Core Viewpoint - Lian Microelectronics (605358.SH) has successfully mass-produced automotive-grade VCSEL chips for laser radar applications in smart driving, becoming the first global manufacturer to achieve this milestone [1] Group 1: Product Development - Lian Microelectronics' VCSEL chip products are utilized in laser radar for smart driving and have achieved large-scale shipments [1] - The company has developed a two-dimensional addressable high-power VCSEL technology, which is a significant advancement in the automotive radar sector [1] Group 2: Market Applications - The VCSEL chips are applied in various fields, including smart driving, humanoid robots, and lawn mowing robots, showcasing the versatility of the technology [1] - The company currently does not have products for automotive 4D millimeter-wave radar, indicating a focus on laser radar technology [1]

格隆汇1月12日丨立昂微(605358.SH)在互动平台表示，立昂东芯pHEMT工艺可将栅长0.15um的功率 管、低噪声晶体管、PN二极管、E/D逻辑及射频开关集成于单芯片并实现商业化量产，目前已用于低轨 卫星通信领域并已实现大批量出货，实现包括功率放大器（PA），低噪声放大器（LNA）以及射频开 关（SW）等功能。此外，立昂东芯的氮化镓射频芯片工艺也将实现卫星领域应用作为目标。 ...

Core Viewpoint - Lian Microelectronics (605358.SH) has successfully mass-produced automotive-grade VCSEL chips for laser radar applications in smart driving, becoming the first global manufacturer to achieve this milestone [1] Group 1: Product Development - Lian Microelectronics' VCSEL chip products are utilized in laser radar for smart driving and have achieved large-scale shipments [1] - The company has developed a 2D addressable high-power VCSEL technology, which is a significant advancement in the automotive sector [1] Group 2: Market Applications - The VCSEL chips are applied in various fields, including smart driving, humanoid robots, and lawn mowing robots [1] - The company currently does not have products for automotive 4D millimeter-wave radar applications, indicating a focus on laser radar technology [1]

Group 1 - The company has decided to extend the completion date of the "Annual Production of 1.8 Million 12-inch Semiconductor Silicon Epitaxial Wafer Project" to December 2027 due to market conditions and demand fluctuations [3][6][8] - The company raised a total of RMB 339 million through the issuance of convertible bonds, with a net amount of RMB 337.81 million after deducting issuance costs [1][2] - As of December 31, 2025, the cumulative investment from the raised funds amounted to RMB 286.99 million, excluding issuance costs [2] Group 2 - The project was initially delayed to May 2026 due to weak market conditions affecting the semiconductor industry, leading to underutilization of existing production capacity [3][5] - The construction of the new epitaxial workshop has reached the roofing stage and is expected to be completed by August 2026, followed by equipment installation and debugging [6][7] - The company has observed a recovery in the semiconductor silicon wafer industry since Q1 2025, with increased demand for high-end power devices, prompting a faster project construction pace [7] Group 3 - The board of directors approved the project delay during a meeting on January 9, 2026, and the decision followed necessary procedures [9][42] - The company has implemented a prudent investment strategy to protect shareholder interests and mitigate investment risks [5][8] - The company will continue to monitor market conditions and adjust the project implementation pace accordingly to ensure efficient use of raised funds [7][8]

