Company and Industry Overview * **Company**: Yungxi Semiconductor * **Industry**: Semiconductor packaging and testing * **Focus**: High-end advanced packaging solutions Key Points Revenue and Profitability * **2023**: Revenue of approximately 2.4 billion RMB, up 10% year-on-year. Net profit declined due to increased investment in construction and personnel expansion. * **Q1 2024**: Revenue of 720 million RMB, up over 70% year-on-year. Profitability improved due to scale effects and product mix changes. * **2024 Outlook**: Targeting revenue growth of over 50% compared to 2022, aiming for 3.3 billion RMB. Customer Structure and Market Segments * **Main Customers**: Consumer electronics, IoT, automotive electronics, and computing. * **Market Segments**: IoT (50%), PA (20%), security (10-15%), and others (10-20%). * **Growth Drivers**: Expansion of customer base, especially in new large customers and vertical integration solutions. Product Development and Technology * **Product Lines**: Wafer-level packaging, bumping, CSP, WLCSP, FCBGA, and automotive electronics. * **Focus**: Bumping, microflow CSP, FCBGA, and automotive electronics. * **2.5D Packaging**: Currently in development, expected to have commercial products in the second half of 2024. Capacity Expansion and Investment * **Second Phase Expansion**: Construction progressing smoothly, with initial capacity of 30,000 wafers per month. * **Capital Expenditure**: Expected to be around 2 billion RMB in 2024, focusing on equipment investment. Competitive Landscape * **Competitors**: Other domestic and international semiconductor packaging and testing companies. * **Competitive Advantage**: Strong customer relationships, technical expertise, and cost competitiveness. Future Outlook * **Growth Drivers**: Expansion of customer base, product innovation, and capacity expansion. * **Challenges**: Intense competition, technological advancements, and economic uncertainties. Additional Points * **Investment in R&D**: 6% of revenue in Q1 2024. * **Employee Expansion**: Significant increase in personnel in 2023. * **Strategic Partnerships**: Collaborations with leading customers and technology providers.

