智通财经1月21日讯（记者 汪斌）得益于半导体行业市场需求增长，立昂微（605358.SH）预计2025年 亏损幅度有所收窄。 立昂微今日晚间发布业绩预告，预计公司2025年度实现营收约35.95亿元，同比增长16.26%；预计归母 净利润亏损1.21亿元左右，亏损幅度有所减少，上年同期公司净亏损2.66亿元。值得注意的是，公司预 计2025年实现EBITDA（息税折旧摊销前利润）约11.2亿元，同比增长约75.91%。 对于业绩连续亏损的原因，立昂微归结为折旧摊销支出、计提存货跌价准备、可转债利息费用、公允价 值变动损失四个因素所致。根据公告，2025年公司折旧摊销支出约11.24亿元，计提存货跌价准备、可 转债利息费用分别为1.26亿元、1.35亿元。 对于业绩从深度亏损转为大幅减亏的原因，立昂微在公告中明确指出，这得益于半导体硅片板块盈利能 力的复苏。 立昂微称，随着产品结构持续向高端化迭代升级，半导体硅片业务的平均销售单价自2025年第一季度起 呈逐季提升态势；加之产销规模稳步扩张，尤其是12英寸硅片产销量实现大幅增长，硅片单位成本亦随 之同步下降。在出货价格提升和单位成本下降双重驱动下，硅片业务综合 ...

转自：证券时报 人民财讯1月21日电，立昂微(605358)1月21日公告，预计2025年度实现归属于上市公司股东的净利润为 亏损1.21亿元左右，同比减亏。报告期内，公司归属于上市公司股东的净利润同比大幅减亏，主要得益 于半导体硅片板块盈利能力的复苏。 ...

| 证券代码：605358 | 证券简称：立昂微 | 公告编号：2026-009 | | --- | --- | --- | | 债券代码：111010 | 债券简称：立昂转债 | | 杭州立昂微电子股份有限公司 2025 年年度业绩预告 本公司董事会及全体董事保证本公告内容不存在任何虚假记载、误导性陈述或者重大遗漏， 并对其内容的真实性、准确性和完整性承担个别及连带责任。 重要内容提示： ● 业绩预告的具体适用情形：净利润为负值。 ● 杭州立昂微电子股份有限公司（以下简称"公司"）预计2025年度实现营业收入 359,500.00万元左右，同比增长约16.26%。预计实现归属于上市公司股东的净利润为亏损 12,100.00万元左右，同比减亏约54.47%。 ● 预计归属于上市公司股东的扣除非经常性损益的净利润为亏损16,100.00万元左右，同 比减亏约39.46%。 一、本期业绩预告情况 （一）业绩预告期间 2025年1月1日至2025年12月31日。 （二）业绩预告情况 1、经财务部门初步测算，预计2025年度实现营业收入359,500.00万元左右，与上年同期 相比增加50,268.34万元左右，同比 ...

格隆汇1月21日丨立昂微公告称，立昂微预计2025年度实现归属于上市公司股东的净利润为亏损1.21亿 元左右，上年同期亏损2.66亿元。预计2025年度实现营业收入35.95亿元左右，同比增长约16.26%。业 绩变动主要原因是半导体硅片板块盈利能力复苏，产品结构向高端化升级，12英寸硅片产销量大幅增 长，销售单价提升、单位成本下降，带动毛利率改善，同时非经常性损益增加。 ...

南财智讯1月21日电，立昂微发布年度业绩预告，预计2025年全年归属于上市公司股东的净利润为亏损 12,100.00万元左右，同比减亏约54.47%；归属于上市公司股东的扣除非经常性损益的净利润为亏损 16,100.00万元左右，同比减亏约39.46%。净利润变动原因为：报告期内，公司实现归属于上市公司股 东的净利润变动的主要原因：1、随着公司扩产项目陆续转产，本报告期折旧摊销支出约112,370.00万 元，同比增加约18,463.00万元。2、基于谨慎性原则，本报告期计提了约12,560.00万元的存货跌价准 备。3、报告期内公司计提了13,540.00万元的可转债利息费用。4、2024年12月控股子公司金瑞泓微电子 （衢州）有限公司收购金瑞泓微电子（嘉兴）有限公司少数股权导致利润减少约4,310.00万元。报告期 内，公司归属于上市公司股东的净利润同比大幅减亏，主要得益于半导体硅片板块盈利能力的复苏。随 着产品结构持续向高端化迭代升级，半导体硅片业务的平均销售单价自2025年第一季度起呈现逐季提升 态势；加之产销规模的稳步扩张，尤其是12英寸硅片产销量实现大幅增长，硅片单位成本亦随之同步下 降。在出货价 ...

