债券代码：利扬转债 债券简称：118048 广东利扬芯片测试股份有限公司 向不特定对象发行可转换公司债券 第一次临时受托管理事务报告 （2025年度） （注册地址：广东省东莞市万江街道莫屋新丰东二路2号） 债券受托管理人 广发证券股份有限公司 （注册地址：广东省广州市黄埔区中新广州知识城腾飞一街2号618室） 二零二五年七月 重要声明 本报告依据《可转换公司债券管理办法》（以下简称"《管理办法》"）《广 东利扬芯片测试股份有限公司与广发证券股份有限公司关于广东利扬芯片测试 股份有限公司向不特定对象发行可转换公司债券之受托管理协议》（以下简称 "《受托管理协议》"）《广东利扬芯片测试股份有限公司向不特定对象发行可 转换公司债券募集说明书》（以下简称"《募集说明书》"）等相关公开信息披 露文件、第三方中介机构出具的专业意见等，由债券受托管理人广发证券股份有 限公司（以下简称"广发证券"）编制。广发证券对本报告中所包含的从上述文 件中引述内容和信息未进行独立验证，也不就该等引述内容和信息的真实性、准 确性和完整性做出任何保证或承担任何责任。 本报告不构成对投资者进行或不进行某项行为的推荐意见，投资者应对相关 事宜做 ...

Group 1 - The report by Aijimi highlights the growth of the semiconductor packaging and testing industry, projecting a total revenue of 87.056 billion yuan for listed companies in 2024, representing a year-on-year increase of 20.69% with a gross margin of approximately 15.67% [1] - The top three companies by total revenue in the packaging and testing sector are Changdian Technology (35.962 billion yuan), Tongfu Microelectronics (23.882 billion yuan), and Huatian Technology (14.462 billion yuan) [1] - The report indicates that the R&D expenditure as a percentage of revenue is highest for Liyang Chip (15.95%), Jingfang Technology (14.12%), and Weicai Technology (13.22%) [1] Group 2 - The advanced packaging market is expected to generate total revenue of $51.9 billion in 2024, with a year-on-year growth of 10.9%, and is projected to reach $78.6 billion by 2028, with a compound annual growth rate (CAGR) of 10.05% from 2022 to 2028 [2] - The global semiconductor packaging market is forecasted to grow from $65.04 billion in 2020 to $118.6 billion in 2027, with a CAGR of 6.6%, while advanced packaging is expected to surpass traditional packaging in market size by 2027 [2] Group 3 - The domestic packaging and testing industry is performing well, with Chinese companies leading in brand strength, diverse teams, international operations, technical capabilities, quality assurance, production scale, and operational efficiency [3] - In 2023, capital expenditure in the advanced packaging sector reached $9.9 billion, primarily from major semiconductor companies and leading OSAT firms, with an expected increase to $11.5 billion in 2024 [3] - The report emphasizes that the growth of the semiconductor packaging market is driven by emerging technologies such as AI, IoT, cloud computing, and big data, which are increasing the demand for chips [3] Group 4 - The global Chiplet market is projected to grow from approximately $3.1 billion in 2023 to around $107 billion by 2033, with a CAGR of 42.5% from 2024 to 2033 [4] - Companies like Intel and TSMC have mature Chiplet technologies, while domestic firms such as Changdian Technology and Tongfu Microelectronics are also advancing in this area [4] - The 2.5D/3D packaging market is expected to expand from $9.4 billion in 2022 to $22.5 billion by 2028, with a CAGR of 15.6%, driven by high-performance computing and AI technologies [4]

Group 1 - The semiconductor sector in the A-share market is experiencing a downturn, with notable declines in stocks such as Xin Heng Hui, which fell over 3% [1] - Other companies in the semiconductor industry, including Dawei Co., Yuanjie Technology, Liyang Chip, Langke Technology, and Huahong Company, are also witnessing declines [1] - Former President Trump has indicated plans to announce tariff measures on semiconductors, which may impact the market further [1]

