Core Viewpoint - Guangdong Liyang Chip Testing Co., Ltd. has announced that its convertible bonds, "Liyang Convertible Bonds," are expected to meet the redemption conditions based on stock price performance [1][2]. Group 1: Convertible Bond Issuance and Trading - The company has been approved by the China Securities Regulatory Commission to issue convertible bonds totaling RMB 520 million, with a term of 6 years [2][3]. - The bonds have been listed and traded on the Shanghai Stock Exchange since July 19, 2024, under the code "118048" [3]. Group 2: Conversion Price and Adjustments - The initial conversion price for the bonds was set at RMB 16.13 per share, which will be adjusted to RMB 16.12 per share starting July 9, 2025, due to an increase in the company's total share capital [4]. Group 3: Redemption Conditions - The company may redeem the bonds if, during a specified period, the stock price remains at or above 130% of the conversion price for a certain number of trading days [6][8]. - The redemption price will be at the face value plus accrued interest, with specific conditions outlined in the bond issuance prospectus [6][7].

Summary of Key Points Core Viewpoint - Guangdong Liyang Chip Testing Co., Ltd. has announced the potential conditional redemption of its convertible bonds if certain stock price conditions are met, indicating a strategic financial maneuver to manage its debt obligations and capital structure [1][2]. Group 1: Convertible Bond Issuance - The company has been authorized by the China Securities Regulatory Commission to issue convertible bonds totaling RMB 520 million, with a maturity of 6 years [1]. - The convertible bonds, named "Liyang Convertible Bonds" with code "118048," began trading on July 19, 2024 [2]. - The initial conversion price for the bonds was set at RMB 16.13 per share, which has been adjusted to RMB 16.12 per share following a stock incentive plan [2][4]. Group 2: Redemption Conditions - The company may redeem the convertible bonds if, during the conversion period, the stock price remains at or above 130% of the conversion price for at least 5 out of 12 consecutive trading days [1][4]. - As of the announcement, the stock price has already met the condition for 10 trading days, indicating a strong likelihood of triggering the redemption clause [4]. - The redemption will be executed at the bond's face value plus accrued interest, should the conditions be satisfied [3][4]. Group 3: Interest Calculation - The accrued interest for the bonds is calculated based on the formula: IA = B × i × t / 365, where IA is the accrued interest, B is the total face value of the bonds held, i is the annual coupon rate, and t is the number of days since the last interest payment [3].

（编辑 任世碧） 证券日报网讯 7月30日晚间，利扬芯片发布公告称，公司股票自2025年7月7日至2025年7月30日已有10 个交易日的收盘价不低于当期转股价格的130%（即20.956元/股），若未来连续12个交易日内，公司股 票有5个交易日的收盘价格不低于当期转股价的130%（含130%），将触发《广东利扬芯片测试股份有 限公司向不特定对象发行可转换公司债券募集说明书》中规定的有条件赎回条款。若触发条件，公司有 权决定是否按照债券面值加当期应计利息的价格赎回全部或部分未转股的"利扬转债"。 ...

| 证券代码：688135 | 证券简称：利扬芯片 | 公告编号：2025-038 | | --- | --- | --- | | 转债代码：118048 | 转债简称：利扬转债 | | 广东利扬芯片测试股份有限公司 （一）可转债发行上市情况 根据中国证券监督管理委员会（以下简称"中国证监会"）出具的《关于同 意广东利扬芯片测试股份有限公司向不特定对象发行可转换公司债券注册的批 复》（证监许可〔2024〕266 号），广东利扬芯片测试股份有限公司（以下简称 "公司"）获准向不特定对象发行面值总额为人民币 52,000.00 万元的可转换公 司债券，期限 6 年。 经上海证券交易所自律监管决定书〔2024〕94 号文同意，公司本次发行的 可转换公司债券已于 2024 年 7 月 19 日起在上海证券交易所挂牌交易，债券简称 为"利扬转债"、转债代码"118048"。 根据有关规定和《广东利扬芯片测试股份有限公司向不特定对象发行可转换 公司债券募集说明书》（以下简称"《募集说明书》"）的约定，公司本次发行 1 关于"利扬转债"预计满足赎回条件的提示性公告 本公司董事会及全体董事保证本公告内容不存在任何虚假记载、误 ...

