Core Viewpoint - Company plans to invest in a new integrated circuit packaging and testing production base in Malaysia, with a total investment not exceeding 2.1 billion RMB, accounting for approximately 13.68% of the company's total assets [1][5]. Investment Project Details - Investment Type: New Project [2] - Project Name: Integrated Circuit Packaging and Testing Production Base in Malaysia [2] - Main Content: Production lines and supporting facilities for integrated circuit packaging and testing [2] - Location: Penang, Malaysia [2] - Total Investment Amount: Not exceeding 210,000 million RMB [2] - Company Investment Amount: Not exceeding 210,000 million RMB [2] - Construction Period: 60 months [2] - Within Main Business Scope: Yes [2] Strategic Importance - Malaysia holds a significant position in global semiconductor manufacturing, particularly in packaging and testing, with Penang being a key hub attracting major international chip manufacturers [3][7]. - The project aims to leverage the local market environment and industrial foundation to expand the company's overseas market scale and enhance revenue levels, thereby consolidating and improving the company's industry position [3][7]. Financial Performance Forecast - Company expects to achieve operating revenue of 4.2 billion to 4.6 billion RMB in 2025, representing a year-on-year increase of 16.37% to 27.45% [8]. - Projected net profit for 2025 is estimated to be between 75 million and 100 million RMB, with a year-on-year growth of 13.08% to 50.77% [8]. - Expected net profit after deducting non-recurring items for 2025 is projected to be between -50 million and -30 million RMB [8]. Market Dynamics - The global semiconductor industry continues to grow, driven by demand in artificial intelligence, high-performance computing, and data center infrastructure [10]. - The company benefits from the sustained growth of overseas major clients and the development of domestic core SoC customer groups, maintaining revenue growth [10]. - An increase in the proportion of advanced packaging products and optimization of product structure, along with scale effects, have contributed to a decrease in unit manufacturing costs and period expense ratios, driving net profit growth [10].

Core Viewpoint - The company plans to invest in a new integrated circuit packaging and testing production base project in Malaysia, with a total investment not exceeding 210 million RMB, which represents approximately 13.68% of the company's total assets as of September 30, 2025 [2][5]. Investment Overview - The investment is aimed at enhancing the company's overseas strategic layout and promoting the development of its overseas business [5]. - The project has been approved by the company's board of directors and does not require shareholder approval [7][8]. - The investment will be executed through cash contributions from the company's own funds and self-raised funds, without involving raised capital [12][13]. Project Details - The project is currently in the preparatory stage and has not yet completed the necessary approval procedures, leading to uncertainty regarding the approval results [10]. - The project is expected to leverage Malaysia's significant position in the global semiconductor manufacturing sector, particularly in packaging and testing, to expand the company's overseas market scale and enhance revenue levels [11]. Impact on the Company - The investment aligns with national industrial policy and the company's overall strategic layout, representing a significant strategic move to seize industry development opportunities and achieve overseas industrial deployment [13]. - Upon completion, the project is anticipated to effectively address future capacity shortages, strengthen the company's market share in the global integrated circuit packaging and testing sector, and enhance strategic cooperation with overseas major clients [13].

甬矽电子(688362.SH)发布公告，根据公司战略规划，为进一步完善公司海外战略布局，推动海外业务 发展进程，公司拟投资新建马来西亚集成电路封装和测试生产基地项目，投资总额不超过人民币21亿元 (实际投资金额以中国及当地主管部门批准金额为准)，约占公司总资产的13.68%(截至2025年9月30日)。 该项目建设内容主要为系统级封装产品等封装产品，下游应用领域包括AIoT、电源模组等。本次对外 投资符合国家产业政策导向及公司整体战略布局，是公司把握行业发展机遇、实现海外产业布局的重要 战略举措。项目建成后，一方面将有效补充公司未来业务发展面临的产能缺口，巩固并提升公司在全球 集成电路封装和测试业务市场的份额;另一方面将有利于深化公司与海外大客户的战略合作、进一步增 强盈利能力、降低运营风险及提高综合竞争力。 ...

