证券代码：688135 证券简称：利扬芯片 公告编号：2026-001 证券代码：118048 转债简称：利扬转债 广东利扬芯片测试股份有限公司 第四届董事会第十五次会议决议公告 本公司董事会及全体董事保证公告内容不存在虚假记载、误导性陈述或者重大遗漏，并对其内容的真实 性、准确性和完整性承担个别及连带法律责任。 一、董事会会议召开情况 广东利扬芯片测试股份有限公司（以下简称"公司"）第四届董事会第十五次会议于2025年12月30日在公 司会议室以现场结合通讯方式召开，本次会议的通知已于会议前通过电子邮件形式送达全体董事。本次 会议由黄江先生主持，会议应到董事9人，实际到会董事9人。 本次会议的召集、召开和表决程序符合《中华人民共和国公司法》《上海证券交易所科创板股票上市规 则》等相关法律、行政法规、规范性文件及《公司章程》的有关规定，会议合法、有效。 二、董事会会议审议情况 本次会议经全体董事表决，形成决议如下： 1、审议通过《关于2026年度日常关联交易预计的议案》 本议案在提交董事会前已经董事会审计委员会、独立董事专门会议审议通过，并同意提交公司董事会审 议。 表决情况：同意9票；反对0票；弃权0票； ...

Core Viewpoint - The investment by拓荆科技 in芯丰精密 aims to strengthen the company's strategic layout and industrial synergy in the 3D integration and advanced packaging sectors [1][3]. Investment Details -拓荆科技 plans to acquire a stake in芯丰精密 for no more than RMB 270 million, which represents 16.4154% of the company's registered capital post-financing [1]. - The associated party,丰泉创投, will invest RMB 30 million for a 1.8239% stake [1]. - The total registered capital of芯丰精密 will increase from RMB 57,891,044 to RMB 60,819,616 after the financing round [3]. Company Profile -芯丰精密 specializes in the research and manufacturing of core equipment and materials for 3D integration and advanced packaging [3]. - The company has developed capabilities in core software and components, with a product line that includes thinning, dicing, and slicing equipment, as well as advanced bonding equipment [3]. -芯丰精密's products have been successfully applied in advanced storage and image sensor fields [3]. Strategic Importance - The investment is seen as a strategic move to enhance the technological synergy in the high-tech semiconductor equipment market [4]. - As the semiconductor industry evolves towards 3D integration and advanced packaging, the demand for core equipment is increasing, highlighting the strategic value of such investments [4].

Core Viewpoint - The company,拓荆科技, plans to invest in 宁波芯丰精密科技有限公司 through an associated entity, 丰泉创业投资, indicating a strategic move to enhance its industrial layout and synergy in the semiconductor equipment sector [1][4]. Investment Details - 拓荆科技 intends to acquire 998.38 million yuan of registered capital from 芯丰精密 for no more than 270 million yuan, representing 16.42% of the post-financing registered capital [1]. - 丰泉创投 will invest 30 million yuan for 110.93 million yuan of registered capital, accounting for 1.82% of the post-financing registered capital [1]. - The total capital increase for 芯丰精密 from various investors, including 拓荆科技 and 丰泉创投, amounts to 99 million yuan, raising the registered capital from 57.89 million yuan to 60.82 million yuan [3]. Company Profile - 芯丰精密 specializes in the research and production of thinning, dicing, and slicing equipment and consumables, primarily used in 3D IC and advanced packaging processes [3]. - The company has core software and component R&D and manufacturing capabilities [3]. Financial Performance - As of mid-2025, 芯丰精密's total assets and net assets are projected to be 388 million yuan and -82.86 million yuan, respectively [3]. - Revenue for 2024 and the first half of 2025 is expected to be 56.35 million yuan and 15.87 million yuan, with net losses of 30.88 million yuan and 7.19 million yuan [3]. Valuation - The pre-investment valuation for 芯丰精密's capital increase is set at 1.8 billion yuan, while the valuation for the share transfer is 1.566 billion yuan due to the lack of special shareholder rights [3]. Strategic Intent - 拓荆科技 aims to strengthen its position in the semiconductor equipment industry through this investment, enhancing its product offerings in the 3D integration field [4]. - The company has successfully developed advanced bonding equipment and related detection devices, which are now in mass production [5]. Financial Growth - In the first three quarters of the year, 拓荆科技 reported revenues of 4.22 billion yuan, a year-on-year increase of 85.27%, and a net profit of 557 million yuan, up 105.14% [5]. - The company plans to raise up to 4.6 billion yuan through a private placement to expand high-end semiconductor equipment capacity and fund cutting-edge technology projects [5].

