Topic 1: Product Development and Innovation - Shanghai Kingsemi Microelectronics Co., Ltd. officially released the KCE front-end single-wafer chemical cleaning machine, opening up a new market worth billions of RMB and completing the strategic layout of front-end coating development and front-end cleaning[1] - The company launched a strategic new product, the front-end single-wafer chemical cleaning machine, in March 2024, with a process coverage rate of over 80%, expanding the domestic market space for front-end products to 20 billion RMB[11] - The company's coating development and single-wafer wet equipment have been widely used in major manufacturers such as TSMC, JCET, and Huatian Technology, with some technologies reaching international leading levels[12] - The company officially launched the fully automatic SiC dicing and breaking machine, leveraging unique SnB dicing technology to solve traditional cutting issues, enriching the product layout in the small-size field[13] - The company's front-end chemical cleaning machine KS-CM300/200 has achieved over 80% process coverage and passed 26nm particle testing, meeting advanced process requirements[184] - The company's temporary bonding machine for Chiplet technology has achieved excellent TTV and warpage performance, compatible with 60μm and above thick film coating requirements[175] - The company's new SiC wafer dicing machine KS-S200-2H1L achieves a cutting speed of approximately 100mm/s, significantly improving efficiency[152] - The company's third-generation immersion high-capacity coater-developer has achieved mass production in conjunction with mainstream global lithography machines, with plans to develop next-generation higher-capacity models[197] Topic 2: R&D and Technological Advancements - The company's R&D expenses have consistently exceeded 10% of revenue, with a compound annual growth rate of over 50% in the past five years, and 131 new patent and software copyright applications in 2023[14] - The company plans to continue increasing R&D investment in 2024, focusing on market and customer demand, and strengthening basic R&D capabilities to drive product technology upgrades[16] - The company's R&D expenditure in 2023 was RMB 300 million, accounting for 11.2% of total revenue[74] - R&D expenditure accounted for 11.52% of revenue in 2023, an increase of 0.53 percentage points from 2022[85] - The company's technology center was recognized as a "National Enterprise Technology Center" in February 2023, highlighting its strong innovation capabilities[116] - The company was awarded the title of "National Manufacturing Single Champion Enterprise" in March 2024 for its coater/developer products[117] - As of the end of the reporting period, the company held 286 patents, including 181 invention patents, 69 utility model patents, and 36 design patents[117] Topic 3: Market Expansion and Strategic Growth - The establishment of Kingsemi Kyoto Co., Ltd. in Japan in August 2022 helps the company access high-end industrial and R&D resources in the semiconductor field, enhancing technical capabilities and reducing production costs[1] - Guangzhou Kingsemi Co., Ltd. was established in September 2023, focusing on the R&D and industrialization of core components such as photoresist pumps, supported by government funding, marking the start of a new development pattern of "whole machine + components"[2] - The global front-end 300mm wafer fab equipment expenditure is expected to grow by 20% to $116.5 billion by 2025 and reach a record $137 billion by 2027[8] - The company's market share in the semiconductor equipment sector increased to 12% in 2023[74] - The company completed the acquisition of a key competitor, enhancing its technological capabilities and market position[74] - The company's international sales grew by 30% in 2023, driven by expansion in Europe and North America[74] - The company's total orders at the end of the reporting period were approximately 2.2 billion yuan (including tax), providing strong support for 2024 performance[167] - The company's front-end coating and developing equipment has achieved full coverage of 28nm and above process nodes in front-end wafer processing, with 28nm and below process technologies currently under validation[183] - The company's front-end physical cleaning machines have been widely adopted by major domestic fabs such as SMIC, HLMC, and Silan, becoming the main production model for domestic logic and power device customers[169] - The company's next-generation high-capacity physical cleaning machine has been sent to a major domestic memory customer for validation, with potential to open new market space in the memory sector[169] - The company's back-end advanced packaging coating and developing equipment and single-wafer wet process equipment have been continuously used as mainstream models by top-tier manufacturers including TSMC, JCET, and Huatian for multiple years[171] - The company's ArF immersion high-capacity coater-developer equipment received orders from 5 major domestic customers[141] - The strategic new product, front-end chemical cleaning machine KS-CM300/200, received validation orders from major domestic customers in Q4 2023[145] - The company's temporary bonding and debonding equipment has reached international advanced levels and received orders from multiple domestic leading customers[152] - The company's compound and small-size equipment, including coating and developing machines and cleaning machines, are widely used in 4-8 inch wafer processes for RF devices, power devices, and MEMS production[189] - The global semiconductor equipment market is projected to see significant growth, with 300mm wafer fab equipment spending expected to exceed $100 billion in 2025 and reach a historic high of $137 billion by 2027[193] Topic 4: Financial Performance and Metrics - The company's revenue for 2023 reached RMB 2.67 billion, reflecting a 15% year-over-year growth[74] - The company's net profit for 2023 was RMB 500 million, marking a 20% increase compared to the previous year[74] - Revenue for 2023 reached 1,716,969,907.58 RMB, a 23.98% increase compared to 2022[85] - Net profit attributable to shareholders in 2023 was 250,626,202.20 RMB, up 25.21% year-over-year[85] - Net cash flow from operating activities in 2023 was -562,876,699.27 RMB, a 391.70% decrease compared to 2022, primarily due to increased material procurement and reduced sales collections[86] - Total assets at the end of 2023 were 4,301,555,628.29 RMB, a 23.03% increase from 2022[85] - Basic earnings per share in 2023 were 1.82 RMB, a 19.82% decrease compared to 2022[85] - Weighted average return on equity (ROE) in 2023 was 11.24%, a decrease of 2.12 percentage points from 2022[85] - The company's net profit attributable to shareholders excluding non-recurring gains and losses increased by 36.37% year-over-year in 2023[85] - The company's total equity attributable to shareholders at the end of 2023 was 2,380,440,281.77 RMB, a 13.00% increase from 2022[85] - Non-recurring profit and loss items for 2023 amounted to 63,461,030.55 RMB, with significant contributions from government subsidies and asset disposal gains[111] - Revenue for the reporting period reached 1.717 billion yuan, a year-on-year increase of 23.98%[137] - Net profit attributable to shareholders of the listed company was 251 million yuan, a year-on-year increase of 25.21%[137] - Net profit attributable to shareholders of the listed company after deducting non-recurring gains and losses was 187 million yuan, a year-on-year increase of 36.37%[137] - Total assets at the end of the reporting period were 4.302 billion yuan, with shareholders' equity of 2.38 billion yuan[137] - Quarterly revenue for Q4 2023 was 510,488,873.67 RMB, with net profit attributable to shareholders of 30,398,122.88 RMB[131] - The company's other non-current financial assets increased by 39,372,047.24 RMB, contributing to a total fair value change of 24,576,587.09 RMB[134] Topic 5: Supply Chain and Operational Efficiency - The company will continue to promote digitalization, informatization, and standardization in supply chain management in 2024 to ensure efficient, scientific, and standardized operations[17] - The company has established stable strategic partnerships with hundreds of core suppliers and implemented a multi-vendor strategy for key components to ensure timely supply[17] - The company is advancing the localization of key core materials, including mechanical hands, pumps, hot plates, and fluororesin components, to ensure quality while reducing reliance on imports[17] - The company's Japanese subsidiary was successfully established in August 2022, enriching its supply chain resources[17] - The Guangzhou subsidiary, established during the reporting period, focuses on the R&D and industrialization of core components such as photoresist pumps, leveraging the parent company's expertise in coating and development[17] - In 2024, the company will implement a comprehensive cost-reduction and efficiency-improvement plan, with key operational indicators such as new orders, production output, contract acceptance, and sales collection being tracked and optimized[18] - The company's procurement plan is based on production order materials, R&D materials, after-sales service materials, demand planning, and safety stock requirements, with a focus on supplier management and quality assurance[190] - The company adopts a production model that primarily relies on existing orders, supplemented by pre-production for potential orders, to meet customized product design and manufacturing needs while managing inventory risks[190] Topic 6: Employee Incentives and Corporate Governance - The company has launched a new restricted stock incentive plan in August 2023, granting 1.26 million shares at 50 yuan per share to 160 core technical employees to drive long-term sustainable development[21] - The company's 2023 restricted stock incentive plan has a total confirmed share-based payment expense of 25.16 million yuan, with all company-level performance targets met[29] - The company completed the registration of 304,880 restricted shares for the third vesting period of the 2020 restricted stock incentive plan and 75,480 shares for the second batch of the second vesting period of the 2021 plan on October 30, 2023[31] - On December 7, 2023, the company registered 57,720 restricted shares for the third batch of the second vesting period of the 2021 restricted stock incentive plan[31] - The company proposed to grant 1.6 million restricted shares, accounting for 1.16% of the total share capital, with 1.28 million shares (0.93% of total share capital) for the initial grant and 320,000 shares (0.23% of total share capital) reserved[31] - On August 14, 2023, the company granted 1.26 million restricted shares to 160激励对象 at a grant price of 50.00元 per share[31] - The company implemented three restricted stock incentive plans from 2020 to 2023, covering 299人次 of management and core business骨干, with clear performance考核目标[49] - The company has established a robust intellectual property and trade secret protection system, recognizing these as critical assets for its technological advancement and growth[22] Topic 7: Environmental and Social Responsibility - The company actively fulfills environmental protection obligations, optimizing carbon emission digital management and reducing emissions through digital monitoring[41] - The company has established a comprehensive environmental protection system and employs certified "carbon traders" for carbon emission trading management[41] - The company uses chemicals such as photoresist, OK73, alcohol, and various acid-base药液 for product testing, with strict safety measures and professional disposal of waste chemicals[43] - The company emphasizes ESG (Environmental, Social, and Governance) work, integrating it into corporate culture to achieve high-quality development[41] Topic 8: Subsidiaries and Geographic Expansion - The company established a wholly-owned subsidiary, Shenyang Xinli Microelectronics Equipment Co., Ltd., in January 2024, focusing on the R&D and industrialization of 2.5D/3D advanced packaging products[34] - The company has set up subsidiaries in Japan, Guangzhou, and Shenyang to focus on core component development, high-end packaging R&D, and overseas resource expansion[179] - The company has established three production bases in Shenyang and Shanghai, with the Shanghai Lingang facility officially put into operation in March 2024[179] - The company's employee count increased from 880 to 1,118, with over 50% of R&D personnel holding master's degrees or higher[178] Topic 9: Dividend and Shareholder Returns - The company's cash dividend policy includes a distribution of 2 yuan per 10 shares and a capital reserve transfer of 4.5 shares per 10 shares, with a total cash dividend of 27.57 million yuan[26] - The company plans to distribute a cash dividend of 2 RMB per 10 shares and a capital reserve transfer of 4.5 shares per 10 shares[90] Topic 10: Industry Trends and Market Outlook - Chiplet technology has emerged as a key pathway to enhance integration and chip computing power as Moore's Law slows down[197] - Sales in the compound semiconductor and small-sized equipment segment declined due to lower market demand[121] - The global semiconductor equipment market is projected to see significant growth, with 300mm wafer fab equipment spending expected to exceed $100 billion in 2025 and reach a historic high of $137 billion by 2027[193]

