证券代码：688362 证券简称：甬矽电子 公告编号：2025-078 债券代码：118057 债券简称：甬矽转债 甬矽电子（宁波）股份有限公司 2024 年限制性股票激励计划首次授予部分 第一个归属期归属结果暨股份上市的公告 （一）2024 年 7 月 19 日，公司召开第三届董事会第七次会议，审议通过了《关 于<2024 年限制性股票激励计划（草案）>及其摘要的议案》《关于<2024 年限制性 股票激励计划实施考核管理办法>的议案》及《关于提请股东大会授权董事会办理 股权激励计划相关事宜的议案》等议案。 同日，公司召开第三届监事会第四次会议，审议通过了《关于<2024 年限制性 股票激励计划（草案）>及其摘要的议案》《关于<2024 年限制性股票激励计划实施 考核管理办法>的议案》及《关于核实<2024 年限制性股票激励计划首次授予激励 对象名单>的议案》，公司监事会对本次激励计划的相关事项进行核实并出具了相 关核查意见。公司于 2024 年 7 月 20 日在上海证券交易所网站（www.sse.com.cn） 披露了相关公告。 （二）2024 年 7 月 20 日至 2024 年 7 月 29 日，公司 ...

| 证券代码：688362 | 证券简称：甬矽电子 | 公告编号：2025-079 | | --- | --- | --- | | 债券代码：118057 | 债券简称：甬矽转债 | | 1、审议通过《关于"甬矽转债"转股价格调整的议案》 甬矽电子（宁波）股份有限公司 第三届董事会第二十一次会议决议公告 本公司董事会及全体董事保证本公告内容不存在任何虚假记载、误导性陈述或 者重大遗漏，并对其内容的真实性、准确性和完整性依法承担法律责任。 一、董事会会议召开情况 甬矽电子（宁波）股份有限公司（以下简称"公司"）第三届董事会第二十一次 会议于 2025 年 9 月 19 日以现场结合通讯会议方式在公司会议室召开。全体董事一致 同意豁免本次会议的提前通知期限，召集人已在董事会会议上就豁免董事会会议通知 的相关情况作出说明。会议由公司董事长王顺波主持，本次会议应出席董事 7 名，实 际出席董事 7 名。本次会议的召集、召开方式符合有关法律、法规和《甬矽电子（宁 波）股份有限公司章程》的规定，会议决议合法、有效。 二、董事会会议审议情况 本次会议经与会董事审议并以记名投票表决方式审议通过了相关的议案，形成决 议如下： ...

Investment Rating - The industry investment rating is maintained as "Outperform" [3] Core Insights - The semiconductor packaging and testing industry is experiencing significant growth driven by AI and advanced packaging technologies, with major players focusing on creating one-stop solutions for packaging and testing [1][5] - Key companies such as Jiayuan Electronics and Weicai Technology are increasing their capital expenditures and expanding high-end testing capacities, reflecting strong demand across various applications [2][5] - The overall gross margin for the domestic packaging sector has shown a notable increase, with leading companies like Huada Technology and Liyang achieving higher margins compared to the industry average [11][12] Summary by Sections Overview - The gross margin for the semiconductor packaging sector has significantly improved, reaching 21.44% in Q2 2025, which is higher than the average for previous quarters [11][12] OSAT (Outsourced Semiconductor Assembly and Test) - Daylight Technology's advanced packaging revenue has surpassed 10% of its total, with a recovery in general business observed [17] - Anke Technology reported a revenue of 10.779 billion RMB in Q2 2025, with a 14.3% quarter-on-quarter growth, driven by strong demand in various markets [30][31] - Powertech Technology's revenue reached 4.226 billion RMB in Q2 2025, reflecting a 16.56% quarter-on-quarter increase [39] Testing - Jiayuan Electronics has significantly increased its capital expenditure, with a 149.64% quarter-on-quarter growth in Q2 2025 [2][3] - Weicai Technology has seen strong revenue and profit growth in H1 2025, driven by the increasing demand for high-end testing services [5][20] Equipment - AI continues to be the main driver for industry growth, with strong demand for TCB, hybrid bonding, and SoC testing equipment [5][21] - ASMPT reported a 50% year-on-year increase in TCB equipment orders in H1 2025 [5][23] Market Trends - The smartphone market is experiencing regional differentiation, with strong growth in specific areas such as the Middle East and Africa [6][28] - The automotive sector is showing positive trends, particularly in the new energy vehicle segment, while traditional fuel vehicles are stabilizing [6][32] Investment Recommendations - The report suggests focusing on key players in packaging, testing, and equipment sectors, including Daylight Technology, Tongfu Microelectronics, and ASMPT, among others [5][34]

