| 证券代码：688362 | 证券简称：甬矽电子 | 公告编号：2025-056 | | --- | --- | --- | | 转债代码：118057 | 转债简称：甬矽转债 | | 甬矽电子（宁波）股份有限公司 关于调整募集资金投资项目拟投入募集资金金额的公告 本公司董事会及全体董事保证本公告内容不存在任何虚假记载、误导性陈 述或者重大遗漏，并对其内容的真实性、准确性和完整性依法承担法律责任。 甬矽电子（宁波）股份有限公司（以下简称"公司"）2025年7月15日召开第三 届董事会第十七次会议和第三届监事会第十四次会议，审议通过了《关于调整募集资 金投资项目拟投入募集资金金额的议案》，同意公司根据向不特定对象发行可转换公 司债券募集资金实际情况，对募集资金投资项目（以下简称"募投项目"）拟投入募集 资金金额进行调整。保荐人平安证券股份有限公司（以下简称"保荐人"）发表了明 确的核查意见。现将相关情况公告如下： 一、募集资金基本情况 经中国证券监督管理委员会《关于同意甬矽电子（宁波）股份有限公司向不特定 对象发行可转换公司债券注册的批复》（证监许可〔2025〕1042号）同意，公司向不 特定对象发行116, ...

| 证券代码：688362 | 证券简称：甬矽电子 | 公告编号：2025-058 | | --- | --- | --- | | 转债代码：118057 | 转债简称：甬矽转债 | | 甬矽电子（宁波）股份有限公司 根据《甬矽电子（宁波）股份有限公司向不特定对象发行可转换公司债券募集说 明书》及实际募集资金净额情况，本次发行募集资金扣除发行费用后，将用于投入以 下项目： 单位：万元 | 序 | 项目名称 | 项目总投资 | 拟投入募集资金 | 拟投入募集资金金 | | --- | --- | --- | --- | --- | | 号 | | | 金额（调整前） | 额（调整后）注 | | 1 | 多维异构先进封装技术研发及 产业化项目 | 146,399.28 | 90,000.00 | 90,000.00 | | 2 | 补充流动资金及偿还银行借款 | 26,500.00 | 26,500.00 | 25,129.88 | | | 合计 | 172,899.28 | 116,500.00 | 115,129.88 | 关于使用部分闲置募集资金临时补充流动资金的公告 本公司董事会及全体董事保证本公告内容不 ...

| 证券代码：688362 | 证券简称：甬矽电子 | 公告编号：2025-061 | | --- | --- | --- | | 转债代码：118057 | 转债简称：甬矽转债 | | 甬矽电子（宁波）股份有限公司（以下简称"公司"）于 2025 年 7 月 15 日召开 第三届董事会第十七次会议，审议通过了《关于变更注册资本及修订<公司章程>并办 理工商变更登记的议案》。根据公司股东大会就办理股权激励计划相关事宜对董事会 的授权，公司本次变更注册资本及修订《甬矽电子（宁波）股份有限公司章程》（以 下简称"《公司章程》"）事宜无需提交股东大会审议，现将具体事项公告如下： 一、公司注册资本变更情况 公司 2023 年限制性股票激励计划第二个归属期的归属条件已经达成，公司因本次 限制性股票归属新增的股份数量为 121.353 万股，已于 2025 年 6 月 10 日在中国证券登 记结算有限责任公司上海分公司完成登记，并于 2025 年 6 月 17 日起上市流通。本次 变更后，公司股份总数由归属前的 40,841.24 万股变更为 40,962.593 万股，公司注册资 本由人民币 40,841.24 万元变 ...