Core Viewpoint - The announcements from the company reveal the completion of the 6-inch silicon polishing wafer project and the second delay of the 12-inch semiconductor silicon epitaxial wafer project, highlighting challenges in the semiconductor industry and adjustments in project timelines. Group 1: 6-inch Silicon Polishing Wafer Project - The 6-inch silicon polishing wafer project has officially completed as of January 9, 2026, with a total investment of 124,739.68 million yuan against a promised amount of 125,000 million yuan, resulting in a surplus of 1,840.24 million yuan [2] - The surplus funds will be fully allocated to the 12-inch semiconductor silicon epitaxial wafer project, as the surplus is below 5% of the committed investment, thus not requiring board approval [2] Group 2: 12-inch Semiconductor Silicon Epitaxial Wafer Project - The timeline for the 12-inch semiconductor silicon epitaxial wafer project has been postponed from May 2026 to December 2027, marking the second delay after an initial postponement from April 2024 [3] - The project has a planned investment of 113,000 million yuan, with 62,263.61 million yuan already invested, reflecting a progress rate of 55.10% as of December 31, 2025 [3] - The delay is attributed to the downturn in the semiconductor silicon wafer industry, leading to underutilization of existing capacity and increased profitability pressure, prompting the company to slow down construction and equipment procurement [3] Group 3: Industry Environment and Future Outlook - Since the first quarter of 2025, the semiconductor silicon wafer industry has seen a recovery in demand, with significant increases in order volumes and shipment quantities, particularly for high-end power devices [4] - The company has accelerated the construction pace of its projects since the second half of 2025 and plans to adjust the construction schedule dynamically based on market conditions [4]

Core Viewpoint - Lianang Micro announced the completion of its "annual production of 6 million pieces of 6-inch integrated circuit silicon wafers project" and will transfer the surplus raised funds of 18.4024 million yuan (including interest) to the ongoing "annual production of 1.8 million pieces of 12-inch semiconductor silicon epitaxial wafer project" without requiring board approval [2] Group 1 - The company has completed its 6-inch silicon wafer project, which indicates progress in its production capabilities [2] - The surplus funds from the completed project will be redirected to support the development of the 12-inch silicon epitaxial wafer project, highlighting a strategic allocation of resources [2] - The transfer of funds does not require board approval, suggesting streamlined decision-making processes within the company [2]

Core Viewpoint - Lianang Microelectronics announced a delay in the completion date of its semiconductor project, extending it to December 2027 due to business planning and project evaluation [2] Group 1: Company Announcement - Lianang Microelectronics held its 15th meeting of the 5th Board of Directors on January 9, 2026 [2] - The company approved a proposal to postpone the completion date of the "Annual Production of 1.8 Million 12-inch Semiconductor Silicon Epitaxial Wafer Project" [2] - The decision was made after careful consideration of the actual situation of the fundraising investment projects and future business development plans [2]

Group 1 - The company Lianang Micro (605358) announced that it will hold its first extraordinary shareholders' meeting on January 26, 2026 [1]

（文章来源：证券日报） 证券日报网讯 1月9日，立昂微发布公告称，公司第五届董事会第十五次会议审议通过《关于部分募集 资金投资项目延期的议案》《关于2025年度日常关联交易的执行情况及预计2026年度日常关联交易情况 的议案》《关于公司2026年度为控股子公司提供担保的议案》。 ...

部分募集资金投资项目延期的核查意见 东方证券股份有限公司（以下简称"东方证券"或"保荐机构"）作为杭州 立昂微电子股份有限公司（以下简称"立昂微"或"公司"）2022 年公开发行可 转换公司债券的保荐机构，根据《证券发行上市保荐业务管理办法》《上市公司 募集资金监管规则》《上海证券交易所股票上市规则》《上海证券交易所上市公司 自律监管指引第 1 号——规范运作》等相关规定，对立昂微部分募集资金投资项 目延期的事项进行了认真、审慎核查。具体核查情况如下： 一、募集资金基本情况 公司经中国证券监督管理委员会《关于核准杭州立昂微电子股份有限公司公 开发行可转换公司债券的批复》（证监许可[2022]2345号）核准，公开发行可转 换公司债券3,390.00万张，每张面值100元，共计募集资金人民币339,000.00万元， 本次公开发行可转换公司债券发行承销保荐费及其他发行费用（不含税）共计人 民币1,187.59万元，本次公开发行可转换公司债券认购资金总额扣减上述发行费 用（不含税）后募集资金净额为人民币337,812.41万元，已于2022年11月18日汇 入本公司募集资金监管账户。上述募集资金到位情况业经中汇会 ...