the first half of 2024 was ¥114,671,139.53, compared to ¥70,230,848.16 in the first half of 2023, indicating a significant increase of about 63.4%[79]. - The total comprehensive income for the first half of 2024 was ¥112,394,706.89, compared to ¥69,515,173.68 in the first half of 2023, showing an increase of about 61.5%[79]. Cash Flow and Assets - The net cash flow from operating activities was ¥123,066,198.66, down 5.55% from ¥130,300,545.84 in the same period last year[10]. - The company reported a net cash flow from investing activities of ¥343,663,414.87, a significant improvement compared to a net outflow of ¥1,491,594,817.20 in the previous year[29]. - The total assets at the end of the reporting period were ¥4,606,502,871.85, a decrease of 4.51% from ¥4,824,122,558.00 at the end of the previous year[10]. - Total current assets decreased to ¥2,605,330,982.38 from ¥2,780,440,577.98, a decline of approximately 6.3%[69]. - Cash and cash equivalents decreased to ¥2,304,522,560.25 from ¥2,554,605,772.26, representing a decrease of about 9.8%[69]. - Accounts receivable increased to ¥140,961,738.11 from ¥93,960,044.15, an increase of approximately 49.9%[69]. - Total liabilities decreased to ¥414,653,404.97 from ¥702,589,480.10, a significant reduction of about 41.0%[71]. - The company's overseas assets amounted to ¥614,138,174.68, accounting for 13.33% of total assets[32]. Research and Development - Research and development expenses increased by 27.90% to ¥70,912,231.77 from ¥55,444,608.29 year-on-year[29]. - The company aims to enhance its advanced packaging technology capabilities, particularly in automotive applications, and expand its market share in intelligent sensors and MEMS[26]. - The company has established a competitive advantage in wafer-level chip size packaging (WLCSP) technology, focusing on miniaturization, low power consumption, and high integration[18]. - The company is implementing a semiconductor technology innovation industrial park project with a total investment of ¥410 million, covering an area of 90 acres and a construction area of approximately 120,000 square meters[34]. Market Outlook - The global semiconductor sales are projected to reach $611.2 billion in 2024, a year-on-year increase of 15.8%[17]. - The global packaging market is expected to reach $89.9 billion in 2024, with a growth rate of 9.4%[17]. - The intelligent sensor market is recovering, with the global image sensor market projected to grow to $28.8 billion by 2028, with a compound annual growth rate of 5.1% from 2022 to 2028[24]. - The advanced packaging market is expected to grow at a compound annual growth rate of 11% from 2023 to 2029, reaching $69.5 billion[17]. Strategic Initiatives - The company has outlined its future growth strategy focusing on expanding its market presence and enhancing product offerings in the semiconductor industry[13]. - The company is establishing a global production and R&D layout, including a manufacturing base in Penang, Malaysia, to better meet overseas customer demands[28]. - The company is actively pursuing mergers and acquisitions to enhance its technological capabilities and market position, including the acquisition of Anteryon and VisIC[19]. Environmental Compliance - The company strictly adheres to environmental laws and regulations, ensuring that pollutant emissions meet national and local standards, with no significant environmental incidents reported during the reporting period[44]. - The company has obtained ISO 14001 environmental management certification, demonstrating its commitment to integrating environmental protection into its operations[51]. - Measures to reduce carbon emissions include improvements in energy management processes through ISO 50001, equipment upgrades, and the use of clean energy[52]. - The company has completed an emergency response plan for environmental incidents, which has been filed with local environmental authorities, and regular emergency drills are conducted to enhance response capabilities[47]. Shareholder Information - The company has a total of 162,208 common stock shareholders as of the end of the reporting period[62]. - The largest shareholder, Suzhou Industrial Park Venture Capital Co., Ltd., holds 115,849,766 shares, representing 17.75% of the total shares[62]. - The company did not propose any profit distribution or capital reserve transfer plan for the first half of 2024[42]. Governance and Compliance - There were no significant lawsuits or arbitration matters during the reporting period[58]. - The company has not engaged in any non-operational fund occupation by controlling shareholders or related parties during the reporting period[58]. - The company has not reported any changes in the audit opinion from the previous annual report[58]. Accounting Policies - The company adheres to the accounting standards and principles set forth by the relevant authorities, ensuring accurate financial reporting[110]. - The company’s financial statements reflect its financial position, operating results, changes in equity, and cash flows accurately[110]. - The company recognizes expected credit losses for financial assets measured at amortized cost and those measured at fair value with changes recognized in other comprehensive income[146].

