JADARD TECHNOLOGY INC.(688252)
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天德钰(688252) - 深圳天德钰科技股份有限公司关于持股5%以上股东减持股份计划公告
2025-06-09 12:18
证券代码:688252 证券简称:天德钰 公告编号:2025-026 深圳天德钰科技股份有限公司 关于持股 5%以上股东减持股份计划公告 本公司董事会、全体董事及相关股东保证本公告内容不存在任何虚假记载、 误导性陈述或者重大遗漏,并对其内容的真实性、准确性和完整性依法承担法律 责任。 重要内容提示: | | | 股东名称 | 持有数量(股) | 持有比例 | 一致行动关系形成原因 | | | --- | --- | --- | --- | --- | --- | --- | | 第一组 | Corich Richred | LP LP | 22,584,099 3,568,425 | 5.52% 同为 0.87% | Corich LP与 Richred | Richred LP Limited | | | | | | | 控制的公司 | | | | | 合计 | 26,152,524 | 6.39% — | | | 2 股东名称 Corich LP 股东身份 控股股东、实控人及一致行动人 □是 √否 直接持股 5%以上股东 √是 □否 董事、监事和高级管理人员 □是 √否 其他:/ 持股数量 22,584, ...
天德钰:股东CorichLP拟减持不超过1.40%公司股份
news flash· 2025-06-09 11:24
天德钰:股东CorichLP拟减持不超过1.40%公司股份 智通财经6月9日电,天德钰(688252.SH)公告称,股东CorichLP因自身资金需求,拟通过集中竞价交易 或大宗交易方式减持其所持有的公司股份,合计减持股份数量不超过5,721,909股,占公司总股本的比例 不超过1.40%。其中,通过集中竞价交易方式减持不超过4,090,213股,占公司总股本的1%,自公告披露 之日起15个交易日后的3个月内实施;通过大宗交易方式减持不超过1,631,696股,占公司总股本的 0.40%,自公告披露之日起15个交易日后的3个月内实施。 ...
天德钰(688252) - 深圳天德钰科技股份有限公司关于2023年限制性股票激励计划预留授予及预留授予(第二批次)第一个归属期归属结果的公告
2025-06-06 10:18
证券代码:688252 证券简称:天德钰 公告编号:2025-025 深圳天德钰科技股份有限公司 关于 2023 年限制性股票激励计划预留授予及 预留授予(第二批次)第一个归属期归属结果的公告 本公司董事会及全体董事保证本公告内容不存在任何虚假记载、误导性陈述 或者重大遗漏,并对其内容的真实性、准确性和完整性依法承担法律责任。 重要内容提示: 本次归属股票数量:预留授予部分第一个归属期归属 20,100 股,预留授 予(第二批次)部分第一个归属期归属 207,155 股。 本次归属股票来源:公司从二级市场回购的公司 A 股普通股股票。 一、本次限制性股票归属的决策程序及相关信息披露 (一)2023 年 8 月 4 日,公司召开第一届董事会第十五次会议审议,通过 了《关于<公司 2023 年限制性股票激励计划(草案)>及其摘要的议案》《关于< 公司 2023 年限制性股票激励计划实施考核管理办法>的议案》《关于提请股东大 会授权董事会办理 2023 年限制性股票激励计划相关事宜的议案》等议案。公司 独立董事对相关议案发表了同意的独立意见。 同日,公司召开第一届监事会第九次会议,审议通过了《关于<公司 2023 ...