| 证券代码：688362 | 证券简称：甬矽电子 | 公告编号：2025-057 | | --- | --- | --- | | 转债代码：118057 | 转债简称：甬矽转债 | | 本公司董事会及全体董事保证本公告内容不存在任何虚假记载、误导性陈述 或者重大遗漏，并对其内容的真实性、准确性和完整性依法承担法律责任。 甬矽电子（宁波）股份有限公司（以下简称"公司"）于2025年7月15日召 开第三届董事会第十七会议和第三届监事会第十四次会议，审议通过了《关于 使用可转换公司债券部分募集资金向控股子公司提供借款以实施募投项目的议 案》，同意公司使用募集资金向控股子公司甬矽半导体（宁波）有限公司（以 下简称"甬矽半导体"）提供借款90,000.00万元以实施向不特定对象发行可转 换公司债券募集资金投资项目（以下简称"募投项目"）"多维异构先进封装 技术研发及产业化项目"。保荐人平安证券股份有限公司（以下简称"保荐 人"）对该事项出具了明确的核查意见。现将具体情况公告如下： 一、募集资金基本情况 三、本次使用募集资金向控股子公司提供借款的情况 根据《募集说明书》，公司募集资金投资项目中"多维异构先进封装技术 研 ...

| 证券代码：688362 | 证券简称：甬矽电子 | 公告编号：2025-062 | | --- | --- | --- | | 转债代码：118057 | 转债简称：甬矽转债 | | 甬矽电子（宁波）股份有限公司 第三届监事会第十四次会议决议公告 本公司监事会及全体监事保证本公告内容不存在任何虚假记载、误导性陈述或 者重大遗漏，并对其内容的真实性、准确性和完整性依法承担法律责任。 一、监事会会议召开情况 甬矽电子（宁波）股份有限公司（以下简称"公司"）第三届监事会第十四次会 议于 2025 年 7 月 15 日以现场结合通讯会议方式在公司会议室召开。本次会议通知于 2025 年 7 月 10 日以书面及电子邮件等方式发出。会议由公司监事会主席岑漩主持，本 次会议应出席监事 3 名，实际出席监事 3 名。本次会议的召集、召开方式符合有关法 律、法规和《甬矽电子（宁波）股份有限公司章程》（以下简称"《公司章程》"） 的规定，会议决议合法、有效。 二、监事会会议审议情况 本次会议经与会监事审议并以记名投票表决方式审议通过了相关的议案，形成决 议如下： （一）审议通过《关于调整募集资金投资项目拟投入募集资金金额的 ...

| 证券代码：688362 | 证券简称：甬矽电子 | 公告编号：2025-063 | | --- | --- | --- | | 转债代码：118057 | 转债简称：甬矽转债 | | 甬矽电子（宁波）股份有限公司 第三届董事会第十七次会议决议公告 本公司董事会及全体董事保证本公告内容不存在任何虚假记载、误导性陈述或 者重大遗漏，并对其内容的真实性、准确性和完整性依法承担法律责任。 一、董事会会议召开情况 甬矽电子（宁波）股份有限公司（以下简称"公司"）第三届董事会第十七次会 议于 2025 年 7 月 15 日以现场结合通讯会议方式在公司会议室召开。本次会议通知于 2025 年 7 月 10 日以书面及电子邮件等方式发出。会议由公司董事长王顺波主持，本次 会议应出席董事 7 名，实际出席董事 7 名。本次会议的召集、召开方式符合有关法律、 法规和《甬矽电子（宁波）股份有限公司章程》（以下简称"《公司章程》"）的规 定，会议决议合法、有效。 二、董事会会议审议情况 本次会议经与会董事审议并以记名投票表决方式审议通过了相关的议案，形成决 议如下： （一）审议通过《关于调整募集资金投资项目拟投入募集资金金额的议 ...

Core Viewpoint - Yongxi Electronics is issuing convertible bonds to raise a total of 1.165 billion yuan, primarily for the research and industrialization of advanced packaging technology, which is crucial for enhancing its competitiveness in the semiconductor packaging industry [1][2]. Group 1: Fundraising and Investment - The total amount raised from the convertible bonds is 1.165 billion yuan, with 900 million yuan allocated for the development and industrialization of multi-dimensional heterogeneous advanced packaging technology [1]. - The remaining funds will be used to supplement working capital and repay bank loans [1]. Group 2: Technology and Market Position - Yongxi Electronics focuses on high-end advanced packaging technology, with products used in various fields including RF front-end chips, application processor SoC chips, and AIoT chips [1]. - The company has a total investment of 1.464 billion yuan for the multi-dimensional heterogeneous advanced packaging technology project, which will enhance its production capacity to 90,000 units per year once fully operational [1]. - The company has consistently increased its R&D expenditures, with amounts of 122 million yuan, 145 million yuan, and 217 million yuan planned for the years 2022 to 2024, respectively [2]. Group 3: Competitive Advantage - The focus on multi-dimensional heterogeneous packaging technology is seen as a key competitive advantage in the high-performance chip sector, which is critical for future competition among advanced packaging companies [1][2]. - The company aims to narrow the gap with international leaders in the high-end packaging market, which has been dominated by major global players [2].