Core Viewpoint - Liyang Chip (688135) has experienced a price increase of 3.59% this week, closing at 21.64 yuan, with a total market capitalization of 4.393 billion yuan [1] Company Announcements Summary - The company has been approved to issue 5.2 million convertible bonds, with a total fundraising amount of 520 million yuan, maturing in 6 years [1] - The initial conversion price for the bonds is set at 16.13 yuan per share, adjusted to 16.12 yuan as of July 9, 2025 [1] - The company's 2024 operating revenue is projected to be 488 million yuan, reflecting a year-on-year decline of 2.98%, while net profit is expected to be -59 million yuan, a significant drop of 336% [1][3] - Total assets have increased by 24.84% year-on-year, reaching 2.593 billion yuan, while total debt has surged by 76.98% to 1.276 billion yuan [1][3] - The company maintains a stable credit rating outlook with a credit rating of "A+" for both the company and its convertible bonds [1][3]

Group 1 - The company's previous credit rating was "A+" with a stable outlook for both the company and the convertible bond "Liyang Convertible Bond" [1][2] - The current credit rating remains "A+" with a stable outlook, as assessed by the credit rating agency Zhongzheng Pengyuan on July 24, 2025 [2] - The credit rating report has been disclosed on the Shanghai Stock Exchange website [2]

Core Viewpoint - The credit rating report for Guangdong Liyang Chip Testing Co., Ltd. maintains a stable outlook, reflecting the company's capacity expansion and good cash flow performance, despite facing competitive pressures and potential risks related to debt and imported equipment reliance [4][7][9]. Company Overview - Guangdong Liyang Chip Testing Co., Ltd. is an independent third-party integrated circuit testing service provider, focusing on chip testing solution development, wafer testing services, and finished chip testing services [11]. - The company has established a good cooperative relationship with well-known clients in the integrated circuit design sector, including companies like Goodix Technology and Allwinner Technology [15][19]. Financial Performance - The company's total revenue for 2024 was 4.88 billion yuan, a decrease from 5.03 billion yuan in 2023, with a significant drop in gross profit margin from 30.33% to 20.90% [5][15]. - Operating cash flow showed a net inflow of 2.04 billion yuan in 2024, indicating improved cash flow performance compared to previous years [7][8]. - The company's total debt increased to 12.36 billion yuan in 2025, up from 7.21 billion yuan in 2023, reflecting rapid growth in debt levels [5][22]. Industry Environment - The integrated circuit testing industry is experiencing structural growth, with the global semiconductor market expected to reach $620.2 billion in 2024, a 17% increase year-on-year [12]. - The domestic independent testing market is still in its early stages, with significant potential for growth as high-end testing demands increase [13][14]. Competitive Landscape - The industry faces intense competition, with many players expanding their testing capabilities, which may pressure the company's market position [7][9]. - The company is expanding its testing capacity and diversifying its service offerings, including investments in wafer dicing and other related services [16][18]. Future Outlook - The company has a stable credit rating outlook, supported by its accumulated testing platforms and quality customer resources, indicating good business sustainability [9][10]. - However, the company must navigate challenges related to capacity utilization and potential financial leverage increases due to ongoing capital investments [22][23].

