法律意见书 致：锦州神工半导体股份有限公司 北京市中伦律师事务所（以下简称"本所"）接受锦州神工半导体股份有限 公司（以下简称"公司"）的委托并列席公司 2023 年年度股东大会（以下简称 "本次股东大会"），对本次股东大会的合法性进行见证并出具法律意见书。 本法律意见书根据《中华人民共和国公司法》（以下简称"《公司法》"）、 《中华人民共和国证券法》（以下简称"《证券法》"）、中国证券监督管理委 员会《上市公司股东大会规则》（以下简称"《股东大会规则》"）和上海证券 交易所发布的《上海证券交易所科创板上市公司自律监管指引第 1 号——规范运 作》等现行有效的法律、法规、规范性文件以及《锦州神工半导体股份有限公司 章程》（以下简称"《公司章程》"）、《锦州神工半导体股份有限公司股东大 会议事规则》（以下简称"《股东大会议事规则》"）的有关规定，出具本法律 意见书。 为出具本法律意见书，本所律师审查了公司本次股东大会的有关文件和材 北京 • 上海 • 深圳 • 广州 • 武汉 • 成都 • 重庆 • 青岛 • 杭州 • 南京 • 海口 • 东京 • 香港 • 伦敦 • 纽约 • 洛杉矶 • 旧金山 • 阿拉木图 ...

证券代码：688233 证券简称：神工股份 公告编号：2024-022 锦州神工半导体股份有限公司 2023 年年度股东大会决议公告 本公司董事会及全体董事保证公告内容不存在任何虚假记载、误导性陈述或 者重大遗漏，并对其内容的真实性、准确性和完整性依法承担法律责任。 重要内容提示： 本次会议是否有被否决议案：无 一、 会议召开和出席情况 （三） 出席会议的普通股股东、特别表决权股东、恢复表决权的优先股股东及 其持有表决权数量的情况： （四） 表决方式是否符合《公司法》及公司章程的规定，大会主持情况等。 本次股东大会由公司董事会召集，董事长潘连胜先生主持，大会采用现场投 （一） 股东大会召开的时间：2024 年 4 月 19 日 （二） 股东大会召开的地点：公司会议室 票和网络投票相结合的方式进行表决，会议的召开和表决方式符合《中华人民共 和国公司法》《上海证券交易所上市公司股东大会网络投票实施细则》等相关法 律法规和《公司章程》的有关规定，会议合法有效。 （五） 公司董事、监事和董事会秘书的出席情况 3、 董事会秘书出席了本次会议；其他高级管理人员及见证律师列席了会议。 二、 议案审议情况 （一） 非累积投票 ...

锦州神工半导体股份有限公司 2023 年年度股东大会 会议资料 二○二四年四月 锦州神工半导体股份有限公司 2023年年度股东大会会议资料 | 听取： | 40 | | --- | --- | | 议案十八： | 《关于 2023 年度计提资产减值准备的议案》 38 | 锦州神工半导体股份有限公司 2023年年度股东大会会议资料 锦州神工半导体股份有限公司 2023 年年度股东大会会议须知 | 锦州神工半导体股份有限公司 | | 2023 年年度股东大会会议须知 4 | | --- | --- | --- | | 锦州神工半导体股份有限公司 | | 2023 年年度股东大会会议议程 6 | | 议案一： | 《关于公司 | 2023 年年度报告及其摘要的议案》 8 | | 议案二： | 《关于 | 2023 年度董事会工作报告的议案》 9 | | 议案三： | 《关于 | 2023 年度监事会工作报告的议案》 14 | | 议案四： | 《关于公司 | 2023 年度财务决算报告的议案》 18 | | 议案五： | 《关于公司 | 2024 年度财务预算报告的议案》 21 | | 议案六： | 《关于公司 | ...