Investment Rating - The report maintains an investment rating of "Outperform the Market" for the semiconductor industry [4]. Core Insights - The semiconductor packaging sector has shown significant improvement in gross margins, with leading companies like Huada and Liyang experiencing notable growth [12][13]. - AI continues to be the primary driving force behind industry growth, with major OSAT players focusing on advanced packaging solutions [6][18]. - The report highlights the strong performance of key companies such as Tongfu Microelectronics and ASE Technology, driven by robust demand in AI and automotive electronics [50][47]. Summary by Sections 1. Overview - The gross margin of the semiconductor packaging sector has significantly increased, surpassing levels seen in 2024. In Q2 2025, the gross margin reached 21.44%, up 4.52 percentage points from the previous quarter [12][13]. 2. OSAT - **ASE Technology**: In Q2 2025, ASE's revenue reached 132.13 billion RMB, with a year-on-year growth of 6.68% and a quarter-on-quarter increase of 9.55%. The advanced packaging and testing business has shown strong growth, accounting for over 10% of total revenue [18][19]. - **Anke Technology**: Reported revenue of 107.79 billion RMB in Q2 2025, with a quarter-on-quarter growth of 14.3% and a year-on-year increase of 3.42%. The company is expanding its testing capabilities and focusing on advanced packaging solutions [31][39]. - **Powertech Technology**: Achieved a revenue of 42.26 billion RMB in Q2 2025, with a quarter-on-quarter growth of 16.56%. The company is set to restart significant capital expenditures to expand its production capacity [40][44]. 3. Testing - **King Yuan Electronics**: Capital expenditures surged to 26.62 billion RMB in Q2 2025, reflecting a 149.64% quarter-on-quarter increase and a 474.34% year-on-year increase. All application segments reported growth [2][29]. - **Weichai Technology**: Continued to enhance its high-end testing capacity, with strong revenue and profit growth in H1 2025, driven by AI and automotive electronics [5][35]. 4. Equipment - AI remains the main driver for industry development, with significant growth in TCB, hybrid bonding, and SoC testing machines. ASMPT reported a 50% year-on-year increase in TCB equipment orders in H1 2025 [5][4]. 5. Market Trends - The smartphone market is experiencing regional differentiation, with strong growth in specific areas such as the Middle East and Africa. The PC market saw an 8.4% year-on-year increase in shipments in Q2 2025 [6][11]. 6. Investment Recommendations - The report suggests focusing on companies involved in packaging, testing, and equipment, including ASE Technology, Tongfu Microelectronics, and ASMPT, as they are expected to benefit from the ongoing advancements in AI and semiconductor technology [6][50].

Wind数据显示，9月16日，5家上市公司回购股票，其中工业富联回购金额最高达771万元，回购数量 129万股，塔牌集团回购金额达502万元，回购数量56万股，甬矽电子回购金额达297万元，回购数量9万 股。 ...

证券代码：688362 证券简称：甬矽电子 公告编号：2025-076 债券代码：118057 债券简称：甬矽转债 甬矽电子（宁波）股份有限公司 关于股份回购实施结果暨股份 变动的公告 本公司董事会及全体董事保证本公告内容不存在任何虚假记载、误导性陈述或者重大遗漏，并对其内容 的真实性、准确性和完整性依法承担法律责任。 重要内容提示： ■ 一、回购审批情况和回购方案内容 2024年10月28日，甬矽电子（宁波）股份有限公司（以下简称"公司"）召开第三届董事会第十次会议， 审议通过了《关于以集中竞价交易方式回购公司股份方案的议案》，同意使用招商银行股份有限公司宁 波分行提供的专项贷款及公司自有资金通过上海证券交易所交易系统以集中竞价交易方式回购公司已发 行的部分人民币普通股（A股）股票。本次回购价格不超过人民币32.44元/股（含），回购股份的总金 额不低于人民币7,000万元（含），不超过人民币9,000万元（含）。本次回购的股份将在未来适宜时机 拟用于员工持股计划及/或股权激励计划，或用于转换上市公司发行的可转换为股票的公司债券。回购 期限为自董事会审议通过本次回购股份方案之日起12个月内。具体内容详见公司 ...

