本公司董事会及全体董事保证本公告内容不存在任何虚假记载、误导性陈述 或者重大遗漏，并对其内容的真实性、准确性和完整性承担法律责任。 证券代码：688233 证券简称：神工股份 公告编号：2024-028 锦州神工半导体股份有限公司 关于以集中竞价交易方式回购公司股份的进展公告 截至 2024 年 6 月 28 日，公司通过上海证券交易所交易系统以集中竞价交易 方式累计回购公司股份 950,416 股，占公司总股本 170,305,736 股的比例为 0.5579%， 回购成交最高价为 35.12 元/股，最低价为 14.70 元/股，支付的资金总额为人民币 28,595,409.90 元（不含印花税、交易佣金等交易费用）。 重要内容提示： | 回购方案首次披露日 | 2023/8/18，由董事长潘连胜先生提议 | | --- | --- | | 回购方案实施期限 | 待第二届董事会第十五次会议审议通过后 个月 12 | | 预计回购金额 | 1,500.00 万元~3,000.00 万元 | | 回购用途 | 用于员工持股计划或股权激励 | | 累计已回购股数 | 股 950,416 | | 累计已回购股数占 ...

本公司董事会及全体董事保证本公告内容不存在任何虚假记载、误导性陈述 或者重大遗漏，并对其内容的真实性、准确性和完整性承担法律责任。 重要内容提示： 证券代码：688233 证券简称：神工股份 公告编号：2024-027 锦州神工半导体股份有限公司 关于以集中竞价交易方式回购公司股份的进展公告 根据《上市公司股份回购规则》《上海证券交易所上市公司自律监管指引第 7 号——回购股份》的相关规定，现将公司回购股份的进展情况公告如下： 截至 2024 年 5 月 31 日，公司通过上海证券交易所交易系统以集中竞价交易 方式累计回购公司股份 950,416 股，占公司总股本 170,305,736 股的比例为 0.5579%， 回购成交最高价为 35.12 元/股，最低价为 14.70 元/股，支付的资金总额为人民币 28,595,409.90 元（不含印花税、交易佣金等交易费用）。 本次回购股份符合法律法规及公司回购股份方案的规定。 | 回购方案首次披露日 | 2023/8/18，由董事长潘连胜先生提议 | | --- | --- | | 回购方案实施期限 | 待第二届董事会第十五次会议审议通过后 个月 12 | | ...

容诚会计师事务所(特殊普通合伙) 关于对锦州神工半导体股份有限公司 2023 年年度报告的信息披露监管问询函的回复 上海证券交易所: 贵所于 2024年 4 月 16 目出具的《关于对锦州神工半导体股份有限公司 2023 年年度报告的信息披露监管问询函》(上证科创公函[2024]0062 号,以下简称"《问 询函》"）已收悉。容诚会计师事务所(特殊普通合伙)作为锦州神工半导体股 份有限公司（以下简称"神工股份"、"公司"）的年审会计师,对问询函涉及 会计师的相关问题进行了逐项核查,现回复如下,请予以审核。 第一部分 关于经营情况 问题 1、关于营业收入 年报显示,公司 2023 年实现营业收入 13,503.32 万元,同比下降 74.96%。 其中,大直径硅材料营业收入 8,354.66 万元,同比下降 82.45%。营业收入各季 度波动较大,第四季度实现营业收入 1.585.32 万元,环比下降 60.71%,占全年 营业收入比例由上年同期 27.53%下降至 11.74%。 请公司:(1)补充披露大直径硅材料产品前五大客户及主要交易产品、交 易数量、交易金额和平均交易价格,并按客户说明与上一年度发生重大 ...

