关于深圳天德钰科技股份有限公司 中信证券股份有限公司 根据《上海证券交易所上市公司自律监管指引第 7 号 --- 回购股份》, 上市 公司回购专用账户中的股份不享有利润分配及公积金转增股本的权利。截至本核 查意见出具日,公司总股本为 409.021.341 股,扣减回购专用证券账户中股份数 2,625,780 股，实际参与分配的股本数为 406,395,561 股。 差异化分红事项的核查意见 中信证券股份有限公司(以下简称"中信证券"或"保荐机构")作为深 圳天德钰科技股份有限公司(以下简称"天德钰"或"公司")首次公开发行 股票并在科创板上市的保荐人,根据《中华人民共和国公司法》(以下简称"《公 司法》"）、《中华人民共和国证券法》（以下简称"《证券法》"）及《上 海证券交易所上市公司自律监管指引第7号 -- 回购股份》等有关规定,对天 德钰2024年度利润分配所涉及的差异化分红(以下简称"本次差异化分红") 进行了审慎核查,核查情况及意见如下: 一、本次差异化分红的原因 2024年2月20日,公司召开第二届董事会第四次会议,审议通过了《关于 以集中竞价交易方式回购公司股份的议案》,同意公司使用自有资金通过 ...

证券代码：688252 证券简称：天德钰 公告编号：2025-027 深圳天德钰科技股份有限公司 2024年年度权益分派实施公告 本公司董事会及全体董事保证公告内容不存在任何虚假记载、误导性陈述或 者重大遗漏，并对其内容的真实性、准确性和完整性依法承担法律责任。 重要内容提示： | 股权登记日 | 除权（息）日 | 现金红利发放日 | | --- | --- | --- | | 2025/6/20 | 2025/6/23 | 2025/6/23 | 一、 通过分配方案的股东大会届次和日期 本次利润分配方案经公司2025年 4月 24 日的2024年年度股东大会审议通过。 二、 分配方案 截至股权登记日下午上海证券交易所收市后，在中国证券登记结算有限责任 公司上海分公司（以下简称"中国结算上海分公司"）登记在册的本公司全体股东 （深圳天德钰科技股份有限公司回购专用证券账户除外）。 是否涉及差异化分红送转：是 每股分配比例 每股现金红利0.072元 相关日期 1. 发放年度：2024年年度 2. 分派对象： 3. 差异化分红送转方案： 截至本公告披露日，公司回购专用证券账户持有股份 2,625,780 股。占公司 ...

Core Viewpoint - The major shareholder Corich LP plans to reduce its stake in Shenzhen Tiande Yu Technology Co., Ltd. by up to 5,721,909 shares, representing no more than 1.40% of the company's total share capital due to personal funding needs [1][2][3] Shareholder Information - As of the announcement date, Corich LP holds 22,584,099 shares, accounting for 5.52% of the total share capital, while its concerted action partner Richred LP holds a total of 26,152,524 shares, representing 6.39% of the total share capital [1][2] - The shares held by Corich LP were acquired before the company's initial public offering (IPO) and are already listed and tradable [1][3] Reduction Plan Details - Corich LP intends to reduce its holdings through centralized bidding and block trading, with a maximum of 4,090,213 shares to be sold via centralized bidding and 1,631,696 shares through block trading [3] - The reduction period is set from July 1, 2025, to September 30, 2025 [3] - The reduction is driven by the shareholder's need for capital arrangement [3] Compliance and Commitments - The company assures that the reduction plan complies with relevant regulations from the China Securities Regulatory Commission and the Shanghai Stock Exchange [4][5] - Corich LP has committed to disclose the reduction plan to the Shanghai Stock Exchange 15 trading days prior to the first sale and to announce any other reduction methods three trading days in advance [4][5]