证券代码：688037 证券简称：芯源微 公告编号：2024-019 沈阳芯源微电子设备股份有限公司 关于使用部分超募资金永久补充流动资金的公告 本公司董事会及全体董事保证公告内容不存在任何虚假记载、误导性陈述或 者重大遗漏，并对其内容的真实性、准确性和完整性依法承担法律责任。 重要内容提示： ● 沈阳芯源微电子设备股份有限公司（以下简称"公司"）于 2024 年 4 月 26 日召开第二届董事会第二十次会议及第二届监事会第十九次会议，审议通 过了《关于使用部分超募资金永久性补充流动资金的议案》，同意公司在保证募 集资金投资项目建设的资金需求和募集资金项目正常进行的前提下，为满足公司 流动资金需求，提高募集资金的使用效率，降低财务成本，进一步提升公司盈利 能力，维护上市公司和股东的利益，使用部分超募资金人民币 3,830 万元用于永 久补充流动资金。本次使用部分超募资金永久补充流动资金仅在与主营业务相关 的生产经营中使用；在本次超募资金永久补充流动资金后的 12 个月内，不进行 高风险投资或对外提供财务资助。 ● 公司保荐机构中国国际金融股份有限公司（以下简称"保荐机构"）对 本事项出具了同意的核查意见。 一 ...

