（文章来源：证券日报） 证券日报网讯 1月19日，甬矽电子在互动平台回答投资者提问时表示，公司目前稼动率饱满，产品价格 稳中向好。 ...

第1笔成交价格为47.65元，成交7.49万股，成交金额356.85万元，溢价率为-5.00%，买方营业部为中信 证券股份有限公司上海世博馆路证券营业部，卖方营业部为中信证券股份有限公司杭州延安路证券营业 部。 炒股就看金麒麟分析师研报，权威，专业，及时，全面，助您挖掘潜力主题机会！ 1月19日，甬矽电子收跌3.93%，收盘价为50.16元，发生1笔大宗交易，合计成交量7.49万股，成交金额 356.85万元。 进一步统计，近3个月内该股累计发生2笔大宗交易，合计成交金额为753.65万元。该股近5个交易日累 计上涨20.72%，主力资金合计净流入3.29亿元。 责任编辑：小浪快报 ...

1月19日，甬矽电子大宗交易成交7.49万股，成交额356.85万元，占当日总成交额的0.21%，成交价47.65元，较市场收盘价50.16元折价5%。 | 交易日期 | 证券简称 | 证券代码 | 成交价(元) 成交金额(万元) 成交量( * ) 买入营业部 | | | | 卖出营业部 | | --- | --- | --- | --- | --- | --- | --- | --- | | 2026-01-19 | 角矽电子 | 688362 | 47.65 356.85 | 7.49 | 中信证券股份有限 公司上海世博馆路 | 中信证券股份有限 公司杭州延安路证 | | ...

Investment Rating - The industry investment rating is "Overweight" [1] Core Insights - The semiconductor industry is expected to experience significant growth driven by advancements in AI and high-end packaging technologies. TSMC has raised its capital expenditure guidance for 2026 to between $52 billion and $56 billion, a substantial increase of up to 36.9% from 2025, with a focus on advanced packaging and testing [3][4] - Major companies are actively expanding capacity to meet the rising demand for advanced packaging, with investments in new facilities and technologies across various sectors, including automotive and AI [4] - Price increases in packaging services are anticipated due to strong structural demand and rising raw material costs, with some companies already implementing price hikes of up to 30% [5] Summary by Sections Capital Expenditure and Growth - TSMC's capital expenditure for 2026 is projected to be between $52 billion and $56 billion, with advanced packaging investments expected to contribute over 10% of revenue by 2026 [3] - The revenue contribution from advanced packaging is expected to grow from approximately 8% in 2025 to slightly above 10% in 2026, indicating a higher growth rate than the overall company growth [3] Capacity Expansion - Major players like Changdian Technology and Jinglong Technology are investing heavily in new facilities to enhance their testing capabilities for high-end semiconductors, with investments reaching billions [4] - Companies such as Tongfu Microelectronics and Nexperia are also planning significant investments to boost their packaging capacities, indicating a trend of expansion in response to market demand [4] Price Trends in Packaging - The packaging industry is experiencing price increases driven by high demand for AI and memory chips, with companies like ASE and others in Taiwan raising prices by 5-20% and up to 30% respectively [5] - The increase in raw material costs, including metals like gold and copper, is contributing to the overall rise in packaging costs, which may lead to improved profitability for packaging companies [5] Investment Recommendations - Investors are advised to focus on domestic companies actively engaged in high-end advanced packaging, such as Changdian Technology and Tongfu Microelectronics, as well as those benefiting from the sector's growth like Yongxi Electronics and Huada Technology [6]

