Group 1 - The company has decided to extend the completion date of the "Annual Production of 1.8 Million 12-inch Semiconductor Silicon Epitaxial Wafer Project" to December 2027 due to market conditions and demand fluctuations [3][6][8] - The company raised a total of RMB 339 million through the issuance of convertible bonds, with a net amount of RMB 337.81 million after deducting issuance costs [1][2] - As of December 31, 2025, the cumulative investment from the raised funds amounted to RMB 286.99 million, excluding issuance costs [2] Group 2 - The project was initially delayed to May 2026 due to weak market conditions affecting the semiconductor industry, leading to underutilization of existing production capacity [3][5] - The construction of the new epitaxial workshop has reached the roofing stage and is expected to be completed by August 2026, followed by equipment installation and debugging [6][7] - The company has observed a recovery in the semiconductor silicon wafer industry since Q1 2025, with increased demand for high-end power devices, prompting a faster project construction pace [7] Group 3 - The board of directors approved the project delay during a meeting on January 9, 2026, and the decision followed necessary procedures [9][42] - The company has implemented a prudent investment strategy to protect shareholder interests and mitigate investment risks [5][8] - The company will continue to monitor market conditions and adjust the project implementation pace accordingly to ensure efficient use of raised funds [7][8]

Core Viewpoint - The announcements from the company reveal the completion of the 6-inch silicon polishing wafer project and the second delay of the 12-inch semiconductor silicon epitaxial wafer project, highlighting challenges in the semiconductor industry and adjustments in project timelines. Group 1: 6-inch Silicon Polishing Wafer Project - The 6-inch silicon polishing wafer project has officially completed as of January 9, 2026, with a total investment of 124,739.68 million yuan against a promised amount of 125,000 million yuan, resulting in a surplus of 1,840.24 million yuan [2] - The surplus funds will be fully allocated to the 12-inch semiconductor silicon epitaxial wafer project, as the surplus is below 5% of the committed investment, thus not requiring board approval [2] Group 2: 12-inch Semiconductor Silicon Epitaxial Wafer Project - The timeline for the 12-inch semiconductor silicon epitaxial wafer project has been postponed from May 2026 to December 2027, marking the second delay after an initial postponement from April 2024 [3] - The project has a planned investment of 113,000 million yuan, with 62,263.61 million yuan already invested, reflecting a progress rate of 55.10% as of December 31, 2025 [3] - The delay is attributed to the downturn in the semiconductor silicon wafer industry, leading to underutilization of existing capacity and increased profitability pressure, prompting the company to slow down construction and equipment procurement [3] Group 3: Industry Environment and Future Outlook - Since the first quarter of 2025, the semiconductor silicon wafer industry has seen a recovery in demand, with significant increases in order volumes and shipment quantities, particularly for high-end power devices [4] - The company has accelerated the construction pace of its projects since the second half of 2025 and plans to adjust the construction schedule dynamically based on market conditions [4]

Core Viewpoint - Lianang Micro announced the completion of its "annual production of 6 million pieces of 6-inch integrated circuit silicon wafers project" and will transfer the surplus raised funds of 18.4024 million yuan (including interest) to the ongoing "annual production of 1.8 million pieces of 12-inch semiconductor silicon epitaxial wafer project" without requiring board approval [2] Group 1 - The company has completed its 6-inch silicon wafer project, which indicates progress in its production capabilities [2] - The surplus funds from the completed project will be redirected to support the development of the 12-inch silicon epitaxial wafer project, highlighting a strategic allocation of resources [2] - The transfer of funds does not require board approval, suggesting streamlined decision-making processes within the company [2]

Core Viewpoint - Lianang Microelectronics announced a delay in the completion date of its semiconductor project, extending it to December 2027 due to business planning and project evaluation [2] Group 1: Company Announcement - Lianang Microelectronics held its 15th meeting of the 5th Board of Directors on January 9, 2026 [2] - The company approved a proposal to postpone the completion date of the "Annual Production of 1.8 Million 12-inch Semiconductor Silicon Epitaxial Wafer Project" [2] - The decision was made after careful consideration of the actual situation of the fundraising investment projects and future business development plans [2]

Group 1 - The company Lianang Micro (605358) announced that it will hold its first extraordinary shareholders' meeting on January 26, 2026 [1]

（文章来源：证券日报） 证券日报网讯 1月9日，立昂微发布公告称，公司第五届董事会第十五次会议审议通过《关于部分募集 资金投资项目延期的议案》《关于2025年度日常关联交易的执行情况及预计2026年度日常关联交易情况 的议案》《关于公司2026年度为控股子公司提供担保的议案》。 ...