证券代码：688037 证券简称：芯源微 公告编号：2024-015 沈阳芯源微电子设备股份有限公司 第二届董事会第二十次会议决议公告 本公司董事会及全体董事保证本公告内容不存在任何虚假记载、误导性陈述 或者重大遗漏，并对其内容的真实性、准确性和完整性依法承担法律责任。 一、董事会会议召开情况 沈阳芯源微电子设备股份有限公司（以下简称"公司"）于 2024 年 4 月 26 日在公司会议室以现场和通讯相结合的方式召开了第二届董事会第二十次会议 （以下简称"本次会议"）。本次会议的通知于 2024 年 4 月 16 日送达全体董事。 会议应出席董事 9 人，实际出席董事 9 人。会议的召集和召开程序符合有关法律、 行政法规、部门规章、规范性文件和公司章程的规定，会议决议合法、有效。 二、董事会会议审议情况 本次会议由董事长宗润福先生主持，经与会董事审议，形成决议如下： （一）审议通过《关于公司<2023年度董事会工作报告>的议案》 根据相关法律、法规、规范性文件、公司章程、《董事会议事规则》等规定， 公司董事会编制了《沈阳芯源微电子设备股份有限公司2023年度董事会工作报 告》。 表决结果：9票同意，0票反对， ...