证券代码：688252 证券简称：天德钰 公告编号：2025-026 深圳天德钰科技股份有限公司 关于持股 5%以上股东减持股份计划公告 本公司董事会、全体董事及相关股东保证本公告内容不存在任何虚假记载、 误导性陈述或者重大遗漏，并对其内容的真实性、准确性和完整性依法承担法律 责任。 重要内容提示： | | | 股东名称 | 持有数量（股） | 持有比例 | 一致行动关系形成原因 | | | --- | --- | --- | --- | --- | --- | --- | | 第一组 | Corich Richred | LP LP | 22,584,099 3,568,425 | 5.52% 同为 0.87% | Corich LP与 Richred | Richred LP Limited | | | | | | | 控制的公司 | | | | | 合计 | 26,152,524 | 6.39% — | | | 2 股东名称 Corich LP 股东身份 控股股东、实控人及一致行动人 □是 √否 直接持股 5%以上股东 √是 □否 董事、监事和高级管理人员 □是 √否 其他：/ 持股数量 22,584, ...

天德钰：股东CorichLP拟减持不超过1.40%公司股份 智通财经6月9日电，天德钰(688252.SH)公告称，股东CorichLP因自身资金需求，拟通过集中竞价交易 或大宗交易方式减持其所持有的公司股份，合计减持股份数量不超过5,721,909股，占公司总股本的比例 不超过1.40%。其中，通过集中竞价交易方式减持不超过4,090,213股，占公司总股本的1%，自公告披露 之日起15个交易日后的3个月内实施；通过大宗交易方式减持不超过1,631,696股，占公司总股本的 0.40%，自公告披露之日起15个交易日后的3个月内实施。 ...

证券代码：688252 证券简称：天德钰 公告编号：2025-025 深圳天德钰科技股份有限公司 关于 2023 年限制性股票激励计划预留授予及 预留授予（第二批次）第一个归属期归属结果的公告 本公司董事会及全体董事保证本公告内容不存在任何虚假记载、误导性陈述 或者重大遗漏，并对其内容的真实性、准确性和完整性依法承担法律责任。 重要内容提示： 本次归属股票数量：预留授予部分第一个归属期归属 20,100 股，预留授 予（第二批次）部分第一个归属期归属 207,155 股。 本次归属股票来源：公司从二级市场回购的公司 A 股普通股股票。 一、本次限制性股票归属的决策程序及相关信息披露 （一）2023 年 8 月 4 日，公司召开第一届董事会第十五次会议审议，通过 了《关于<公司 2023 年限制性股票激励计划（草案）>及其摘要的议案》《关于< 公司 2023 年限制性股票激励计划实施考核管理办法>的议案》《关于提请股东大 会授权董事会办理 2023 年限制性股票激励计划相关事宜的议案》等议案。公司 独立董事对相关议案发表了同意的独立意见。 同日，公司召开第一届监事会第九次会议，审议通过了《关于<公司 2023 ...

Group 1: Core Insights - The semiconductor industry is transitioning into the "post-Moore era," leading to a shift in technological innovation towards advanced packaging technologies, which are crucial for the development of AI, HPC, and 5G [1][7] - The demand for advanced packaging technologies, such as CoWoS, is surging due to the rapid penetration of domestic AI chips in large model training and terminal applications [1][5] Group 2: Advanced Packaging Technology Overview - Advanced packaging technology plays a critical role in semiconductor manufacturing, providing electrical interconnection, mechanical support, and thermal management [2] - The evolution of packaging technology has seen significant changes from through-hole mounting to surface mount technology, and now to advanced packaging techniques like BGA, CSP, and 2.5D/3D packaging [3][4] Group 3: Market Demand and Applications - Advanced packaging is increasingly applied in high-end fields such as AI, HPC, and 5G, with its market share in the overall packaging and testing market continuously rising [5] - The need for advanced packaging is particularly high in AI chips due to the demands for high performance and efficiency, driven by large model training and inference [6] Group 4: Domestic Equipment Development - The domestic semiconductor industry is making significant strides in the development of advanced packaging equipment, driven by the increasing adoption of technologies like CoWoS [8] - Companies like Huazhuo Precision and Pulaixin Intelligent are leading the way in developing high-end equipment for HBM chip manufacturing and CoWoS technology, respectively [9][11] Group 5: Future Prospects - The advanced packaging market is expected to experience explosive growth as the challenges in advanced process technology increase [7] - The advancements in domestic equipment and technology are likely to enhance the competitiveness of the domestic semiconductor industry in the global market [8][10]