Financial Performance - In 2023, the company faced a net loss of RMB -69.11 million, marking its first loss since establishment[14]. - The company's operating revenue for 2023 was ¥135,033,152.23, a decrease of 74.96% compared to ¥539,236,503.68 in 2022[31]. - Revenue excluding non-main business income was ¥129,443,827.09, down 74.25% from ¥502,659,382.34 in the previous year[31]. - The net profit attributable to shareholders of the listed company was -69.11 million yuan in 2023, a decrease of 143.70% year-on-year, mainly due to the downturn in the semiconductor industry and a substantial decline in revenue from large-diameter silicon materials[34]. - The net cash flow from operating activities decreased by 36.83% year-on-year, primarily due to reduced revenue leading to lower customer payments[34]. - Basic and diluted earnings per share were both -0.43 yuan in 2023, a decrease of 143.43% year-on-year[33]. - The weighted average return on equity was -4.31% in 2023, a decrease of 15.15 percentage points compared to the previous year[33]. - The company reported a total revenue of 135.03 million yuan in 2023, a decrease of 74.96% year-on-year, primarily due to a significant reduction in orders from downstream customers in the semiconductor industry[34]. - The company reported a stoppage loss of 38.79 million RMB, attributed to the need for maintaining production levels for customer certification[128]. Profit Distribution and Shareholder Returns - The company will not distribute profits or issue cash dividends for the year 2023, prioritizing long-term shareholder interests[14]. - The company plans to issue shares through a simplified procedure to specific targets, which may dilute immediate returns[163]. - The company has proposed a three-year dividend return plan for shareholders covering 2023 to 2025[163]. - The company plans to prioritize cash dividends when the net profit is positive, with a minimum distribution of 10% of distributable profits[197]. - In mature stages without major capital expenditure, cash dividends should constitute at least 80% of profit distribution[197]. - The company retains undistributed profits primarily for investment in its main business operations[198]. Market and Industry Trends - The semiconductor industry is experiencing a downturn, impacting the revenue from the main large-diameter silicon material business[9]. - The global semiconductor market size in 2023 was $520 billion, a year-on-year decline of 9.4%, influenced by high interest rates and geopolitical conflicts[44]. - The global semiconductor industry faces risks and opportunities due to intensified competition and export controls, particularly affecting Chinese clients' access to advanced equipment[77]. - The domestic silicon component market is estimated to have a market size of 1.8 billion RMB per year, with a demand for customized silicon components at 1.5 billion RMB and OEM silicon components at 300 million RMB[52]. - The global semiconductor market is expected to see structural changes, with demand for advanced logic chips and AI applications driving growth in 2024[70]. Research and Development - Research and development expenses accounted for 16.64% of operating revenue, an increase of 9.34 percentage points year-on-year[33]. - The company invested 22.47 million yuan in R&D, leading to the acquisition of 4 core technologies and 23 patents during the reporting period[48][49]. - The company has developed multiple core technologies to control the flatness of silicon wafers, continuously improving yield rates to meet downstream customer demands[67]. - The company has made significant advancements in the precision etching and cleaning processes for silicon components, improving yield rates[96]. - The company has developed a "silicon component precision etching and cleaning technology" to meet customer demands for product cleanliness[80]. Production Capacity and Operations - Significant investments are being made in chip production capacity, driven by the demand for computing power and data[8]. - The company has expanded its production capacity for large-diameter silicon materials by approximately 100%, maintaining a competitive advantage in the global market[47]. - The company has completed the construction of its "8-inch semiconductor-grade silicon single crystal polishing wafer production project," with annual production capacity reaching 1.8 million wafers[49]. - The company has achieved a production capacity of 50,000 pieces per month for its silicon wafer processing equipment and aims to reach 100,000 pieces per month with newly installed equipment[157]. - The company is focusing on enhancing communication with suppliers to improve product research and testing efficiency, ensuring a stable supply of equipment and materials[108]. Customer Engagement and Market Strategy - The company is actively engaging with downstream customers to strengthen its position in the large-diameter silicon material market[9]. - The company plans to focus on expanding its market presence and enhancing its product offerings in response to the current industry challenges[34]. - The company is expanding its market presence by strengthening relationships with existing customers while actively seeking new clients in the domestic semiconductor industry[110]. - The company aims to expand production capacity to meet the growing domestic demand for semiconductor materials, particularly focusing on large-diameter silicon materials and silicon components[156]. Risks and Challenges - The company is facing risks related to customer concentration, with major clients located in Japan, Korea, and the United States[103]. - The company is exposed to raw material price fluctuation risks, which could adversely affect profitability if prices rise significantly[104]. - The company’s performance is significantly influenced by the cyclical nature of the semiconductor industry, with potential for business volatility during downturns[105]. - The company faces financial risks due to high capital expenditures in the semiconductor business and low capacity utilization[112]. Corporate Governance and Management - The company held two shareholder meetings during the reporting period, with all resolutions passed and no proposals rejected[165]. - The total pre-tax remuneration for senior management during the reporting period amounted to 548.57 million yuan[167]. - The company has established a compensation and assessment committee to review and approve remuneration plans for directors and senior management[175]. - The company has not faced any penalties from securities regulatory agencies in the past three years[177]. - The company has consistently maintained attendance at board meetings, with all directors present at the required meetings[179].