Core Viewpoint - The article discusses the significant investment and strategic shifts in the semiconductor packaging industry, particularly focusing on advanced packaging technologies driven by the AI wave and the structural changes in the storage industry [1][2]. Group 1: Investment and Market Trends - SK Hynix announced a 19 trillion KRW (approximately 12.9 billion USD) investment to build an advanced chip packaging factory in Cheongju, South Korea, reflecting the structural changes in the storage industry due to AI [1]. - The global advanced chip packaging market is projected to grow from 50.38 billion USD in 2025 to 79.85 billion USD by 2032, with a compound annual growth rate (CAGR) of 6.8% [2]. - By early 2026, leading packaging and testing companies are expected to ramp up advanced packaging capacity, indicating a competitive landscape focused on advanced packaging capabilities [2]. Group 2: TSMC's Dominance - TSMC is recognized as the leader in advanced packaging, holding over 60% market share in semiconductor manufacturing and establishing significant competitive barriers in advanced packaging technologies [2][3]. - TSMC has developed three branches of CoWoS technology: CoWoS-S for medium-sized chips, CoWoS-R for greater design flexibility, and CoWoS-L for large AI chips [3]. - TSMC's SoIC technology, based on CoWoS and wafer-on-wafer stacking, offers higher interconnect density and improved performance compared to traditional 2.5D packaging [3]. Group 3: Capacity Expansion and Technological Advancements - TSMC's CoWoS capacity is projected to increase 6-8 times from 2023 to 2026, with a CAGR exceeding 60% [5]. - TSMC's new advanced packaging facilities, including the flagship AP6 plant in Zhunan, are designed for full automation and are expected to handle significant orders from major clients like NVIDIA and AMD [5][6]. - TSMC is also expanding its advanced packaging capabilities in the U.S. with plans for two new facilities in Arizona, focusing on SoIC and CoPoS technologies [6]. Group 4: Competitors' Strategies - ASE, as the largest packaging and testing foundry, is benefiting from the advanced packaging trend, with over 60% of its ATM business expected to come from advanced packaging by 2025 [9]. - ASE is developing its own 2.5D packaging platform, FOCoS, and is expanding its production capacity across multiple sites, including a new K28 plant aimed at meeting the demand for AI and GPU chips [10][11]. - Amkor is enhancing its market position through partnerships, such as its collaboration with Intel on EMIB technology, and expanding its facilities in the U.S. to meet advanced packaging demands [15][16]. Group 5: Mainland China's Participation - Mainland Chinese companies are actively investing in advanced packaging technologies and capacity, with firms like Yongxi Electronics and Changjiang Electronics focusing on high-density packaging and automotive electronics [20][22]. - Yongxi Electronics is establishing a new production base in Malaysia to enhance its overseas strategy, while Changjiang Electronics is expanding its automotive electronics packaging capabilities [21][22]. - Tongfu Microelectronics is also increasing its advanced packaging capacity, particularly in automotive and high-performance computing sectors, to meet growing market demands [23][24]. Group 6: Future Outlook - The article concludes that while TSMC's dominance in advanced packaging is unlikely to be challenged in the short term, other specialized packaging firms are seeking to differentiate themselves through flexible capacity and innovative technologies [25][27]. - The collective expansion of packaging firms represents a significant industry bet on the demand for AI-driven computing power, with the potential for winners to emerge as the market stabilizes and technology paths clarify [27].

Group 1 - A-share market trading volume has returned to over 30 trillion yuan, with the Shanghai Composite Index closing at 4101.91 points, down 0.26% [1] - The semiconductor industry chain remains active, with stocks like Tianyue Advanced and Yongxi Electronics hitting the daily limit of 20% [1] - The electric grid equipment sector saw significant gains, with multiple stocks including Electric Power Research Institute and Senyuan Electric reaching their daily limit [1][2] Group 2 - The electric grid equipment sector is driven by supply-demand dynamics, with the State Grid Corporation announcing a planned investment of 4 trillion yuan during the 14th Five-Year Plan, a 40% increase from the previous plan [2] - The overseas market for electric grid investments is expected to accelerate, with supply shortages leading to extended delivery times for transformers and high-voltage cables [2] - The storage chip sector is experiencing strong performance, with companies like Baiwei Storage and Jibang Long hitting daily limits, driven by increased demand from AI and server capacity [4] Group 3 - Research indicates that the storage market is surpassing historical highs, with prices expected to rise by 40% to 50% in Q1 2026 and an additional 20% in Q2 [4] - The A-share market is anticipated to maintain a steady upward trend, supported by factors such as improved profitability and capital market reforms [5] - Investment strategies for 2026 suggest a balanced approach, focusing on high-yield opportunities, technology growth driven by AI, and cyclical recovery investments [6]