Core Viewpoint - The company, Yongxi Electronics, plans to invest up to 2.1 billion RMB in a new integrated circuit packaging and testing production base in Malaysia, which represents approximately 13.68% of its total assets as of September 30, 2025 [1] Group 1: Investment Details - The total investment for the project will not exceed 2.1 billion RMB, subject to approval from Chinese and local authorities [1] - The project will focus on system-level packaging products, with downstream applications including AIoT and power modules [1] Group 2: Strategic Importance - This investment aligns with national industrial policy and the company's overall strategic layout, marking a significant step in capturing industry development opportunities and establishing an overseas presence [1] - Upon completion, the project is expected to address future capacity shortages, strengthen the company's market share in global integrated circuit packaging and testing, and enhance strategic cooperation with overseas major clients [1] - The initiative aims to improve profitability, reduce operational risks, and increase overall competitiveness [1]

Group 1 - Baiwei Storage's second largest shareholder, the National Integrated Circuit Fund Phase II, plans to reduce its stake by no more than 2% of the company's shares, equating to approximately 934.26 million shares [1][6] - Rongbai Technology expects a net loss of 150 million to 190 million yuan for 2025, but anticipates turning a profit in the fourth quarter with an estimated net profit of around 30 million yuan [8] - Yongxi Electronics plans to invest no more than 2.1 billion yuan in building an integrated circuit packaging and testing production base in Malaysia, which will account for approximately 13.68% of the company's total assets [9][10] Group 2 - Zhenyou Technology reported that revenue from the satellite internet sector accounted for about 7.15% of its total revenue in the first three quarters of 2025, indicating a low impact on overall performance [4] - Aerospace Hongtu stated that its main business is still in the satellite application stage, with no significant changes in market conditions or internal operations [5] - Ligong Navigation noted that its business planning in the commercial aerospace application field is still in the early stages, with revenue of approximately 154,400 yuan for the first nine months of 2025 [7] Group 3 - Zhongke Xingtou highlighted that its stock price increase is not supported by actual performance in the commercial aerospace sector, with related revenue accounting for 13.89% of total revenue [7] - Xinkai Mobile reported that its revenue from the satellite internet sector is approximately 2% to 3% of total revenue, which does not significantly impact overall performance [12] - Huayin Technology is focusing on special functional materials and exploring business opportunities in the aerospace sector, but the contribution of these products to revenue remains uncertain [16]

| 证券代码：688362 | 证券简称：甬矽电子 公告编号：2026-004 | | --- | --- | | 债券代码：118057 | 债券简称：甬矽转债 | 甬矽电子（宁波）股份有限公司 关于对外投资的公告 本公司董事会及全体董事保证本公告内容不存在任何虚假记载、误导性陈述 或者重大遗漏，并对其内容的真实性、准确性和完整性依法承担法律责任。 重要内容提示： 投资标的名称：马来西亚集成电路封装和测试生产基地项目。 投资金额：项目投资总额不超过 210,000 万元人民币（实际投资金额 以中国及当地主管部门批准金额为准），约占公司总资产的 13.68%（截至 2025 年 9 月 30 日）。 交易实施尚需履行的审批及其他相关程序：本次对外投资事项已经甬 矽电子（宁波）股份有限公司（以下简称"公司"）第三届董事会战略与可持 续发展委员会第三次会议、第三届董事会第二十六次会议审议通过。该事项 未达到股东会审议标准，无需提交公司股东会审议。本次对外投资尚需履行 境内对境外投资审批或备案手续，以及马来西亚当地相关部门的备案或审批 手续。 3、本次对外投资项目的建设计划和建设周期及规模等可能根据外部环境变 化、 ...