国泰君安证券股份有限公司 关于锦州神工半导体股份有限公司 2023 年年度报告信息披露监管问询函回复的核查意见 上海证券交易所： 根据贵所出具的《关于对锦州神工半导体股份有限公司 2023 年年度报告的 信息披露监管问询函》（上证科创公函[2024]0062 号）（以下简称"《问询函》"） 的要求，国泰君安证券股份有限公司（以下简称"国泰君安"或"保荐机构"） 作为锦州神工半导体股份有限公司（以下简称"神工股份"或"公司"）的保荐 机构，会同公司及年审会计师就《问询函》相关问题逐项进行认真核查落实。现 将有关事项报告如下： 第一部分 关于经营情况 问题 1、关于营业收入 年报显示，公司 2023 年实现营业收入 13,503.32 万元，同比下降 74.96%。 其中，大直径硅材料营业收入 8,354.66 万元，同比下降 82.45%。营业收入各季 度波动较大，第四季度实现营业收入 1,585.32 万元，环比下降 60.71%，占全年 营业收入比例由上年同期 27.53%下降至 11.74%。 请公司：（1）补充披露大直径硅材料产品前五大客户及主要交易产品、交 易数量、交易金额和平均交易价格，并按客户说明 ...

Operational Projects - The company adjusted the expected operational status date for the 8-inch semiconductor-grade silicon single crystal polishing wafer production project to February 2024[2]. Financial Performance - The company reported an accounts receivable balance of 60.32 million yuan and a bad debt provision of 8.14 million yuan at the end of the reporting period[7]. - The total fair value of financial derivatives at the end of the period is RMB 40,636,991.13, with a fair value change gain of RMB 121,681.44[11]. - The total fair value of financial assets measured at fair value is RMB 45,872,531.75, with a total purchase amount of RMB 136,817,225.00 and total sale/redemption amount of RMB 150,820,214.00[11]. - The company reported a cumulative fair value change of RMB 25,409.80 for other financial assets[11]. Research and Development - The company aims to enhance product competitiveness by increasing R&D investment and optimizing product structure[6]. - The company has established a dedicated project development team to ensure the smooth progress of R&D projects[3]. - The company is committed to continuous innovation and enhancing its industry competitiveness through technology and talent development[5]. Market Strategy - The company is focusing on expanding its domestic market share by strengthening its sales and after-sales service network[6]. - The company has successfully entered the international advanced semiconductor materials supply chain and aims to maintain long-term stable relationships with existing customers[5]. - The company is actively exploring new customer relationships, particularly with emerging equipment manufacturers and end integrated circuit clients in the domestic semiconductor industry[6]. Supplier and Procurement Management - The company emphasizes the importance of supplier management to reduce procurement costs while ensuring the quality of raw materials[6]. Accounts Receivable Management - The company is facing a downturn in the conductor industry, leading to decreased sales from downstream customers and increased collection pressure, resulting in temporary overdue accounts[8]. - To address overdue accounts, the company has implemented measures including enhancing the management of accounts receivable and increasing the frequency of tracking overdue accounts[8]. - The company plans to further improve internal control management of accounts receivable, focusing on credit policies, collection tracking, and incentive mechanisms to reduce overdue risks[8]. Information Disclosure - The company acknowledges the need to enhance the quality of information disclosure and will strengthen the review process for disclosure documents[19]. - The company will disclose the corrected annual report on the Shanghai Stock Exchange website on the same day as this announcement[19]. - The company expresses apologies for any inconvenience caused to investors due to the corrections made[19]. - The board of directors of Jinzhou Shengo Semiconductor Co., Ltd. made this announcement on May 11, 2024[21].