| 证券代码：688135 | 证券简称：利扬芯片 | 公告编号：2025-037 | | --- | --- | --- | | 转债代码：118048 | 转债简称：利扬转债 | | 广东利扬芯片测试股份有限公司 关于"利扬转债"跟踪信用评级结果的公告 本公司董事会及全体董事保证公告内容不存在虚假记载、误导性陈述或者重 大遗漏，并对其内容的真实性、准确性和完整性承担个别及连带法律责任。 评级报告》已于同日在上海证券交易所网站（www.sse.com.cn）披露。 特此公告。 本次信用评级报告《广东利扬芯片测试股份有限公司相关债券 2025 年跟踪 1 前次债券评级：公司主体信用等级为"A+"，评级展望为"稳定"，"利 扬转债"的信用等级为"A+"。 本次债券评级：公司主体信用等级为"A+"，评级展望为"稳定"，"利 扬转债"的信用等级为"A+"。 据《上市公司证券发行注册管理办法（2025 年修正）》《上海证券交易所 科创板股票上市规则》等有关规定，广东利扬芯片测试股份有限公司（以下简称 "公司"）委托信用评级机构中证鹏元资信评估股份有限公司（以下简称"中证 鹏元"）对公司主体及公司向不特定对象发行的可转 ...

广东利扬芯片测试股份有限公司 相关债券 2025 年跟踪评级报告 中鹏信评【2025】跟踪第【945】号 01 信用评级报告声明 除因本次评级事项本评级机构与评级对象构成委托关系外，本评级机构及评级从业人员与评级对象不存 在任何足以影响评级行为独立、客观、公正的关联关系。 本评级报告版权归本评级机构所有，未经授权不得修改、复制、转载和出售。除委托评级合同约定外， 未经本评级机构书面同意，本评级报告及评级结论不得用于其他债券的发行等证券业务活动或其他用途。 中证鹏元资信评估股份有限公司 本评级机构与评级从业人员已履行尽职调查义务，有充分理由保证所出具的评级报告遵循了真实、客观、 公正原则，但不对评级对象及其相关方提供或已正式对外公布信息的合法性、真实性、准确性和完整性 作任何保证。 本评级机构依据内部信用评级标准和工作程序对评级结果作出独立判断，不受任何组织或个人的影响。 本评级报告观点仅为本评级机构对评级对象信用状况的个体意见，不作为购买、出售、持有任何证券的 建议。本评级机构不对任何机构或个人因使用本评级报告及评级结果而导致的任何损失负责。 本次评级结果自本评级报告所注明日期起生效，有效期为被评证券的存续期 ...

Core Points - Guangdong Liyang Chip Testing Co., Ltd. has been approved to issue convertible bonds totaling 520,000 units, each with a face value of RMB 100, raising a total of RMB 52 million [2][4] - The bonds have a maturity period of 6 years, from July 2, 2024, to July 1, 2030 [7] - The initial conversion price for the bonds is set at RMB 16.13 per share, subject to adjustments based on various corporate actions [18] Summary by Sections Approval and Issuance - The issuance of convertible bonds has been approved by the China Securities Regulatory Commission, allowing the company to raise funds through the issuance of 520,000 convertible bonds [2] - The total amount raised from this issuance is RMB 52 million, with each bond having a face value of RMB 100 [4] Bond Characteristics - The bonds are classified as convertible corporate bonds, with a total issuance amount of RMB 52 million [4][3] - The bonds will pay interest annually, with rates starting at 0.2% in the first year and increasing to 1.5% by the fourth year [7] Conversion and Adjustment Mechanism - The conversion period for the bonds begins six months after issuance and lasts until maturity [8] - The conversion price can be adjusted based on corporate actions such as stock dividends, capital increases, and cash dividends [9][18] - The adjusted conversion price is calculated using specific formulas to ensure fair treatment of bondholders [9][18] Redemption and Buyback Provisions - The company has the right to redeem the bonds at face value plus accrued interest under certain conditions, such as if the stock price exceeds 130% of the conversion price for a specified period [12][14] - Bondholders have the right to sell back their bonds to the company if the stock price falls below 70% of the conversion price during the last two interest years [14][15] Credit Rating and Management - The bonds are not secured by any collateral, and the credit rating is provided by China Chengxin International Credit Rating Co., Ltd. [15] - The bond management is overseen by GF Securities Co., Ltd., which will monitor the company's compliance with bondholder interests [18]