Report Industry Investment Rating - Not provided in the given content Core Viewpoints - Last week, the equity market had a volume - driven rally. The real estate, steel, and building materials sectors were strong, while the banking sector declined. The bond market adjusted, and the 10 - year Treasury bond rate closed at 1.67% on Friday, up 2.2bp from the previous week. The convertible bond market mostly rose, with the CSI Convertible Bond Index up 0.76% for the week [1][8][9]. - In the short term, convertible bond supply may significantly shrink. The follow - up momentum of the convertible bond market has weakened, and valuations have been further compressed. It is recommended to focus on balanced convertible bonds or high - price, low - premium and non - redeemable in the short - term equity - biased varieties. For those with high requirements for drawdown, consider reducing positions [2][17]. - With the disclosure of mid - year report performance forecasts, attention should be paid to sectors such as consumer goods, technology, power grid equipment, and innovation drugs. Also, be cautious about bonds with a high proportion of exports to the US [3][18]. Summary by Relevant Catalogs Market Trends (2025/7/7 - 2025/7/11) - **Stock Market**: The equity market rose with volume. Real estate, steel, and building materials sectors performed well due to policy expectations and "anti - involution" themes. The non - banking sector was strong driven by the stablecoin theme, while the banking sector declined. Different sectors showed different performances on each trading day [8]. - **Bond Market**: The bond market adjusted. Factors such as the postponement of Trump's equal - tariff effective date, the Shanghai Composite Index breaking through 3500, and real estate policy rumors suppressed bond market sentiment. The 10 - year Treasury bond rate closed at 1.67% on Friday, up 2.2bp from the previous week [1][9]. - **Convertible Bond Market**: Most convertible bond issues rose. The CSI Convertible Bond Index increased by 0.76% for the week, the median price rose by 0.95%, and the calculated arithmetic average parity increased by 2.07%. The overall market conversion premium rate decreased by 1.29% compared with the previous week. Sectors like non - banking finance, coal, and computer in the convertible bond market led the gains, while social services, banking, and automotive sectors lagged. The total trading volume of the convertible bond market last week was 3405.76 billion yuan, with an average daily trading volume of 681.15 billion yuan, an increase from the previous week [9][12][15]. Viewpoints and Strategies (2025/7/14 - 2025/7/18) - **Supply Outlook**: Convertible bond supply may significantly shrink in the short term. The approval of the "potential new bond" Fudan Microelectronics expired, and there are only 5 issues in the pending - issuance list that have passed the listing committee, with a total scale of less than 5 billion yuan. Also, the delisting of existing bonds is accelerating [2][17]. - **Investment Suggestions**: Due to the intensified supply - demand contradiction, it is recommended to focus on balanced convertible bonds that can quickly consume the premium rate with high - volatility underlying stocks or high - price, low - premium and non - redeemable in the short - term equity - biased varieties. Consider reducing positions for those with high drawdown requirements [2][17]. - **Sector Focus**: Pay attention to sectors such as consumer goods (appliances, auto parts, two - wheeled vehicles), technology (PCB, copper - clad laminates, data center power supplies), power grid equipment, sea - wind power, energy storage, innovation drugs, and chemical pharmaceuticals. Be cautious about bonds with a high proportion of exports to the US [3][18]. Valuation Overview - As of July 11, 2025, for equity - biased convertible bonds, the average conversion premium rates in different parity intervals are at different percentile levels since 2010 and 2021. For debt - biased convertible bonds, the average YTM of bonds with a parity below 70 yuan is - 1.04%, at the 4%/0% percentile since 2010/2021. The average implied volatility of all convertible bonds is 33.92%, at the 64%/45% percentile since 2010/2021, and the difference between the implied volatility of convertible bonds and the long - term actual volatility of the underlying stocks is - 13.38%, at the 27%/32% percentile since 2010/2021 [19]. Primary Market Tracking - **Last Week (2025/7/7 - 2025/7/11)**: Guanghe Convertible Bond announced its issuance, and Luwei and Huachen Convertible Bonds were listed. Guanghe Convertible Bond, with an issuance scale of 4.9 billion yuan, is for the Guangdong Lufeng Nuclear Power Plant Project. Luwei Convertible Bond, with an issuance scale of 615 million yuan, is mainly for semiconductor and high - precision flat - panel display mask expansion projects. Huachen Convertible Bond, with an issuance scale of 460 million yuan, is for new - energy power equipment manufacturing and digital factory construction projects [27][28][29]. - **Next Week (2025/7/14 - 2025/7/18)**: Xizhen and Yongxi Convertible Bonds will be listed. Xizhen Convertible Bond, with an issuance scale of 520 million yuan, is for the Langfang Zhenhua Automobile Parts Project. Yongxi Convertible Bond, with an issuance scale of 1.165 billion yuan, is for multi - dimensional heterogeneous advanced packaging technology R & D and industrialization projects [30][31]. - **Overall Pending Issuance**: As of July 11, there are 75 convertible bonds to be issued, with a total scale of 116.32 billion yuan, including 2 issues approved for registration (total scale of 2.11 billion yuan) and 3 issues passed by the listing committee (total scale of 2.62 billion yuan) [32].