登录新浪财经APP 搜索【信披】查看更多考评等级 ● 投资标的名称：宁波芯丰精密科技有限公司（以下简称"芯丰精密"）。 ● 本次对外投资概述：拓荆科技股份有限公司（以下简称"公司"）拟与关联方丰泉创业投资（张家港） 合伙企业（有限合伙）（以下简称"丰泉创投"）共同投资芯丰精密，其中，公司拟以不超过人民币 270,000,001元受让芯丰精密原股东持有的9,983,765元注册资本，占芯丰精密本轮融资后注册资本的比例 为16.4154%；丰泉创投拟以人民币30,000,000元受让芯丰精密原股东持有的1,109,307元注册资本，占芯 丰精密本轮融资后注册资本的比例为1.8239%。 ● 本次交易涉及与关联方丰泉创投共同投资，构成关联交易，但不构成《上市公司重大资产重组管理办 法》规定的重大资产重组。 ● 本次交易实施不存在重大法律障碍。 ● 本次交易事项已经公司第二届董事会第二十一次会议审议通过，关联董事吕光泉先生和刘静女士已回 避表决，本事项尚需提交公司股东会审议。 证券代码：688072 证券简称：拓荆科技 公告编号：2025-085 拓荆科技股份有限公司关于与 关联方共同投资暨关联交易的公告 本公司董事 ...

Core Viewpoint - The company,拓荆科技, plans to invest in 宁波芯丰精密科技有限公司, acquiring a 16.4154% stake through a capital transfer of up to 270 million yuan [1] Investment Details - The company will acquire 998.38 million yuan of registered capital from the original shareholders of 芯丰精密 [1] - The investment is part of a financing round for 芯丰精密, which focuses on developing and manufacturing equipment and consumables for 3D integration and advanced packaging processes [1] Company Profile - 芯丰精密 specializes in the research and production of thinning, dicing, and cutting equipment, as well as consumables for advanced packaging [1] - The company possesses independent research and manufacturing capabilities for core software and components [1]

Core Viewpoint - The 2025 High-Quality Development Forum for Listed Companies and the 27th Golden Bull Award Ceremony recognized Huahai Qingke for its continuous innovation and contributions in the high-end semiconductor equipment sector, highlighting the market's acknowledgment of the company's practices in new productivity and high-quality development [1][2]. Group 1: Company Achievements - Huahai Qingke won the "2024 New Quality Enterprise Golden Bull Award," marking its second consecutive year receiving this recognition, which reflects its excellence in technological innovation and sustainable development [1]. - The Golden Bull Award, established in 1999, aims to create a credible platform for listed companies in China's capital market, emphasizing rigorous and transparent evaluation processes [1]. Group 2: Business Strategy and Future Plans - As a high-end semiconductor equipment company listed on the Sci-Tech Innovation Board, Huahai Qingke has developed a platform-based strategy that integrates "equipment + services," covering key products such as Chemical Mechanical Polishing (CMP), ion implantation, thinning, cutting, edge polishing, and wet processes [2]. - The company has established a proprietary solution system with independent intellectual property rights, showcasing its strong technological advantages and reliable product series, which enhance its competitiveness and market influence [2]. - Looking ahead, Huahai Qingke plans to increase R&D investment, continue launching advanced semiconductor equipment and integrated process solutions, and collaborate with industry partners to promote the improvement and upgrading of the semiconductor industry ecosystem [2].

Group 1 - The company, Huahai Qingsi, is in discussions with relevant intermediaries regarding the specific progress of its H-share listing, with details yet to be confirmed. The success of the listing is uncertain due to the need for approval, filing, and review processes [3] - Huahai Qingsi primarily engages in the research, production, sales, and technical services of semiconductor equipment, generating revenue through sales to downstream integrated circuit manufacturers and research institutions, as well as providing key consumables, maintenance, upgrades, and wafer regeneration services [3] Group 2 - For the first half of the year, the company reported operating revenue of approximately 1.95 billion, an increase from 1.50 billion in the same period last year [4] - The total profit for the same period was approximately 549.78 million, compared to 492.40 million in the previous year [4] - The net profit attributable to shareholders was approximately 505.43 million, up from 432.65 million year-on-year [4] - The net cash flow from operating activities was approximately 394.97 million, compared to 372.02 million in the previous year [4] - As of the end of the reporting period, the net assets attributable to shareholders were approximately 6.99 billion, an increase from 6.47 billion at the end of the previous year [4] - The total assets amounted to approximately 12.25 billion, compared to 11.75 billion at the end of the previous year [4] - The company was listed on the Shanghai Stock Exchange's Sci-Tech Innovation Board on June 8, 2022, with a current share price of 126.04, resulting in a market capitalization of approximately 44.53 billion [4]