先进封装设备,国产进程加速
3 6 Ke· 2025-05-20 11:28
Group 1: Core Insights - The semiconductor industry is transitioning into the "post-Moore era," leading to a shift in technological innovation towards advanced packaging technologies, which are crucial for the development of AI, HPC, and 5G [1][7] - The demand for advanced packaging technologies, such as CoWoS, is surging due to the rapid penetration of domestic AI chips in large model training and terminal applications [1][5] Group 2: Advanced Packaging Technology Overview - Advanced packaging technology plays a critical role in semiconductor manufacturing, providing electrical interconnection, mechanical support, and thermal management [2] - The evolution of packaging technology has seen significant changes from through-hole mounting to surface mount technology, and now to advanced packaging techniques like BGA, CSP, and 2.5D/3D packaging [3][4] Group 3: Market Demand and Applications - Advanced packaging is increasingly applied in high-end fields such as AI, HPC, and 5G, with its market share in the overall packaging and testing market continuously rising [5] - The need for advanced packaging is particularly high in AI chips due to the demands for high performance and efficiency, driven by large model training and inference [6] Group 4: Domestic Equipment Development - The domestic semiconductor industry is making significant strides in the development of advanced packaging equipment, driven by the increasing adoption of technologies like CoWoS [8] - Companies like Huazhuo Precision and Pulaixin Intelligent are leading the way in developing high-end equipment for HBM chip manufacturing and CoWoS technology, respectively [9][11] Group 5: Future Prospects - The advanced packaging market is expected to experience explosive growth as the challenges in advanced process technology increase [7] - The advancements in domestic equipment and technology are likely to enhance the competitiveness of the domestic semiconductor industry in the global market [8][10]
天德钰: 深圳天德钰科技股份有限公司关于召开2024年度暨2025年第一季度业绩暨现金分红说明会的公告
Zheng Quan Zhi Xing· 2025-05-20 08:19
Core Viewpoint - The company, Shenzhen Tiande Yu Technology Co., Ltd., is set to hold a performance and cash dividend briefing for the fiscal year 2024 and the first quarter of 2025 on May 28, 2025, to enhance investor understanding of its financial results and operational status [1][2]. Group 1 - The briefing will take place on May 28, 2025, from 17:00 to 18:00 [1][2]. - Participants in the briefing will include the Chairman and General Manager, Mr. Guo Yinglin, and the Secretary of the Board and Chief Financial Officer, Ms. Deng Lingling [1]. - Investors can participate online through the Shanghai Securities News and China Securities Network [2][3]. Group 2 - Investors are encouraged to submit questions via email by May 26, 2025, for discussion during the briefing [2]. - The briefing will be conducted in an online text interaction format [3]. - After the briefing, investors can access the main content and details through the Shanghai Securities News and China Securities Network [2].
天德钰(688252) - 深圳天德钰科技股份有限公司关于召开2024年度暨2025年第一季度业绩暨现金分红说明会的公告
2025-05-20 07:46
(二)会议召开地点:上海证券报•中国证券网 证券代码:688252 证券简称:天德钰 公告编号:2025-024 深圳天德钰科技股份有限公司 关于召开2024年度暨2025年第一季度业绩 暨现金分红说明会的公告 本公司董事会及全体董事保证本公告内容不存在任何虚假记载、误导性陈述 或者重大遗漏,并对其内容的真实性、准确性和完整性依法承担法律责任。 重要内容提示: 一、说明会类型 深圳天德钰科技股份有限公司(以下简称"公司")已于2025年3月27日、2025 年4月31日披露2024年年度报告、2025年第一季度报告,为便于广大投资者更全面深 入地了解公司2024年度、2025年第一季度经营成果、财务状况,公司计划于2025年5 月28日下午17:00-18:00以网络文字互动方式召开2024年度暨2025年第一季度业绩暨 现金分红说明会,就投资者关心的问题进行交流。 二、说明会召开的时间、地点 (一)会议召开时间:2025年5月28日(星期三)下午17:00-18:00 (https://roadshow.cnstock.com/) (三)会议召开方式:网络文字互动 三、参加人员 公司参加本次业绩说明会的人员 ...
天德钰:深耕细琢,研创笃行-20250430
China Post Securities· 2025-04-30 05:23
Investment Rating - The investment rating for the company is "Buy" [3][10]. Core Views - The company reported a significant increase in revenue and net profit for Q1 2025, with revenue reaching 554 million yuan, up 60.52% year-on-year, and net profit of 71 million yuan, up 116.96% year-on-year [1][2]. - The growth in electronic price tags and the introduction of new display driver products are key drivers for revenue expansion. The company's four-color electronic price tag technology has achieved an 80% market share in 2024, with further growth expected as market penetration increases [2]. - The company is increasing its R&D investment, which reached 47 million yuan in Q1 2025, a 23.06% increase year-on-year, representing 8.54% of revenue. This investment supports the development of new products and applications, including narrow bezel GIP architecture for electronic paper driver ICs [2]. Financial Forecasts and Key Metrics - Revenue projections for 2025, 2026, and 2027 are 3.00 billion yuan, 4.01 billion yuan, and 5.22 billion yuan, respectively, with net profits of 373 million yuan, 528 million yuan, and 725 million yuan [3][5]. - The company is expected to maintain strong growth rates, with revenue growth rates of 42.82% in 2025, 33.62% in 2026, and 30.06% in 2027 [5][9]. - Key financial ratios include a projected P/E ratio of 25.52 in 2025, decreasing to 13.15 by 2027, indicating improving valuation metrics over time [5][9].