证券代码：688233 证券简称：神工股份 公告编号：2024-025 锦州神工半导体股份有限公司 关于上海证券交易所《关于对锦州神工半导体股份有 限公司 2023 年年度报告的信息披露监管问询函》 的回复公告 本公司董事会及全体董事保证本公告内容不存在任何虚假记载、误导性陈述 或者重大遗漏，并对其内容的真实性、准确性和完整性依法承担法律责任。 重要内容及风险提示： 市场开拓及竞争风险 公司大直径硅材料产品的现有客户包括三菱材料、SK 化学、CoorsTek、Hana 等半导体材料行业企业；硅零部件产品下游客户为国内等离子刻蚀机制造厂商和 国内集成电路制造厂商，前者如北方华创、中微公司，后者如长江存储等公司； 半导体 8 英寸轻掺低缺陷抛光硅片的目标客户群体为国内外集成电路制造商，主 要包括台湾积体电路制造股份有限公司、中芯国际集成电路制造有限公司等企 业。因此，公司大直径硅材料产品既有客户与硅零部件产品、半导体大尺寸硅片 产品的目标客户并不重叠，公司拓展下游客户存在一定难度和不确定性；同时半 导体 8 英寸轻掺低缺陷抛光硅片所在细分市场的市场集中度较高，新进入者面临 的市场竞争较为激烈，公司募投项目实施存在 ...

证券代码：688233 证券简称：神工股份 公告编号：2024-024 锦州神工半导体股份有限公司 关于以集中竞价交易方式回购公司股份的进展公告 | 回购方案首次披露日 | 2023/8/18，由董事长潘连胜先生提议 | | --- | --- | | 回购方案实施期限 | 待第二届董事会第十五次会议审议通过后 个月 12 | | 预计回购金额 | 1,500.00 万元~3,000.00 万元 | | 回购用途 | 用于员工持股计划或股权激励 | | 累计已回购股数 | 股 950,416 | | 累计已回购股数占总股本比例 | 0.5579% | | 累计已回购金额 | 万元 28,595,409.90 | | 实际回购价格区间 | 14.70 元/股~35.12 元/股 | 一、 回购股份的基本情况 公司于 2023 年 10 月 27 日召开第二届董事会第十五次会议，审议通过了《关 于以集中竞价交易方式回购公司股份的议案》，同意公司使用自有资金以集中竞 价交易方式回购公司已发行的人民币普通股（A 股）。公司拟回购的股份将用于 实施股权激励或员工持股计划。回购价格不超过 44.00 元/股（含），回购资 ...