沈阳芯源微电子设备股份有限公司 2023 年度独立董事述职报告 2023 年，作为沈阳芯源微电子设备股份有限公司（以下简称"公司"）的 独立董事，我严格按照《中华人民共和国公司法》《中华人民共和国证券法》《上 市公司治理准则》《上市公司独立董事管理办法》《上海证券交易所科创板股票 上市规则》《沈阳芯源微电子设备股份有限公司章程》（以下简称"《公司章程》"） 和《沈阳芯源微电子设备股份有限公司独立董事工作制度》（以下简称"《独立 董事工作制度》"）等有关规定和要求，诚信、勤勉、独立地履行职责，积极出 席相关会议，认真审议董事会各项议案，并对公司重大事项发表了独立意见，促 进了董事会规范运作和公司治理水平的提升，切实维护了公司整体利益和中小股 东合法权益。现将 2023 年度履职情况汇报如下： 一、独立董事基本情况 公司于 2022 年 3 月 30 日召开公司 2021 年年度股东大会，选举产生了公司 第二届董事会成员。公司董事会由 9 名董事组成，其中独立董事 3 人，不低于董 事会人数三分之一，符合相关法律法规及公司制度的规定。公司第二届董事会共 有 3 名独立董事成员，分别为朱煜先生、宋雷先生以及我本人。 ...

沈阳芯源微电子设备股份有限公司 董事会审计委员会 2023 年度履职报告 根据中国证监会《上市公司治理准则》《上海证券交易所上市公司自律监管 指引第 1 号——规范运作》《上海证券交易所科创板股票上市规则》等法律、法 规、规范性文件，以及《沈阳芯源微电子设备股份有限公司章程》（以下简称《公 司章程》）和《沈阳芯源微电子设备股份有限公司董事会审计委员会议事规则》 等有关规定，沈阳芯源微电子设备股份有限公司（以下简称"公司"）董事会审 计委员会本着勤勉尽责的原则，认真履行了审计监督职责。现将公司董事会审计 委员会 2023 年度履职情况汇报如下： 二、报告期内审计委员会召开会议情况 报告期内，公司董事会审计委员会共召开 4 次会议，全体委员均亲自出席了 全部会议，具体如下： | 召开日期 | 会议名称 | 会议内容 | | --- | --- | --- | | | | 1、《审计委员会 年度工作总结与 年度 2022 2023 工作计划》 | | 2023/4/17 | 第二届董事会 审计委员会第 | 2、《关于公司<2022 年年度报告>及摘要的议案》 3、《关于公司<2022 年财务决算报告>的议案》 | ...

● 是否需要提交股东大会审议：是 ● 日常关联交易对上市公司的影响：公司与关联方发生的日常关联交易遵 循公允、合理的原则，不存在损害公司及全体股东特别是中小股东利益的行为， 不会对关联方形成依赖，不会影响公司独立性。 一、日常关联交易基本情况 证券代码：688037 证券简称：芯源微 公告编号：2024-018 沈阳芯源微电子设备股份有限公司 关于预计 2024 年度日常关联交易额度的公告 本公司董事会及全体董事保证本公告内容不存在任何虚假记载、误导性陈述 或者重大遗漏，并对其内容的真实性、准确性和完整性依法承担法律责任。 重要内容提示： 本次公司预计与关联方发生日常关联交易金额不超过 5,200.00 万元，具体情 况如下： 注：本次预计的关联交易是对自本次股东大会审议通过之日起至 2024 年年 度股东大会召开之日止期间将要发生的日常关联交易的预计。 （三）前次关联交易的预计和执行情况 公司 2023 年年初至披露日实际关联交易发生金额总额为 1,047.28 万元，具 体情况如下： 单位：万元 关联 交易 类别 关联人 本次预 计金额 占同 类业 务比 例 （%） 本年年初至 披露日与关 联人累计已 发 ...