国泰君安证券股份有限公司 关于锦州神工半导体股份有限公司以简易程序 向特定对象发行股票限售股上市流通的核查意见 国泰君安证券股份有限公司（以下简称"国泰君安"或"保荐机构"）作为 锦州神工半导体股份有限公司（以下简称"神工股份"或"公司"）2023 年以简 易程序向特定对象发行股票的保荐机构及持续督导机构，根据《中华人民共和国 公司法》《中华人民共和国证券法》《证券发行上市保荐业务管理办法》《上海证 券交易所科创板上市公司自律监管规则适用指引第 1 号——规范运作》等有关规 定，对神工股份以简易程序向特定对象发行股票限售股上市流通的事项进行了审 慎核查，核查情况及意见如下： 一、本次上市流通的限售股类型 2023 年 9 月 6 日，公司收到中国证券监督管理委员会出具的《关于同意锦 州神工半导体股份有限公司向特定对象发行股票注册的批复》（证监许［2023］ 2051 号），同意公司向特定对象发行股票的注册申请。 公司以简易程序向特定对象发行人民币普通股（A 股）股票，新增 10,305,736 股股份已于 2023 年 10 月 11 日在中国证券登记结算有限责任公司上海分公司办 理完毕股份登记手续。本次发行 ...

证券代码：688233 证券简称：神工股份 公告编号：2024-021 锦州神工半导体股份有限公司 以简易程序向特定对象发行股票 限售股上市流通公告 本公司董事会及全体董事保证本公告内容不存在任何虚假记载、误导性陈述 或者重大遗漏，并对其内容的真实性、准确性和完整性依法承担法律责任。 重要内容提示： 本次股票上市类型为向特定对象发行股份；股票认购方式为网下，上市股 数为 10,305,736 股。 本次股票上市流通总数为 10,305,736 股。 本次股票上市流通日期为 2024 年 4 月 11 日。 一、本次上市流通的限售股类型 三、本次上市流通的限售股的有关承诺 本次上市流通的限售股属于向特定对象发行股票，认购对象承诺所认购的股 票限售期为自公司向特定对象发行结束之日起 6 个月。除上述承诺外，本次申请 上市的限售股股东无其他特别承诺。 截至本公告披露之日，本次申请上市的限售股股东均严格履行了上述承诺， 不存在相关承诺未履行影响本次限售股上市流通的情况。 四、中介机构核查意见 经核查，保荐机构国泰君安证券股份有限公司（以下简称"保荐机构"）认为： 神工股份上述限售股份持有人严格履行了其在公司以简易程序 ...

证券代码：688233 证券简称：神工股份 公告编号：2024-020 锦州神工半导体股份有限公司 关于以集中竞价交易方式回购公司股份的进展公告 本公司董事会及全体董事保证本公告内容不存在任何虚假记载、误导性陈述 或者重大遗漏，并对其内容的真实性、准确性和完整性依法承担法律责任。 重要内容提示： 公司将严格按照《上市公司股份回购规则》《上海证券交易所上市公司自律 监管指引第7号——回购股份》等相关规定及公司回购股份方案，在回购期限内 根据市场情况择机做出回购决策并予以实施，同时根据回购股份事项进展情况及 时履行信息披露义务，敬请广大投资者注意投资风险。 公司于 2023 年 10 月 27 日召开第二届董事会第十五次会议，审议通过了《关 于以集中竞价交易方式回购公司股份的议案》，同意公司使用自有资金以集中竞 价交易方式回购公司已发行的人民币普通股（A 股）。公司拟回购的股份将用于 实施股权激励或员工持股计划。回购价格不超过 44.00 元/股（含），回购资金总 额不低于人民币 1,500.00 万元（含），不超过人民币 3,000.00 万元（含），同时 授权公司管理层全权办理本次回购股份的相关事宜。回购期限 ...

证券研究报告：电子 | 公司点评报告 总市值/流通市值（亿元）34 / 32 中邮证券投资评级说明 | --- | --- | --- | --- | |------------------------------------------------------------|----------|----------|----------------------------------------------------| | 投资评级标准 | 类型 | 评级 | 说明 | | | | 买入 | 预期个股相对同期基准指数涨幅在 20% 以上 | | 报告中投资建议的评级标准： 报告发布日后的 6 个月内的相 | | 增持 | 预期个股相对同期基准指数涨幅在 10%与 20% 之间 | | 对市场表现，即报告发布日后 | 股票评级 | 中性 | 预期个股相对同期基准指数涨幅在 -10%与 10% 之间 | | 的 6 个月内的公司股价（或行 业指数、可转债价格）的涨跌 | | 回避 | 预期个股相对同期基准指数涨幅在 -10% 以下 | | 幅相对同期相关证券市场基准 指数的涨跌幅。 | | 强于大市 | 预期 ...