每经AI快讯，甬矽电子（SH 688362，收盘价：34.36元）9月15日晚间发布公告称，2025年9月15日，公 司完成回购，公司通过上海证券交易所交易系统以集中竞价交易方式已累计回购公司股份约266万股， 占公司总股本的0.65%，回购成交的最高价为32.33元/股，最低价为23.79元/股，回购均价为26.92元/ 股，支付的资金总额为人民币约7149万元。 每经头条（nbdtoutiao）——重大突破！中国这款新药，中美官方都认定有突破性疗效！世界肺癌大会 沸腾了 2024年1至12月份，甬矽电子的营业收入构成为：集成电路封装测试占比97.96%，其他业务占比 2.04%。 截至发稿，甬矽电子市值为141亿元。 （记者 曾健辉） ...

格隆汇9月15日丨甬矽电子(688362.SH)公布，2025年9月15日，公司完成回购，公司通过上海证券交易 所交易系统以集中竞价交易方式已累计回购公司股份265.53万股，占公司总股本的0.65%，回购成交的 最高价为32.33元/股，最低价为23.79元/股，回购均价为26.92元/股，支付的资金总额为人民币7149.21万 元（不含印花税、交易佣金等交易费用）。 ...

| 证券代码：688362 | 证券简称：甬矽电子 | 公告编号：2025-076 | | --- | --- | --- | | 债券代码：118057 | 债券简称：甬矽转债 | | 甬矽电子（宁波）股份有限公司 关于股份回购实施结果暨股份变动的公告 本公司董事会及全体董事保证本公告内容不存在任何虚假记载、误导性陈述 或者重大遗漏，并对其内容的真实性、准确性和完整性依法承担法律责任。 重要内容提示： | 回购方案首次披露日 | 2024/10/29 | | | | | | | | | --- | --- | --- | --- | --- | --- | --- | --- | --- | | 回购方案实施期限 | 年 月 2024 10 | 10 | 28 | 日~2025 | 年 | 月 | 27 | 日 | | 预计回购金额 | 7,000万元~9,000万元 | | | | | | | | | 回购价格上限 | 32.44元/股 | | | | | | | | | 回购用途 | □减少注册资本 √用于员工持股计划或股权激励 √用于转换公司可转债 | | | | | | | | | | □为维护公司 ...

一、可转换公司债券发行上市概况 | 证券代码：688362 | 证券简称：甬矽电子 | 公告编号：2025-077 | | --- | --- | --- | | 债券代码：118057 | 债券简称：甬矽转债 | | 本公司董事会及全体董事保证本公告内容不存在任何虚假记载、误导性陈述 或者重大遗漏，并对其内容的真实性、准确性和完整性依法承担法律责任。 重要内容提示： 根据相关法律法规规定及《甬矽电子（宁波）股份有限公司向不特定 对象发行可转换公司债券募集说明书》（以下简称"《募集说明书》"）的约 定，甬矽电子（宁波）股份有限公司（以下简称"公司"）本次发行的"甬矽 转债"自2026年1月2日起可转换为公司股份。 公司现就本次向不特定对象发行可转换公司债券，对不符合上海证券 交易所科创板股票投资者适当性要求的投资者所持"甬矽转债"不能转股的风 险，提示如下： 三、其他 投资者如需了解"甬矽转债"的详细情况，请查阅公司于2025年6月24日在 上海证券交易所网站（www.sse.com.cn）披露的《甬矽电子（宁波）股份有限 公司向不特定对象发行可转换公司债券募集说明书》。 （一）可转债发行情况 经中国证券监督 ...