关于沈阳芯源微电子设备股份有限公司 非经营性资金占用及其他关联资金往来情况 汇总表的专项审计报告 目 录 1、 专项审计报告 2、 附表 委托单位：沈阳芯源微电子设备股份有限公司 审计单位：容诚会计师事务所（特殊普通合伙） 联系电话：024-86688037 非经营性资金占用及其他关联资金 往来情况专项说明 沈阳芯源微电子设备股份有限公司 容诚专字[2024]110Z0002 号 RSM 容诚 容诚会计师事务所(特殊普通合伙) 中国 · 北京 您可使用手机"扫一扫"减进入"在哪个在线体育在线进一直营平台（bapp/facebookigasco）"进行了 "这个是 关于沈阳芯源微电子设备股份有限公司 非经营性资金占用及其他关联资金往来情况专项说明 容诚专字[2024]110Z0002 号 沈阳芯源微电子设备股份有限公司全体股东: 我们接受委托,依据中国注册会计师审计准则审计了沈阳芯源微电子设备股 份有限公司(以下简称芯源微公司)2023年12月31日的合并及母公司资产负债 表,2023年度的合并及母公司利润表、合并及母公司现金流量表和合并及母公司 所有者权益变动表以及财务报表附注,并于 2024年 4 月 26 ...

本公司董事会及全体董事保证本公告内容不存在任何虚假记载、误导性陈述 或者重大遗漏，并对其内容的真实性、准确性和完整性依法承担法律责任。 重要内容提示 ● 分配比例：公司拟向全体股东每 10 股派发现金红利 2 元（含税）； ● 转增比例：公司拟以资本公积向全体股东每 10 股转增 4.5 股，不送红股； ●本次利润分配及资本公积金转增股本以实施权益分派股权登记日登记的 总股本扣除公司回购专用证券账户中股份为基数，具体日期将在权益分派实施公 告中明确； ● 在实施权益分派的股权登记日前公司应分配股数（总股本扣除公司回购 专用证券账户股份余额）发生变动的，公司拟维持每股分配比例不变，相应调整 分配总额；同时维持每股转增比例不变，调整转增股本总额，并将另行公告具体 调整情况； 证券代码：688037 证券简称：芯源微 公告编号：2024-022 沈阳芯源微电子设备股份有限公司 关于 2023 年年度利润分配及资本公积转增股本方案 的公告 本次利润分配预案尚需提交公司股东大会审议。 二、关于公司本年度现金分红比例低于 30%的情况说明 （一）公司所处行业情况及特点 ● 本年度现金分红比例低于 30%，是基于行业发展情 ...

沈阳芯源微电子设备股份有限公司 关于会计政策变更的公告 本公司董事会及全体董事保证公告内容不存在任何虚假记载、误导性陈述或 者重大遗漏，并对其内容的真实性、准确性和完整性依法承担法律责任。 重要内容提示 ● 本次会计政策变更是沈阳芯源微电子设备股份有限公司（以下简称"公 司"）根据中华人民共和国财政部（以下简称"财政部"）颁布的《企业会计准 则解释第 17 号》（财会[2023]21 号）（以下简称《准则解释第 17 号》）以及中 国证监会（以下简称"证监会"）发布《公开发行证券的公司信息披露解释性公 告第 1 号——非经常性损益（2023 年修订）》（证监会公告[2023]65 号）（以 下简称《解释性公告第 1 号》）对公司会计政策进行的变更和调整。 证券代码：688037 证券简称：芯源微 公告编号：2024-026 ● 本次会计政策变更不会对公司财务状况、经营成果、现金流量不会产生 重大影响，不存在损害公司及股东利益的情形。 由于上述会计准则解释的发布，公司需对会计政策进行相应变更。 （二）本次变更前采用的会计政策 本次会计政策变更前，公司执行财政部颁布的《企业会计准则——基本准则》 和各项具体会计准 ...

证券代码：688037 证券简称：芯源微 公告编号：2024-021 沈阳芯源微电子设备股份有限公司 关于变更公司注册资本、修订《公司章程》、修订及 制定部分内部治理制度的公告 本公司董事会及全体董事保证公告内容不存在任何虚假记载、误导性陈述或 者重大遗漏，并对其内容的真实性、准确性和完整性依法承担法律责任。 沈阳芯源微电子设备股份有限公司（以下简称"公司"）于 2024 年 4 月 26 日召开第二届董事会第二十次会议，审议通过了《关于变更注册资本、修订<公 司章程>并办理工商变更登记的议案》《关于修订及制定部分内部治理制度的议 案》，现将有关事项公告如下： 一、公司注册资本变更的相关情况 （一）2020 年、2021 年限制性股票激励计划归属 公司 2020 年限制性股票激励计划预留授予部分第二个归属期、2021 年限制 性股票激励计划首次授予部分第二个归属期第一批次、2021 年限制性股票激励 计划预留授予部分第一个归属期的归属条件已经成就，公司因本次限制性股票归 属新增的股份数量为 25.25 万股，其中 2020 年限制性股票激励计划预留授予部 分第二个归属期归属 6.75 万股，2021 年限制性 ...