Core Viewpoint - The company, Shenzhen Tiande Yu Technology Co., Ltd., is set to hold a performance and cash dividend briefing for the fiscal year 2024 and the first quarter of 2025 on May 28, 2025, to enhance investor understanding of its financial results and operational status [1][2]. Group 1 - The briefing will take place on May 28, 2025, from 17:00 to 18:00 [1][2]. - Participants in the briefing will include the Chairman and General Manager, Mr. Guo Yinglin, and the Secretary of the Board and Chief Financial Officer, Ms. Deng Lingling [1]. - Investors can participate online through the Shanghai Securities News and China Securities Network [2][3]. Group 2 - Investors are encouraged to submit questions via email by May 26, 2025, for discussion during the briefing [2]. - The briefing will be conducted in an online text interaction format [3]. - After the briefing, investors can access the main content and details through the Shanghai Securities News and China Securities Network [2].

（二）会议召开地点：上海证券报•中国证券网 证券代码：688252 证券简称：天德钰 公告编号：2025-024 深圳天德钰科技股份有限公司 关于召开2024年度暨2025年第一季度业绩 暨现金分红说明会的公告 本公司董事会及全体董事保证本公告内容不存在任何虚假记载、误导性陈述 或者重大遗漏，并对其内容的真实性、准确性和完整性依法承担法律责任。 重要内容提示： 一、说明会类型 深圳天德钰科技股份有限公司（以下简称"公司"）已于2025年3月27日、2025 年4月31日披露2024年年度报告、2025年第一季度报告，为便于广大投资者更全面深 入地了解公司2024年度、2025年第一季度经营成果、财务状况，公司计划于2025年5 月28日下午17:00-18:00以网络文字互动方式召开2024年度暨2025年第一季度业绩暨 现金分红说明会，就投资者关心的问题进行交流。 二、说明会召开的时间、地点 （一）会议召开时间：2025年5月28日（星期三）下午17:00-18:00 （https://roadshow.cnstock.com/） （三）会议召开方式：网络文字互动 三、参加人员 公司参加本次业绩说明会的人员 ...

Investment Rating - The investment rating for the company is "Buy" [3][10]. Core Views - The company reported a significant increase in revenue and net profit for Q1 2025, with revenue reaching 554 million yuan, up 60.52% year-on-year, and net profit of 71 million yuan, up 116.96% year-on-year [1][2]. - The growth in electronic price tags and the introduction of new display driver products are key drivers for revenue expansion. The company's four-color electronic price tag technology has achieved an 80% market share in 2024, with further growth expected as market penetration increases [2]. - The company is increasing its R&D investment, which reached 47 million yuan in Q1 2025, a 23.06% increase year-on-year, representing 8.54% of revenue. This investment supports the development of new products and applications, including narrow bezel GIP architecture for electronic paper driver ICs [2]. Financial Forecasts and Key Metrics - Revenue projections for 2025, 2026, and 2027 are 3.00 billion yuan, 4.01 billion yuan, and 5.22 billion yuan, respectively, with net profits of 373 million yuan, 528 million yuan, and 725 million yuan [3][5]. - The company is expected to maintain strong growth rates, with revenue growth rates of 42.82% in 2025, 33.62% in 2026, and 30.06% in 2027 [5][9]. - Key financial ratios include a projected P/E ratio of 25.52 in 2025, decreasing to 13.15 by 2027, indicating improving valuation metrics over time [5][9].