Investment Rating - The report maintains a "Buy" rating for the company [17] Core Viewpoints - The semiconductor etching material cycle has reached a bottom, with silicon component revenue increasing by 166% year-on-year [6] - The company is expanding its production capacity to solidify its position in the semiconductor etching silicon material industry, with a projected annual production capacity increase of 393 tons [6][17] - The company has established a full industrial chain capability from etching silicon materials to silicon electrodes, with domestic revenue share rising from 1.9% in 2019 to 59% in 2023 [16] Financial Summary - Total revenue for 2023 is projected at 135 million, a decrease of 74.96% year-on-year, while the net profit attributable to the parent company is expected to be -69 million [19][27] - The company’s gross margin for semiconductor business is projected at -0.84% due to a decrease in revenue from large-diameter silicon materials and relatively high costs of silicon wafer products [27] - Profit forecasts for 2024 and 2025 have been adjusted to 1.1 billion and 2.6 billion respectively, with a new forecast for 2026 at 4.2 billion [17]

Financial Performance - In 2023, the company faced its first loss in ten years, with a net profit attributable to shareholders of -69.11 million RMB[14]. - The company's revenue for 2023 was ¥135,033,152.23, a decrease of 74.96% compared to ¥539,236,503.68 in 2022[31]. - The net profit attributable to shareholders of the listed company for 2023 was CNY -69.11 million, a decrease of 143.70% year-on-year, mainly due to the downturn in the semiconductor industry and a substantial decline in revenue from large-diameter silicon materials[34]. - The net cash flow from operating activities decreased by 36.83% year-on-year, primarily due to reduced revenue leading to lower customer payments[34]. - Basic and diluted earnings per share for 2023 were both CNY -0.43, a decrease of 143.43% year-on-year[33]. - The weighted average return on equity for 2023 was -4.31%, a decrease of 15.15 percentage points compared to the previous year[33]. - The company's total assets at the end of 2023 were CNY 1,933.42 million, an increase of 9.87% compared to the end of 2022[32]. - The net assets attributable to shareholders of the listed company at the end of 2023 were CNY 1,761.79 million, an increase of 11.98% year-on-year[32]. - The company's revenue excluding non-core business income was ¥129,443,827.09, down 74.25% from ¥502,659,382.34 in the previous year[31]. - The company's operating revenue was 135.03 million yuan, a decrease of 74.96% year-on-year, with a net profit attributable to shareholders of -69.11 million yuan, down 143.70%[45]. Market Conditions - The semiconductor industry is experiencing a transformation driven by digitalization and low-carbon trends, with significant investments in chip capacity on both sides of the Pacific[8]. - The global semiconductor market size was $520 billion, a year-on-year decline of 9.4%[44]. - The global semiconductor silicon wafer shipment volume in 2023 was 12.602 billion square inches, a year-on-year decline of 14.3%[60]. - The total sales revenue of the global semiconductor silicon wafer market in 2023 reached 12.3 billion USD, down 10.9% year-on-year due to weakened end demand and inventory adjustments[60]. - The semiconductor market is highly concentrated, posing competitive risks for new entrants and ongoing projects[105]. - The semiconductor industry is experiencing a cyclical downturn, significantly impacting sales orders and revenue[111]. - The global semiconductor market (excluding memory) is projected to grow by over 10% in 2024, with the wafer foundry market expected to increase by about 20%[141]. Business Strategy - The company plans to focus on high-end products and increase production capacity to meet customer demands in the silicon component business[9]. - The company aims to enhance communication with downstream customers and strengthen its international position in the large-diameter silicon material market[9]. - The company is committed to improving production quality and efficiency while balancing evaluation certification needs and economic benefits in the silicon wafer segment[9]. - The company is actively developing new