来源：格隆汇APP 格隆汇1月12日丨甬矽电子(688362.SH)公布，根据公司战略规划，为进一步完善公司海外战略布局，推 动海外业务发展进程，公司拟投资新建马来西亚集成电路封装和测试生产基地项目，投资总额不超过人 民币21亿元(实际投资金额以中国及当地主管部门批准金额为准)，约占公司总资产的13.68%(截至2025 年9月30日)。 ...

人民财讯1月12日电，甬矽电子(688362)1月12日公告，为进一步完善公司海外战略布局，推动海外业务 发展进程，公司拟投资新建马来西亚集成电路封装和测试生产基地项目，项目建设内容主要为系统级封 装产品等封装产品，下游应用领域包括AIoT、电源模组等，投资总额不超过人民币21亿元。项目建设 周期为60个月。 ...

投资建议：结合行业动态及公司2025 年业绩预告，我们调整原有预测，预计2025-2027 年， 公司营业 收入分别为45.24/55.73/67.06 亿元， 增速分别为25.3%/23.2%/20.3% ； 归母净利润分别为0.94/2.37/3.70 亿元， 增速分别为41.1%/152.9%/56.3%。考虑到甬矽电子"Bumping+CP+FC+FT"的一站式交付能力形 成，二期项目产能逐步释放/下游客户群及应用领域不断扩大，叠加中国台湾地区头部IC 设计客户收入 持续增长&local for local 供应链趋势下客户持续拓展，盈利能力有望改善，维持"增持"评级。 风险提示：下游终端需求不及预期；行业与市场波动风险；国际贸易摩擦风险；新技术、新工艺、新产 品无法如期产业化风险；主要原材料供应及价格变动风险等。 AI 带动行业景气度，产线建设/客群拓展/规模效应三线并举。2025 年，全球半导体产业在人工智能、 高性能计算、数据中心基础设施建设等需求的拉动下，延续增长态势。得益于海外大客户的持续放量和 国内核心端侧SoC 客户群的成长，公司营业收入规模保持增长。根据公司披露，预计公司2025 年实 ...

Core Viewpoint - 15 companies listed on the Sci-Tech Innovation Board have provided earnings forecasts for 2025, with 8 companies expecting profit increases, 3 companies expecting reduced losses, 2 companies expecting profit declines, and 2 companies expecting losses [1] Group 1: Earnings Forecast Overview - 53.33% of the companies forecast profit increases, with 8 out of 15 companies reporting positive earnings forecasts [1] - Among the companies expecting profit increases, 2 companies anticipate a net profit growth exceeding 100%, while 2 companies expect growth between 50% and 100% [1] Group 2: Individual Company Forecasts - Zhongke Lanyun (688332) expects the highest net profit growth of 371.51% [1] - Bai'ao Saituo (688796) and Qiangyi Co., Ltd. (688809) forecast net profit growth of 303.57% and 66.24%, ranking second and third respectively [1] - Other notable forecasts include: - Xinpeng Micro (688508) with a 66.00% increase - Muxi Co., Ltd. (688802) with a reduced loss of 54.22% [1] Group 3: Detailed Company Performance - Companies with profit increases: - Zhongke Lanyun: 371.51% [1] - Bai'ao Saituo: 303.57% [1] - Qiangyi Co., Ltd.: 66.24% [1] - Xinpeng Micro: 66.00% [1] - Daotong Technology (688208): 42.76% [1] - More Thread (688795): 41.36% [1] - Jianxin Superconductor (688805): 33.55% [1] - Yongxi Electronics (688362): 31.93% [1] - Youxun Co., Ltd. (688807): 22.01% [1] - Companies with reduced losses: - Muxi Co., Ltd.: 54.22% [1] - More Thread: 41.36% [1] - Zhenhua New Materials (688707): 14.73% [1] - Companies expecting losses: - Angrui Micro (688790): -19.44% [1] - Electric Wind Power (688660): -26.15% [1] - Companies expecting profit declines: - Zhongkong Technology (688777): -57.46% [1] - Aotewei (688516): -60.65% [1]