Overview - The company, Forehope Electronic (Ningbo) Co., Ltd., is issuing convertible bonds totaling RMB 116.5 million, with a total of 1,165,000 bonds to be listed on the Shanghai Stock Exchange [4][5][30]. - The bonds will have a maturity period from June 26, 2025, to June 25, 2031, with a conversion period from January 2, 2026, to June 25, 2031 [4][5]. Company Profile - Forehope Electronic was established on November 13, 2017, and focuses on integrated circuit packaging and testing, primarily serving integrated circuit design companies [9][18]. - The company specializes in advanced packaging technologies, including QFN/DFN, BGA, and WLP, and has developed a strong reputation in the market for its high-density packaging solutions [18][24]. Financial Information - The company has a registered capital of RMB 409,625,930 as of May 26, 2025, and has undergone several capital changes since its establishment [9][15]. - The total amount raised from the bond issuance will be used for projects including advanced packaging technology research and development [30]. Market Position - The integrated circuit packaging and testing industry is capital and technology-intensive, with high barriers to entry. Forehope competes primarily with leading domestic companies such as Changjiang Electronics Technology, Huatian Technology, and Tongfu Microelectronics [20][22]. - The company has established strategic partnerships with numerous well-known design firms, enhancing its market presence and customer base [25][26]. Competitive Advantages - Forehope has a strong focus on R&D, with 1,025 technical staff, representing 17.89% of its total workforce, and holds numerous patents in advanced packaging technologies [26][27]. - The company has been recognized as a high-tech enterprise and has received accolades from clients for its service quality and product reliability [25][26].

股票简称：甬矽电子 股票代码：688362 甬矽电子（宁波）股份有限公司 Forehope Electronic （Ningbo）Co.,Ltd. （浙江省余姚市中意宁波生态园兴舜路 22 号） 向不特定对象发行可转换公司债券 上市公告书 保荐人（主承销商） （深圳市福田区福田街道益田路 5023 号平安金融中心 B 座第 22-25 层） 二〇二五年七月 1 第一节 重要声明与提示 甬矽电子（宁波）股份有限公司（以下简称"甬矽电子""发行人""公司" 或"本公司"）全体董事、监事和高级管理人员保证上市公告书的真实性、准确 性、完整性，承诺上市公告书不存在虚假记载、误导性陈述或重大遗漏，并对其 内容的真实性、准确性和完整性承担个别和连带的法律责任。 根据《中华人民共和国公司法》（以下简称"《公司法》"）、《中华人民 共和国证券法》（以下简称"《证券法》"）等有关法律、法规的规定，本公司 董事、高级管理人员已依法履行诚信和勤勉尽责的义务和责任。 中国证券监督管理委员会（以下简称"中国证监会"）、上海证券交易所（以 下简称"上交所"）、其他政府机关对本公司可转换公司债券上市及有关事项的 意见，均不表明对本公司的任 ...