苏州晶方半导体科技股份有限公司 关于公司高级管理人员辞职的公告 证券代码：603005 证券简称：晶方科技 公告编号：临 2024-039 特此公告。 苏州晶方半导体科技股份有限公司董事会 2024 年 8 月 14 日 本公司董事会及全体董事保证本公告内容不存在任何虚假记载、误导性陈述 或者重大遗漏，并对其内容的真实性、准确性和完整性承担个别及连带责任。 苏州晶方半导体科技股份有限公司（以下简称"公司"）董事会于近日收到 副总经理刘宏钧先生提交的书面辞职报告。刘宏钧先生因个人原因申请辞去公司 副总经理的职务，辞职后刘宏钧先生将不再担任公司任何职务。 根据《公司法》、《上海证券交易所股票上市规则》、《公司章程》等的有关规 定，刘宏钧先生辞去公司副总经理职务自辞职报告送达董事会之日起生效，其辞 职不会对公司的生产经营工作产生影响。 公司及董事会对刘宏钧先生在任职期间的勤勉工作和为公司做出的贡献表 示衷心的感谢！ ...

证券代码：603005 证券简称：晶方科技 公告编号：临 2024-038 苏州晶方半导体科技股份有限公司 关于股份回购实施结果暨股份变动的公告 本公司董事会及全体董事保证本公告内容不存在任何虚假记载、误导性陈述 或者重大遗漏，并对其内容的真实性、准确性和完整性承担个别及连带责任。 一、回购审批情况和回购方案内容 三、回购期间相关主体买卖股票情况 2024 年 2 月 29 日，公司首次披露了本次回购股份事项，具体内容详见公司 于上海证券交易所网站（www.sse.com.cn）披露的《关于以集中竞价交易方式回 购公司股份方案的公告》（公告编号：临 2024-002）。 截至本公告披露前，公司高级管理人员在此期间回购注销公司股票的情况如 下： 苏州晶方半导体科技股份有限公司（以下简称"公司"）于 2024 年 2 月 28 召开了第五届董事会第十二次临时会议，审议通过了《关于以集中竞价交易方式 回购公司股份方案的议案》，同意公司以集中竞价交易方式通过自有资金回购公 司股份，回购资金总额不低于人民币 1,500 万元（含）且不超过人民币 2,500 万 元（含），回购价格不超过人民币 25.93 元/股（含）， ...

二、董事会会议审议情况 本次会议审议表决，通过了相关议案，形成决议如下： （一）会议审议通过了《关于公司完成以集中竞价交易方式回购公司股份方 案的议案》 证券代码：603005 证券简称：晶方科技 公告编号：临 2024-036 苏州晶方半导体科技股份有限公司 第五届董事会第十五次临时会议决议公告 本公司董事会及全体董事保证本公告内容不存在任何虚假记载、误导性陈述 或者重大遗漏，并对其内容的真实性、准确性和完整性承担个别及连带责任。 一、董事会会议召开情况 苏州晶方半导体科技股份有限公司（以下简称"公司"）第五届董事会第十 五次临时会议于 2024 年 7 月 26 日以通讯和邮件方式发出通知，于 2024 年 7 月 30 日在公司会议室召开。会议应到董事 7 人，实际出席 7 人。会议的召集和召 开符合《公司法》和《公司章程》。 苏州晶方半导体科技股份有限公司董事会 2024 年 7 月 31 日 《晶方科技关于股份回购实施结果暨股份变动的公告》详见上海证券交易所 网站：http://www.sse.com.cn。 表决结果：同意 7 票，反对 0 票，弃权 0 票。 特此公告。 ...