证券代码：688135 证券简称：利扬芯片 公告编号：2025-036 转债代码：118048 转债简称：利扬转债 广东利扬芯片测试股份有限公司 本公司董事会及全体董事保证本公告内容不存在任何虚假记载、误导性陈述 或者重大遗漏，并对其内容的真实性、准确性和完整性承担法律责任。 重要内容提示： ? 证券停复牌情况：适用 因可转债转股价格调整,本公司的相关证券停复牌情况如下： 停牌期 停牌终止 证券代码 证券简称 停复牌类型 停牌起始日 复牌日 间 日 ? 调整前转股价格：16.13 元/股 ? 调整后转股价格：16.12 元/股 ? 转股价格调整实施日期：2025 年 7 月 9 日 一、转股价格调整依据 广东利扬芯片测试股份有限公司（以下简称"公司"）已于 2025 年 7 月 4 日 完成了 2021 年限制性股票激励计划首次授予部分第三个归属期的股份登记手续， 公司总股本 202,434,834 股增加至 203,008,275 股，具体内容详见公司于同日在 上海证券交易所网站（www.sse.com.cn）披露的《关于 2021 年限制性股票激励计 划首次授予部分第三个归属期归属结果暨股份上市的公告》 ...

证券代码：688135 证券简称：利扬芯片 公告编号：2025-035 转债代码：118048 转债简称：利扬转债 广东利扬芯片测试股份有限公司 关于 2021 年限制性股票激励计划首次授予部分第三个 归属期归属结果暨股份上市公告 本公司董事会及全体董事保证本公告内容不存在任何虚假记载、误导性陈述 或者重大遗漏，并对其内容的真实性、准确性和完整性依法承担法律责任。 重要内容提示： ? 本次股票上市类型为股权激励股份；股票认购方式为网下，上市股数为 本次股票上市流通总数为573,441股。 ? 本次股票上市流通日期为2025 年 7 月 11 日。 根据中国证券监督管理委员会、上海证券交易所、中国证券登记结算有限责 任公司上海分公司有关业务规则的规定，广东利扬芯片测试股份有限公司（以下 简称"公司"）于近日收到中国证券登记结算有限责任公司上海分公司出具的《证 券变更登记证明》，公司已完成 2021 年限制性股票激励计划（以下简称"本激励 计划"）首次授予部分第三个归属期的股份登记工作。现将有关情况公告如下： 一、本次限制性股票归属的决策程序及相关信息披露 （1）2021 年 5 月 17 日，公司召开第二届董事 ...

重要内容提示： 本次股票上市类型为股权激励股份；股票认购方式为网下，上市股数为 573,441股。 证券代码：688135 证券简称：利扬芯片 公告编号：2025-035 转债代码：118048 转债简称：利扬转债 广东利扬芯片测试股份有限公司 关于 2021 年限制性股票激励计划首次授予部分第三个 归属期归属结果暨股份上市公告 本公司董事会及全体董事保证本公告内容不存在任何虚假记载、误导性陈述 或者重大遗漏，并对其内容的真实性、准确性和完整性依法承担法律责任。 本次股票上市流通总数为573,441股。 本次股票上市流通日期为2025 年 7 月 11 日。 根据中国证券监督管理委员会、上海证券交易所、中国证券登记结算有限责 任公司上海分公司有关业务规则的规定，广东利扬芯片测试股份有限公司（以下 简称"公司"）于近日收到中国证券登记结算有限责任公司上海分公司出具的《证 券变更登记证明》，公司已完成 2021 年限制性股票激励计划（以下简称"本激励 计划"）首次授予部分第三个归属期的股份登记工作。现将有关情况公告如下： 一、本次限制性股票归属的决策程序及相关信息披露 （1）2021 年 5 月 17 日，公司召 ...

| 证券代码：688135 | 证券简称：利扬芯片 公告编号：2025-036 | | --- | --- | | 转债代码：118048 | 转债简称：利扬转债 | 广东利扬芯片测试股份有限公司 关于"利扬转债"转股价格调整暨转股停复牌的公告 本公司董事会及全体董事保证本公告内容不存在任何虚假记载、误导性陈述 或者重大遗漏，并对其内容的真实性、准确性和完整性承担法律责任。 重要内容提示： 证券停复牌情况：适用 因可转债转股价格调整,本公司的相关证券停复牌情况如下： | 证券代码 | 证券简称 | 停复牌类型 | 停牌起始日 | 停牌期 | 停牌终止 | 复牌日 | | --- | --- | --- | --- | --- | --- | --- | | | | | | 间 | 日 | | | 118048 | 利扬转债 | 可转债转股停牌 | 2025/7/8 | 全天 | 2025/7/8 | 2025/7/9 | 一、转股价格调整依据 广东利扬芯片测试股份有限公司（以下简称"公司"）已于 2025 年 7 月 4 日 完成了 2021 年限制性股票激励计划首次授予部分第三个归属期的股份登记手续， 公司 ...