部分募集资金投资项目延期的核查意见 东方证券股份有限公司（以下简称"东方证券"或"保荐机构"）作为杭州 立昂微电子股份有限公司（以下简称"立昂微"或"公司"）2022 年公开发行可 转换公司债券的保荐机构，根据《证券发行上市保荐业务管理办法》《上市公司 募集资金监管规则》《上海证券交易所股票上市规则》《上海证券交易所上市公司 自律监管指引第 1 号——规范运作》等相关规定，对立昂微部分募集资金投资项 目延期的事项进行了认真、审慎核查。具体核查情况如下： 一、募集资金基本情况 公司经中国证券监督管理委员会《关于核准杭州立昂微电子股份有限公司公 开发行可转换公司债券的批复》（证监许可[2022]2345号）核准，公开发行可转 换公司债券3,390.00万张，每张面值100元，共计募集资金人民币339,000.00万元， 本次公开发行可转换公司债券发行承销保荐费及其他发行费用（不含税）共计人 民币1,187.59万元，本次公开发行可转换公司债券认购资金总额扣减上述发行费 用（不含税）后募集资金净额为人民币337,812.41万元，已于2022年11月18日汇 入本公司募集资金监管账户。上述募集资金到位情况业经中汇会 ...

| 证券代码：605358 | 证券简称：立昂微 | 公告编号：2026-006 | | --- | --- | --- | | 债券代码：111010 | 债券简称：立昂转债 | | 杭州立昂微电子股份有限公司 关于 2025 年度日常关联交易的执行情况及 2026 年度日常关联 交易预计的公告 本公司董事会及全体董事保证本公告内容不存在任何虚假记载、误导性陈述 或者重大遗漏，并对其内容的真实性、准确性和完整性承担个别及连带责任。 重要内容提示： 公司日常关联交易预计事项尚需提交股东会审议。 公司与关联方发生的日常关联交易均按照公平、公正、自愿、诚信的原则进行，不会 对公司的独立性产生影响，不会对关联方形成依赖，不存在损害中小股东利益的行为和情况。 一、日常关联交易基本情况 （一）日常关联交易履行的审议程序 | 关联交易类别 | 关联人（注） | 上年（前次）预计 金额 | 上年（前次）实际 发生金额（未经审 | 预计金额与实际发 生金额差异较大的 | | --- | --- | --- | --- | --- | | | | | 计） | 原因 | | 向关联人销售产 品、商品 | 杭州道铭微电子有 限公 ...

证券代码：605358 证券简称：立昂微 公告编号：2026-005 债券代码：111010 债券简称：立昂转债 杭州立昂微电子股份有限公司 关于部分募集资金投资项目延期的公告 本公司董事会及全体董事保证本公告内容不存在任何虚假记载、误导性陈述或者重大遗漏， 并对其内容的真实性、准确性和完整性承担法律责任。 公司经中国证券监督管理委员会《关于核准杭州立昂微电子股份有限公司公开发行可转换 公司债券的批复》(证监许可[2022]2345 号)核准，公开发行可转换公司债券 3,390.00 万张， 每张面值 100 元，共计募集资金人民币 339,000.00 万元，本次公开发行可转换公司债券发行 承销保荐费及其他发行费用(不含税)共计人民币 1,187.59 万元，本次公开发行可转换公司债 券认购资金总额扣减上述发行费用(不含税)后募集资金净额为人民币 337,812.41 万元，已于 2022 年 11 月 18 日汇入本公司募集资金监管账户。上述募集资金到位情况业经中汇会计师事务 所(特殊普通合伙)审验，并由其出具了《验资报告》(中汇会验[2022]7581 号)。 二、募集资金使用情况 截至 2025 年 ...

| 证券代码：605358 | 证券简称：立昂微 | 公告编号：2026-007 | | --- | --- | --- | | 债券代码：111010 | 债券简称：立昂转债 | | 杭州立昂微电子股份有限公司 关于2026年度为控股子公司提供担保的公告 本公司董事会及全体董事保证本公告内容不存在任何虚假记载、误导性陈述或者重大遗漏， 并对其内容的真实性、准确性和完整性承担个别及连带责任。 重要内容提示: 被担保人名称：浙江金瑞泓科技股份有限公司、金瑞泓科技（衢州）有限公司、金瑞 泓微电子（衢州）有限公司、杭州立昂东芯微电子有限公司、海宁立昂东芯微电子有限公司 是否为上市公司关联人：否 本年度担保金额及已实际为其提供的担保余额：截至本公告披露日，公司及控股子公 司担保总额为人民币323,615.66万元，为控股子公司承担担保责任的担保余额合计为人民币 323,615.66万元，公司为除控股子公司之外的其他单位的担保余额为0，公司合计担保余额 323,615.66万元，占公司最近一期经审计净资产的44.10%。 公司不存在逾期对外担保 本次担保无反担保 特别风险提示：本次担保的对象存在资产负债率超过70%的控 ...