天德钰(688252):深耕细琢,研创笃行
China Post Securities· 2025-04-30 04:12
Investment Rating - The report maintains a "Buy" rating for the company Tian De Yu (688252) [3] Core Insights - The company reported a revenue of 554 million yuan for Q1 2025, representing a year-on-year increase of 60.52%, and a net profit attributable to shareholders of 71 million yuan, up 116.96% year-on-year [2] - The gross margin for Q1 2025 was 24.46%, an increase of 4.89 percentage points year-on-year [2] - The company's four-color electronic price tag technology has achieved an 80% market share in 2024, with expectations for continued growth in 2025 as the penetration rate of electronic price tags increases [2] - The company is increasing its R&D investment, which reached 47 million yuan in Q1 2025, a 23.06% increase year-on-year, accounting for 8.54% of revenue [2] Financial Forecasts - The company is expected to achieve revenues of 3.0 billion yuan, 4.0 billion yuan, and 5.2 billion yuan in 2025, 2026, and 2027 respectively, with net profits of 373 million yuan, 528 million yuan, and 725 million yuan for the same years [3][5] - The projected growth rates for revenue are 42.82% in 2025, 33.62% in 2026, and 30.06% in 2027 [5] - The earnings per share (EPS) are forecasted to be 0.91 yuan, 1.29 yuan, and 1.77 yuan for 2025, 2026, and 2027 respectively [5]
天德钰(688252) - 深圳天德钰科技股份有限公司2024年可持续发展报告
2025-04-29 14:15
2024 年可持续发展报告 | 23 | 走进天德钰 | | --- | --- | | 27 | 科技创新与知识产权管理 | | 35 | 客户服务与满意 | | | | 2024 年可持续发展报告 前言 品牌与创新 公司治理 绿色运营 人才多元共荣 社会影响 附录 | 人才多元共荣 | | | --- | --- | | 人权与多元平等 | 70 | | 人才吸引与留任 | 74 | | 劳资关系与沟通 | 77 | | 人才培养与发展 | 81 | 前言 深圳天德钰科技股份有限公司及其控股子公司(以下简称"天德钰""公司"或"我们") 秉持"显示自然之美,触控芯之所及,为美好生活努力"的理念,将可持续发展融入企业 经营理念,编制并发布首份可持续发展报告(以下简称"本报告")。 本报告每年定期发布于交易所指定的信息披露网站与公司官方网站(https://tdytech.com ), 供利益相关方进行查阅、下载,以回应各利益相关方期待与诉求。我们将持续定期向外界 披露公司在品牌与创新、公司治理、绿色运营、人才多元共荣、社会影响等方面的表现。 受各种客观条件限制,报告编写中如有未尽事宜,天德钰将在未来的报告披 ...
天德钰(688252) - 深圳天德钰科技股份有限公司第二届董事会第十三次会议决议公告
2025-04-29 14:07
证券代码:688252 证券简称:天德钰 公告编号:2025-023 深圳天德钰科技股份有限公司 第二届董事会第十三次会议决议公告 本公司董事会及全体董事保证本公告内容不存在任何虚假记载、误导性陈述或者 重大遗漏,并对其内容的真实性、准确性和完整性依法承担法律责任。 深圳天德钰科技股份有限公司(以下简称"公司")第二届董事会第十三次会议于 2024 年 4 月 29 日在公司会议室以现场与通讯相结合的方式召开。会议通知已于 2025 年 4 月 24 日以邮件方式发出,应参加本次会议表决的董事 7 人,实际参加本次会议表 决的董事 7 人。会议由董事长郭英麟先生主持,公司董事会秘书列席了会议。本次会议 的召集、召开程序均符合《中华人民共和国公司法》《深圳天德钰科技股份有限公司章 程》的规定。 经与会董事审议和表决,会议形成决议如下: (一)审议通过了《关于调整 2023 年限制性股票激励计划预留授予及预留授予(第二 批次)授予价格的议案》 根据《公司 2023 年限制性股票激励计划》相关规定,同意调整公司 2023 年限制性 股票激励计划预留授予价格调整为 8.574 元/股;预留授予(第二批次)价格调整为 ...