Financial Performance - The company's operating revenue for 2023 was CNY 2,390.84 million, primarily from integrated circuit packaging and testing products [23]. - The company's operating revenue for 2023 reached ¥2,390,841,120.27, representing a year-on-year increase of 9.82% compared to ¥2,176,992,689.58 in 2022 [57]. - The net profit attributable to shareholders was a loss of ¥93,387,886.95, a significant decline of 167.48% from a profit of ¥138,400,419.38 in the previous year [57]. - The net cash flow from operating activities increased by 19.10% to ¥1,071,479,586.66, up from ¥899,615,766.86 in 2022 [57]. - The total assets of the company grew by 48.20% to ¥12,330,906,165.46, compared to ¥8,320,726,323.62 at the end of 2022 [57]. - The net profit attributable to shareholders decreased by 167.48% year-on-year, primarily due to weak demand and increased costs [74]. - The company's gross profit margin declined compared to the previous year due to weak downstream customer orders and price pressure on certain product lines [74]. - The company's net profit attributable to shareholders of the listed company was -9,338.79 thousand yuan, a decrease of 167.48% year-on-year [141]. - The company's operating costs increased by 21.08% to CNY 2,058,472,654.08 from CNY 1,700,110,847.59 in the previous year [169]. Shareholder Structure - The total number of shares held by the top ten shareholders includes Zhejiang Yongshun Chip Electronics Co., Ltd. with 74,210,000 shares, Wang Shunbo with 16,000,000 shares, and Ningbo Yongjing Enterprise Management Consulting Partnership with 15,250,000 shares [9]. - The company has no controlling shareholder, indicating a diversified ownership structure [13]. - There are no significant changes in the shareholder structure compared to the previous period [8]. - The company has not reported any changes in control during the reporting period [17]. Risks and Mitigation - The company has outlined various risks and corresponding mitigation strategies in its annual report [26]. - The company is facing risks related to gross margin fluctuations, which are directly linked to capacity utilization rates, raw material price volatility, and market supply-demand dynamics [50]. - The company is committed to maintaining reasonable levels of raw material inventory through production planning and supply chain management to mitigate inventory impairment risks [50]. - The company faces risks of underperformance or losses if the semiconductor industry remains sluggish or if project capacity ramp-up does not meet expectations [74]. - The company is actively monitoring global economic trends and industry policies to mitigate risks associated with market fluctuations and changes in government regulations [114]. Research and Development - Research and development expenses for the period amounted to 145.12 million, a year-on-year increase of 19.23%, mainly due to the growth in the number of R&D personnel and related salary costs [51]. - R&D investment reached 145 million yuan, accounting for 6.07% of operating revenue, with 27 new invention patents and 74 utility model patents filed during the reporting period [89]. - The total R&D investment for the year is approximately ¥145.12 million, representing a 19.23% increase from the previous year [104]. - The total R&D personnel increased to 793, representing 16.54% of the company's total workforce, compared to 14.67% in the previous period, indicating a focus on enhancing R&D capabilities [5]. - The company has filed 105 patent applications during the year, with 82 new patents granted [104]. Market and Industry Trends - The semiconductor market is projected to decline by 9.4% in 2023, with a total market size of approximately 520.1 billion USD [74]. - The company anticipates a 13.1% growth in the global semiconductor market in 2024, reaching an estimated value of 588 billion dollars, with expectations for continued revenue growth and improved profitability [89]. - In 2023, the global semiconductor market size is estimated at $520.1 billion, a year-on-year decline of 9.4% [163]. - The global advanced packaging market is projected to grow from $44.3 billion in 2022 to $78.6 billion by 2028, with a compound annual growth rate (CAGR) of 10.6% [94]. Production and Sales - The company's packaging output reached 3.579 billion units, an increase of 33.06% compared to the previous year, while sales volume increased by 31.44% to 3.572 billion units, driven by market expansion and customer demand growth [52]. - The company expanded its product lines in advanced packaging and automotive electronics, achieving one-stop delivery capability with Bumping, CP, FC, and FT technologies [87]. - The company is actively pursuing market expansion, particularly in the automotive electronics sector, with successful certifications from end vehicle manufacturers and Tier 1 suppliers [87]. - The company achieved a revenue of CNY 2,390,841,120.27, representing a year-on-year increase of 9.82% compared to CNY 2,176,992,689.58 in the previous year [169]. - The company had 11 customers with sales exceeding 100 million RMB, and 14 customers with sales over 50 million RMB, indicating an optimized customer structure [79]. Financial Management - The audit report confirms that the financial statements fairly reflect the company's financial position as of December 31, 2023 [30]. - The company has not engaged in any external guarantees that violate decision-making procedures [32]. - The company has not disclosed any information that is subject to confidentiality or exemption due to national secrets or commercial secrets [27]. - The company has implemented strategies to reduce product costs and improve delivery times, further enhancing its competitive position in the semiconductor industry [109]. Innovations and Technologies - The company has developed advanced packaging technologies, including system-level packaging and high-density packaging, to enhance future performance sustainability [63]. - The company has achieved breakthroughs in large FC-BGA, bumping, and RDL technologies through continuous independent research and development [98]. - The company has developed advanced packaging technology for high-density fine-pitch flip chip interconnects, achieving a minimum bump pitch of <80um and a minimum bump diameter of 40um, with over 3,400 bumps per die [99]. - The company’s FC-BGA products have reached 18,000 bumps per die, marking a significant breakthrough in high-density flip chip packaging technology [99]. - The company has successfully developed vacuum molding bottom filling technology for FCCSP flip chips, addressing challenges related to narrow gaps and ensuring effective filling [99].

目 录 一、关于营业收入扣除情况的专项核查意见………………………第 1—2 页 二、2023 年度营业收入扣除情况表…………………………………第 3—5 页 关于营业收入扣除情况的专项核查意见 天健审〔2024〕2154 号 甬矽电子（宁波）股份有限公司全体股东： 我们接受委托，审计了甬矽电子（宁波）股份有限公司（以下简称甬矽电子 公司）2023 年度财务报表，包括 2023 年 12 月 31 日的合并及母公司资产负债表， 2023 年度的合并及母公司利润表、合并及母公司现金流量表、合并及母公司所 有者权益变动表，以及财务报表附注，并出具了审计报告。在此基础上，我们核 查了后附的甬矽电子公司管理层编制的《2023 年度营业收入扣除情况表》（以 下简称扣除情况表）。 一、对报告使用者和使用目的的限定 本报告仅供甬矽电子公司年度报告披露时使用，不得用作任何其他目的。我 们同意将本报告作为甬矽电子公司年度报告的必备文件，随同其他文件一起报送 并对外披露。 我们的核查是根据中国注册会计师执业准则进行的。中国注册会计师执业准 则要求我们计划和实施核查工作，以对扣除情况表是否不存在重大错报获取合理 保证。在核查过程中， ...