Financial Performance - The company's operating revenue for Q1 2024 was CNY 58,320,271.69, representing an increase of 11.86% compared to the same period last year[5]. - The net profit attributable to shareholders was CNY 1,461,563.89, with a significant improvement attributed to increased operating income and enhanced cost control[8]. - The company reported a basic earnings per share of CNY 0.01, indicating a turnaround to profitability[8]. - In Q1 2024, the company achieved revenue of RMB 58.32 million, representing a year-on-year increase of 11.86% and a quarter-on-quarter increase of 267.88%[13]. - The net profit attributable to shareholders in Q1 2024 was RMB 1.46 million, marking a return to profitability for the quarter[13]. - Net profit for Q1 2024 was ¥2,167,192.01, a significant recovery from a net loss of ¥11,887,126.43 in Q1 2023[20]. - The company reported a comprehensive income total of ¥2,018,270.40, compared to a loss of ¥12,547,682.00 in the previous year[21]. - Basic and diluted earnings per share for Q1 2024 were both ¥0.01, recovering from a loss of ¥0.08 per share in Q1 2023[21]. Cash Flow and Assets - The net cash flow from operating activities was CNY 34,222,489.38, showing a decrease of 6.41% year-on-year[5]. - Cash flow from operating activities generated a net amount of ¥34,222,489.38, slightly down from ¥36,567,034.61 in Q1 2023[23]. - Cash flow from investing activities showed a net inflow of ¥196,938,524.47, a turnaround from a net outflow of ¥37,144,854.51 in the previous year[23]. - The company ended Q1 2024 with cash and cash equivalents totaling ¥785,455,987.78, up from ¥546,585,645.07 at the end of Q1 2023[24]. - Total assets at the end of the reporting period were CNY 1,921,669,477.16, down 0.61% from the end of the previous year[6]. - As of March 31, 2024, total assets amounted to RMB 1.92 billion, a slight decrease from RMB 1.93 billion at the end of 2023[16]. - Current assets totaled RMB 1.09 billion, down from RMB 1.11 billion at the end of 2023[16]. - Total liabilities as of March 31, 2024, were RMB 116.87 million, compared to RMB 121.38 million at the end of 2023[17]. - The company's equity attributable to shareholders was RMB 1.75 billion, a decrease from RMB 1.76 billion at the end of 2023[17]. Research and Development - Research and development expenses totaled CNY 5,241,295.49, accounting for 8.99% of operating revenue, a decrease of 1.44 percentage points[6]. - Research and development expenses for Q1 2024 were ¥5,241,295.49, slightly down from ¥5,438,969.18 in Q1 2023[19]. - The company is focused on R&D for new products to contribute uniquely to the domestic semiconductor equipment sector[14]. - The company aims to have more product models certified within the year for its large-size silicon wafer products, which are currently in the promotion and certification phase[14]. Market and Sales - The semiconductor industry market is gradually recovering, leading to an increase in customer orders[8]. - The company is actively expanding its market presence and maintaining customer relationships to sustain revenue growth, despite the overseas market for large-diameter silicon materials not fully recovering[14]. - Sales of silicon component products have been continuously increasing, with a growing number of product categories shipped to key customers[14]. - Total operating costs rose to ¥61,821,177.30, up 22.5% from ¥50,442,201.62 in the same period last year[19]. Shareholder Information - The total number of ordinary shareholders at the end of the reporting period was 11,489[11]. - The largest shareholder, More Light Lighting Co., Ltd., holds 21.73% of the shares, followed by Silicon Valley Semiconductor Technology (Shanghai) Co., Ltd. with 20.87%[11]. - The weighted average return on equity was 0.08%, an increase of 0.85 percentage points[6]. - The company reported a significant increase in investment income, totaling ¥161,001.25 compared to ¥640,535.55 in the previous year[19].

证券代码：688233 证券简称：神工股份 公告编号：2024-023 本公司董事会及全体董事保证本公告内容不存在任何虚假记载、误导性陈述 或者重大遗漏，并对其内容的真实性、准确性和完整性承担法律责任。 重要内容提示： 会议召开时间：2024 年 04 月 29 日(星期一) 下午 13:00-14:00 会议召开地点：上海证券交易所上证路演中心（网址： https://roadshow.sseinfo.com/） 会议召开方式：上证路演中心网络互动 投资者可于 2024 年 04 月 22 日(星期一) 至 04 月 26 日(星期 五)16:00 前登录上证路演中心网站首页点击"提问预征集"栏目或 通过公司邮箱 info@thinkon-cn.com 进行提问。公司将在说明会上对 投资者普遍关注的问题进行回答。 锦州神工半导体股份有限公司（以下简称"公司"）已于 2024 年 3 月 30 日披露公司《2023 年年度报告》，并将于 2024 年 4 月 26 日披 露《2024 年第一季度报告》，为便于广大投资者更全面深入地了解公 司 2023 年度及 2024 年第一季度经营成果、财务状况，公司计划于 ...