Core Viewpoint - The A-share market experienced moderate fluctuations with a total trading volume returning to over 3 trillion yuan, indicating a shift in capital from popular sectors like AI applications and communications to storage chips, automotive chips, and robotics actuators [1][4][6]. Market Performance - The Shanghai Composite Index fell by 0.26% to 4101.91 points, while the ChiNext Index decreased by 0.2% to 3361.02 points, and the Shenzhen Component Index dropped by 0.18% [6]. - The total trading volume across the three markets reached 3.06 trillion yuan, with margin trading balances increasing to 2.72 trillion yuan as of January 15 [6][16]. Sector Performance - The storage chip sector rose by 5.54%, third-generation semiconductors by 3.88%, automotive chips by 4.94%, and robotics actuators by 4.26% [8]. - In contrast, sectors such as media and computing saw significant declines, with media down by 4.84% and computing by 2.23% [9]. Capital Flow and Investment Strategy - Capital is being reallocated due to regulatory measures aimed at risk prevention and monetary policies supporting liquidity, leading to a diversified market structure [4][16]. - Investment strategies should focus on policy guidance, performance support, and valuation matching, particularly in sectors benefiting from domestic substitution and global chip technology breakthroughs [4][22]. Future Market Outlook - The market is expected to continue its oscillation around the 4100-point mark, with potential for structural opportunities in policy-supported sectors and high-performing stocks [19][20]. - Analysts suggest maintaining a neutral position while avoiding high-volatility stocks and focusing on sectors with strong fundamentals [19][22].

1月16日公开信息显示，沪股通席位共现身16只个股龙虎榜。 证券时报·数据宝统计显示，1月16日共有62只个股上榜龙虎榜，其中，16只个股前五大买卖营业部中出 现沪股通专用席位的身影。净买入的有佰维存储、华胜天成、大位科技等，净买入金额分别为21507.01 万元、11926.58万元、9556.89万元。净卖出的有航天机电、甬矽电子、外服控股，净卖出金额分别为 9855.99万元、6448.59万元、452.75万元。 | 代码 | 简称 | 沪股通专用席位净买入（万元） | 当日涨跌幅（%） | 当日换手率（%） | | --- | --- | --- | --- | --- | | 688525 | 佰维存储 | 21507.01 | 17.19 | 12.18 | | 600410 | 华胜天成 | 11926.58 | -9.95 | 43.47 | | 600589 | 大位科技 | 9556.89 | -6.15 | 24.03 | | 600703 | 三安光电 | 8209.91 | 10.03 | 6.50 | | 688234 | 天岳先进 | 7764.65 | 20.00 | 4.9 ...

两融数据显示，该股最新融资余额为4.29亿元，近5日减少4496.66万元，降幅为9.48%。 据天眼查APP显示，甬矽电子(宁波)股份有限公司成立于2017年11月13日，注册资本41048.303万人民 币。（数据宝） 1月16日甬矽电子大宗交易一览 | 成交量 | 成交金额 | 成交价 | 相对当日收盘 | | | | --- | --- | --- | --- | --- | --- | | （万 | （万元） | 格 | 折溢价（%） | 买方营业部 | 卖方营业部 | | 股） | | （元） | | | | | 8.00 | 396.80 | 49.60 | -5.00 | 中信证券股份有限公司上 | 中信证券股份有限公司杭 | | | | | | 海世博馆路证券营业部 | 州延安路证券营业部 | 甬矽电子1月16日大宗交易平台出现一笔成交，成交量8.00万股，成交金额396.80万元，大宗交易成交价 为49.60元，相对今日收盘价折价5.00%。该笔交易的买方营业部为中信证券股份有限公司上海世博馆路 证券营业部，卖方营业部为中信证券股份有限公司杭州延安路证券营业部。 证券时报·数据宝统计显示， ...

机构专用席位净买入金额最多的是雪人集团，该股今日收盘跌停，全天换手率为30.52%，成交额为44.65亿元。因日换手率达30.40%、日跌幅偏离 值达-9.87%上榜龙虎榜，前五大买卖营业部中有3家机构专用席位，为买一、买三、买五，合计净买入23406.96万元。同时上榜的还有深股通专用 席位，净买入665.56万元，营业部席位合计净卖出4.26亿元。资金流向方面，该股全天资金净流出5.67亿元。 通宇通讯，今日收盘下跌8.75%，全天换手率为34.05%，成交额为61.10亿元。因日换手率达34.05%上榜龙虎榜，前五大买卖营业部中有3家机构专 用席位，为买二、买三、买四，合计净买入21050.80万元。同时上榜的还有深股通专用席位，净买入2.18亿元，营业部席位合计净卖出8215.95万 元。资金流向方面，该股全天资金净流入2.60亿元。 红相股份，今日收盘上涨11.33%，全天换手率为40.36%，成交额为31.87亿元。因日换手率达40.36%上榜龙虎榜，前五大买卖营业部中有5家机构 专用席位，为买一、买二、买三、卖一、卖二，合计净买入20166.59万元。资金流向方面，该股全天资金净流入8997.2 ...