甬矽电子（宁波）股份有限公司 证券代码：688362 证券简称：甬矽电子 公告编号：2024-027 2023年度募集资金存放与使用情况的专项报告 本公司董事会及全体董事保证本公告内容不存在任何虚假记载、误导性陈述或 者重大遗漏，并对其内容的真实性、准确性和完整性依法承担法律责任。 根据中国证券监督管理委员会《上市公司监管指引第2号——上市公司募集资金 管理和使用的监管要求（2022年修订）》（证监会公告〔2022〕15号）和上海证券 交易所印发的《上海证券交易所科创板上市公司自律监管指引第1号——规范运作 （2023年12月修订）》（上证发〔2023〕194号）的规定，将甬矽电子（宁波）股份 有限公司（以下简称"公司"）2023年度募集资金存放与使用情况专项说明如下： 一、募集资金基本情况 （一）实际募集资金金额和资金到账时间 根据中国证券监督管理委员会《关于同意甬矽电子（宁波）股份有限公司首次 公开发行股票注册的批复》（证监许可〔2022〕2286号），本公司由保荐机构方正 证券承销保荐有限责任公司和联席主承销商中国国际金融股份有限公司采用向战略 投资者定向配售、网下向符合条件的投资者询价配售和网上向持有 ...

证券代码：688362 证券简称：甬矽电子 公告编号：2024-028 一、2023年度计提资产减值准备情况 甬矽电子（宁波）股份有限公司（以下简称"公司"）基于实际经营情况及行 业市场变化等因素的影响，根据《企业会计准则第8号——资产减值》及公司会计政 策、会计估计的相关规定，为了客观、准确地反映公司截至 2023 年 12 月 31 日的财 务状况和经营成果，基于谨慎性原则，公司对截至 2023 年 12 月 31 日合并报表范围 内可能发生信用减值损失及资产减值损失的有关资产计提资产减值准备。 2023年度，公司计提信用减值损失和资产减值损失共计1,883.17万元，具体如 下： 单位：万元 币种：人民币 | 项目 | 本期金额 | 备注 | | --- | --- | --- | | 信用减值损失 | -1,129.64 | 包含应收票据、应收账款及其他应收款等减值损 失 | | 资产减值损失 | -753.53 | 包含存货跌价损失及合同履约成本等减值损失 | | 合计 | -1,883.17 | / | 注：损失以"-"号填列，本期金额以四舍五入的方式保留两位小数。 二、计提资产减值准备事项的具体 ...

证券代码：688362 证券简称：甬矽电子 公告编号：2024-029 甬矽电子（宁波）股份有限公司 关于2024年度"提质增效重回报"专项行动方案的公告 本公司董事会及全体董事保证本公告内容不存在任何虚假记载、误导性陈述或 者重大遗漏，并对其内容的真实性、准确性和完整性依法承担法律责任。 甬矽电子（宁波）股份有限公司（以下简称"公司"）为践行"以投资者为本" 的上市公司发展理念，维护公司全体股东利益，基于对公司未来发展前景的信心、 对公司价值的认可和切实履行社会责任，公司特制定2024年度"提质增效重回报"专 项行动方案，积极采取措施，提高公司经营质量，切实履行上市公司的责任和义务， 实现管理层与股东利益的共担共享，保障投资者权益，树立良好的资本市场形象。 公司2024年度"提质增效重回报"专项行动方案主要措施如下： 一、专注主业经营，提升公司核心竞争力 公司主要从事集成电路的封装和测试业务，自2017年底成立以来，始终坚持"承 诺诚信、公平公开、专注合作"的企业核心价值观，以市场为导向、以技术为支持、 以诚实守信为根本原则，为客户提供最优化的集成电路封装与测试解决方案。公司 产品全部为中高端先进封装产品， ...