silicon components tailored to customer needs, enhancing its custom development capabilities[49]. - The company plans to enhance its R&D capabilities for large-diameter silicon materials to meet increasing market demand[77]. - The company aims to enhance the production of high-margin products such as lightly doped high-resistivity silicon wafers and ultra-flat silicon wafers, targeting certification from major domestic integrated circuit manufacturers within the year[151]. Research and Development - Research and development expenses accounted for 16.64% of operating revenue, an increase of 9.34 percentage points year-on-year[33]. - The company achieved a 42.95% decrease in research and development expenses, totaling ¥22,465,641.81 compared to ¥39,375,904.62 in the previous year[87]. - A total of 23 new intellectual property applications were filed during the reporting period, with 23 granted, bringing the cumulative total to 111 applications and 85 grants[85]. - The company has developed multiple advanced technologies, including a "multi-crystalline silicon crystal density optimization technology" that improves product quality by reducing the occurrence of voids[95]. - The company has developed silicon components for 12-inch plasma etching machines, meeting the evolving technical requirements of equipment manufacturers[78]. Production Capacity and Operations - The company has expanded its production capacity for large-diameter silicon materials by approximately 100%, maintaining a competitive advantage in the global market[47]. - The company has completed the construction of its "8-inch semiconductor-grade silicon single crystal polishing wafer production project," with annual production capacity reaching 1.8 million wafers[49]. - The company has optimized its large-diameter silicon material production processes, improving yield rates and reducing manufacturing costs[77]. - The company has established a supplier management system to ensure the quality and supply capability of raw materials, with a focus on maintaining relationships with qualified suppliers[56]. - The company has maintained a stable production of large-diameter silicon materials, with production capacity steadily expanding[69]. Financial Management and Governance - The company will not distribute dividends or increase capital reserves for 2023, prioritizing long-term shareholder interests[14]. - The company has established a governance structure with clear responsibilities among the shareholders' meeting, board of directors, supervisory board, and management, ensuring effective operation[155]. - The company held two shareholders' meetings during the reporting period, adhering to legal requirements and ensuring the protection of minority shareholders' rights[159]. - The company plans to issue shares to specific targets and has outlined a three-year dividend return plan for shareholders from 2023 to 2025[157]. - The total pre-tax remuneration for the board members and senior management in the reporting period amounted to CNY 548.57 million[161]. Risks and Challenges - The company faces risks related to customer concentration, with major clients including Mitsubishi Materials and SK Chemicals[102]. - The company is exposed to raw material price fluctuations, which significantly impact its profit margins[102]. - The company faces significant financial risks due to high initial capital expenditures and low capacity utilization, leading to potential inventory write-downs[106]. - The company is exposed to foreign exchange risks due to transactions in USD and JPY, which may affect financial stability[106]. - The company's performance is highly correlated with the semiconductor industry cycle, facing potential business volatility during downturns[104].

锦州神工半导体股份有限公司 董事会议事规则 第一章 总 则 第一条 为规范锦州神工半导体股份有限公司（以下简称"公司"）董事会 的议事方式和决策程序，促使董事和董事会有效地履行其职责，提高董事会科 学决策水平，根据《中华人民共和国公司法》（以下简称"《公司法》"）等法律、 行政法规、其他规范性文件和《锦州神工半导体股份有限公司章程》（以下简称 "《公司章程》"）的规定，制定本规则。 第二章 董事会会议 第四条 董事会会议分为定期会议和临时会议。 定期会议每年应当至少召开两次，原则上应在上下两个半年度各召开一次 定期会议。 第五条 有下列情形之一的，董事会应当召开临时会议； （一）代表十分之一以上表决权的股东提议时； （四）董事长认为必要时； （五）独立董事（经全体独立董事过半数同意）提议时； （六）总经理提议时； （七）法律、行政法规及《公司章程》规定的其他情形。 第二条 董事会的议事方式是召开董事会会议。 第三条 董事按规定参加董事会会议是履行董事职责的基本方式。 （二）三分之一以上董事提议时； （三）监事会提议时； 第六条 下列事项应当经公司独立董事专门会议审议，并由全体独立董事 过半数同意后，方可提交董 ...