Core Insights - The rapid development of technologies such as 5G, AI, big data, and intelligent driving is driving the demand for smart equipment in mining companies, with autonomous mining trucks emerging as a significant opportunity in the market [1] - China has become the first country to deploy over 1,000 autonomous mining trucks, with more than 2,500 units operational in over 50 open-pit coal mines by the end of 2024, capturing over 65% of the global market share [1] - Despite advancements, challenges remain in the field, including reliance on imported high-precision sensors, the need for improved intelligent algorithms, and difficulties in adapting to complex environments [1] Group 1: Technological Breakthroughs - The TerraSight chip, developed by Dieling Optoelectronics and Liyang Chip, enables the world's first truly all-weather autonomous mining truck solution, demonstrating effective obstacle detection in complex scenarios such as smoke and glare [5][10] - The chip's capabilities include strong penetration in adverse weather conditions, providing a significant advantage over traditional sensors that struggle in low visibility environments [12][13] - The chip's dynamic range reaches an impressive 240dB, with a sensitivity of 0.0000001LUX, allowing it to operate effectively in near-dark conditions [15] Group 2: Market Potential and Future Developments - The demand for autonomous mining trucks is strong, with potential market size in the hundreds of billions, especially as traditional solutions have limitations that hinder adoption [20] - The collaboration between Dieling Optoelectronics and Liyang Chip is expected to expand beyond mining applications to consumer products, indicating a broad market potential for the technology [18] - The autonomous mining truck's successful demonstrations have positioned China at the forefront of the global market, with expectations for further breakthroughs in various operational scenarios [22][24]

| 证券代码：688135 | 证券简称：利扬芯片 | 公告编号：2025-034 | | --- | --- | --- | | 转债代码：118048 | 转债简称：利扬转债 | | 广东利扬芯片测试股份有限公司 可转债转股结果暨股份变动公告 本公司董事会及全体董事保证公告内容不存在虚假记载、误导性陈述或者重 大遗漏，并对其内容的真实性、准确性和完整性承担个别及连带法律责任。 经上海证券交易所自律监管决定书〔2024〕94 号文同意，公司本次可转换 公司债券于 2024 年 7 月 19 日起在上海证券交易所挂牌交易，债券简称为"利扬 转债"，债券代码为"118048"。 根据相关法律法规和《广东利扬芯片测试股份有限公司向不特定对象发行可 转换公司债券募集说明书》（以下简称"《募集说明书》"）的约定，"利扬转 债"初始转股价格为 16.13 元/股，转股期自可转债发行结束之日（2024 年 7 月 1 累计转股情况：截至 2025 年 6 月 30 日，累计共有人民币 34,290,000 元"利 扬转债"已转换为公司股票，累计转股数量为2,125,694股，占"利扬转债" 转股前公司已发行股份总额的 1 ...

Summary of Key Points Core Viewpoint - The announcement details the interest payment schedule for the convertible bonds issued by Guangdong Liyang Chip Testing Co., Ltd., including key dates and interest rates for the bondholders [1][2][3]. Group 1: Convertible Bond Issuance - The company issued 5.2 million convertible bonds with a face value of RMB 100 each, raising a total of RMB 520 million [1]. - The bonds have a term starting from the issuance date, with interest rates increasing from 0.2% in the first year to 2.5% in the sixth year [1][2]. Group 2: Interest Payment Details - The interest payment period for the first year is from July 2, 2024, to July 1, 2025, with an annual interest rate of 0.20% [4][5]. - The interest payment will be made on July 2, 2025, with the record date for bondholders set for July 1, 2025 [3][4]. Group 3: Tax Implications - Individual investors are subject to a 20% tax on interest income, resulting in a net interest payment of RMB 0.16 per bond after tax [5]. - Non-resident enterprises are exempt from corporate income tax on the interest income from these bonds until December 31, 2025 [5]. Group 4: Contact Information - The company and its underwriting institution, GF Securities Co., Ltd., have provided contact details for further inquiries regarding the bonds [6][7].