证券代码：688362 证券简称：甬矽电子 公告编号：2024-026 甬矽电子（宁波）股份有限公司 关于确认2023年度日常关联交易及预计2024年度日常关联 交易的公告 本公司董事会及全体董事保证本公告内容不存在任何虚假记载、误导性陈述或 者重大遗漏，并对其内容的真实性、准确性和完整性依法承担法律责任。 重要内容提示： 是否需要提交股东大会审议：否。 （一）日常关联交易履行的审议程序 2024年4月17日，公司召开第三届董事会独立董事专门会议第一次会议，一致同 意并审议通过了《关于确认2023年度日常关联交易及预计2024年度日常关联交易的 议案》，并同意将该事项提交公司董事会审议。 2024年4月17日，公司召开第三届董事会第四次会议和第三届监事会第二次会议， 审议通过了《关于确认2023年度日常关联交易及预计2024年度日常关联交易的议 案》，对2023年度日常关联交易情况进行了补充确认，并对2024年度日常关联交易 进行了预计。关联董事王顺波、关联监事岑漩对本议案回避表决。本次日常关联交 易补充确认和预计事项均在董事会审议权限内，无需提请股东大会审议。 （二）确认2023年度日常关联交易及2024年 ...

目 录 一、募集资金年度存放与使用情况鉴证报告………………………第 1—2 页 二、关于募集资金年度存放与使用情况的专项报告………………第 3—8 页 募集资金年度存放与使用情况鉴证报告 天健审〔2024〕2153 号 甬矽电子（宁波）股份有限公司全体股东： 我们鉴证了后附的甬矽电子（宁波）股份有限公司（以下简称甬矽电子公司） 管理层编制的《2023 年度募集资金存放与使用情况的专项报告》。 一、对报告使用者和使用目的的限定 本鉴证报告仅供甬矽电子公司年度报告披露时使用，不得用作任何其他目的。 我们同意将本鉴证报告作为甬矽电子公司年度报告的必备文件，随同其他文件一 起报送并对外披露。 二、管理层的责任 我们认为，甬矽电子公司管理层编制的《2023 年度募集资金存放与使用情 况的专项报告》符合《上市公司监管指引第 2 号——上市公司募集资金管理和使 用的监管要求（2022 年修订）》（证监会公告〔2022〕15 号）和《上海证券交 易所科创板上市公司自律监管指引第 1 号——规范运作（2023 年 12 月修订）》 （上证发〔2023〕194 号）的规定，如实反映了甬矽电子公司募集资金 2023 年 度实际存放 ...

关于甬矽电子（宁波）股份有限公司 非经营性资金占用及其他关联资金往来情况 汇总表的专项审计报告 目 录 1、 专项审计报告 2、 附表 委托单位：甬矽电子（宁波）股份有限公司 审计单位：天健会计师事务所（特殊普通合伙） 联系电话：0571-89722900 目 录 天健审〔2024 〕2152 号 角矽电子(宁波)股份有限公司全体股东: 吕鸣童 您可使用手机"扫一扫"或进入"注册会计师行业统一监管平台（http://acc.mof.gov.cn） 一、非经营性资金占用及其他关联资金往来情况的专项 审计说明·································································································· 第 1—2 页 二、非经营性资金占用及其他关联资金往来情况汇总表…………第 3—3 页 非经营性资金占用及其他关联资金往来情况的 专项审计说明 我们接受委托,审计了甬矽电子(宁波)股份有限公司(以下简称甬矽电子 公司)2023年度财务报表,包括 2023年 12月 31 日的合并及母公司资产负债表, 2023 年度 ...

甬矽电子（宁波）股份有限公司董事会 根据证监会《上市公司独立董事管理办法》《上海证券交易所科创板股 票上市规则》《上海证券交易所科创板上市公司自律监管指引第 1 号——规 范运作》等相关要求，甬矽电子（宁波）股份有限公司（以下简称"公司"） 董事会，就公司独立董事蔡在法、张冰、王喆垚的独立性情况进行评估并出 具如下专项意见： 甬矽电子（宁波）股份有限公司董事会 2024 年 4 月 17 日 经核查公司独立董事蔡在法、张冰、王喆垚的兼职、任职情况以及其签 署的独立性自查情况报告，上述人员除在公司担任独立董事外，不存在在公 司任职以及在公司主要股东单位任职的情形，与公司以及主要股东之间不 存在利害关系、重大业务往来或其他可能妨碍其独立性的关系。因此，董事 会认为公司独立董事符合《上市公司独立董事管理办法》《上海证券交易所 科创板上市公司自律监管指引第 1 号——规范运作》中对独立董事独立性 的相关要求。 关于独立董事独立性情况的专项意见 ...