立昂微(605358.SH)公告称，立昂微预计2025年度实现归属于上市公司股东的净利润为亏损1.21亿元左 右，上年同期亏损2.66亿元。预计2025年度实现营业收入35.95亿元左右，同比增长约16.26%。业绩变 动主要原因是半导体硅片板块盈利能力复苏，产品结构向高端化升级，12英寸硅片产销量大幅增长，销 售单价提升、单位成本下降，带动毛利率改善，同时非经常性损益增加。 ...

Core Viewpoint - The company, Lian Micro (605358.SH), expects to achieve an operating revenue of approximately 3.595 billion yuan in 2025, representing a year-on-year growth of about 16.26% [1] Financial Performance - The company anticipates a net loss attributable to shareholders of approximately 121 million yuan, which reflects a year-on-year reduction in loss of about 54.47% [1] - The net profit attributable to shareholders after deducting non-recurring gains and losses is expected to be a loss of around 161 million yuan, indicating a year-on-year reduction in loss of approximately 39.46% [1]

Core Insights - The global semiconductor materials market is experiencing a strong recovery, with a market size of $66.7 billion in 2023 and expected to exceed $73 billion by 2025, driven by demand from AI and wafer fab expansions [1] - China is becoming a key growth engine in the semiconductor materials market, with a sales figure of $13.1 billion in 2023, marking a year-on-year growth of 3.8% and increasing its global market share to 20% [1] Market Structure - Semiconductor materials are divided into wafer manufacturing materials and packaging materials, with wafer manufacturing materials dominating the market at 62.2% share ($41.5 billion) in 2023 [2] - Silicon wafers hold the largest share in wafer manufacturing materials at 33%, followed by electronic specialty gases (14%) and photomasks (13%) [2] - The market is highly concentrated, with major players in silicon wafers and photolithography materials predominantly from Japan and the U.S. [2] Core Material Breakthroughs - Domestic companies are making significant progress in wafer manufacturing materials, with local firms achieving breakthroughs in 12-inch silicon wafers and photolithography materials [3][4] - The domestic market for electronic specialty gases is also advancing, with companies like Huate Gas entering the TSMC supply chain [4] Packaging Materials - The global packaging materials market saw a decline of 10.1% to $25.2 billion in 2023, but advanced packaging is driving growth, with a projected increase of 19.62% [5] - Domestic companies are rapidly iterating technology in advanced packaging materials, with significant market shares in lead frames and packaging substrates [5] Import Dependency and Policy Support - China still faces significant import dependency in key categories like photolithography materials and electronic specialty gases, with over 90% reliance on imports for high-end materials below 14nm [6][8] - The government is focusing on critical areas through initiatives like the National Big Fund, aiming for 70% self-sufficiency in core materials by 2030 [6][8] Challenges and Future Outlook - Despite notable advancements, the industry faces challenges such as reliance on foreign technology for EUV-grade silicon wafers and high-end photolithography materials [7] - The advanced packaging materials market is expected to reach $39.3 billion by 2025, indicating a significant growth opportunity for domestic companies [7]

Core Viewpoint - The company, Lian Micro (605358), possesses proprietary technology for 12-inch silicon wafer production, which is a significant competitive advantage in the industry due to over 20 years of technical development and experience accumulation [1] Group 1: Competitive Advantages - The company has outstanding epitaxial technology and heavily doped single crystal technology, which are its core competencies [1] - These advantages allow the company to establish differentiated competition compared to its peers, resulting in better profitability [1] Group 2: Product Applications and Market Demand - The company's epitaxial technology can be applied to both heavily doped and lightly doped silicon epitaxial wafers, with a current utilization rate of approximately 80% for the 12-inch heavily doped series [1] - The 12-inch heavily doped epitaxial wafers meet the demands of high-end power devices, with end applications in AI server uninterruptible power supplies, energy storage inverters, charging piles, industrial electronics, servo drivers, consumer electronics, automotive electronics, home appliances, embedded systems, and industrial control, indicating a broad market demand [1] Group 3: Product Focus - The company’s lightly doped silicon epitaxial wafers focus on key products such as lightly doped boron silicon wafers for 12-inch logic circuits, BCD lightly doped boron silicon wafers, and CIS lightly doped boron silicon wafers, which have rapidly gained traction with clients [1] - These products have a higher single wafer value compared to lightly doped polished wafers [1]

Core Viewpoint - The company has successfully passed vehicle system certifications from major players such as Continental, Bosch, and Fagor, indicating stable product quality [1] Group 1: Company Capabilities - The company produces all power chips using its own 6-inch silicon epitaxial wafers, allowing for customized production from the material stage to better meet customer needs [1]