Financial Performance - The company's operating revenue for 2024 reached ¥1,501,019,718.15, representing a year-over-year increase of 21.22% compared to ¥1,238,293,041.85 in 2023[26]. - The net profit attributable to shareholders for 2024 was ¥159,764,193.29, a decrease of 18.48% from ¥195,985,017.79 in 2023[26]. - The net profit attributable to shareholders after deducting non-recurring gains and losses was ¥134,003,912.85, down 20.33% from ¥168,194,709.94 in 2023[26]. - The net cash flow from operating activities for 2024 was ¥500,863,803.23, an increase of 42.51% compared to ¥351,459,642.36 in 2023[26]. - The net assets attributable to shareholders at the end of 2024 were ¥3,201,070,920.63, reflecting a 2.20% increase from ¥3,132,030,678.41 at the end of 2023[26]. - The total assets at the end of 2024 amounted to ¥4,591,223,702.62, a 27.67% increase from ¥3,596,296,963.42 at the end of 2023[26]. - The basic earnings per share for 2024 was RMB 0.19, down 17.39% from RMB 0.23 in 2023[27]. - The weighted average return on equity fell to 5.12%, a decrease of 1.37 percentage points compared to 6.49% in 2023[27]. - The gross profit margin for the main business decreased by 4.83 percentage points to 22.34% due to increased fixed costs and competitive pricing pressures[37]. Dividend and Profit Distribution - The company plans to distribute a cash dividend of 0.95 CNY per 10 shares, totaling approximately 78.48 million CNY, which represents 49.12% of the net profit attributable to shareholders for the year 2024[7]. - The profit distribution plan has been approved by the board and will be submitted for shareholder approval[8]. - The total cash dividend amount, including share repurchase, was approximately CNY 178.45 million, which is 111.70% of the net profit attributable to ordinary shareholders[193]. - The cash dividend policy is in compliance with regulatory requirements and protects the rights of minority shareholders[192]. Research and Development - Research and development expenses accounted for 5.96% of operating revenue, down 0.41 percentage points from 6.37% in 2023[27]. - The company achieved a total R&D investment of ¥89,406,936.25, representing a 13.38% increase compared to the previous year[68]. - The company holds a total of 47 invention patents and 442 utility model patents as of the end of the reporting period[66]. - The company has developed advanced bumping technology, enabling the production of over 4,000 gold bumps on a single chip measuring approximately 30mm by 1mm[63]. - The company is currently working on six major R&D projects, with a total expected investment of ¥4,800,000, and several projects have already entered mass production[71]. Market Trends and Competition - In 2024, global semiconductor sales are projected to reach $627.6 billion, representing a year-over-year growth of 19.1%[38]. - The global integrated circuit packaging market size in 2023 was $85.7 billion, with advanced packaging accounting for approximately 48.8%[38]. - The implementation of the "national subsidy" policy is expected to boost the demand for display driver chips, particularly for COF chips used in large-size panels[39]. - New entrants in the display driver chip packaging and testing sector are intensifying competition, potentially impacting pricing and customer orders[42]. - The company is experiencing increased competition from new entrants in the display driver chip packaging and testing sector, which may impact its market position[89]. Corporate Governance - The company has established a robust corporate governance structure, ensuring compliance with relevant laws and regulations[153]. - The company has established a supervisory board consisting of 3 members, complying with legal and regulatory requirements[156]. - The company adheres to the information disclosure obligations as per the Shanghai Stock Exchange regulations, ensuring timely and accurate reporting[158]. - The company actively maintains transparency and equal information access for all shareholders, protecting minority investor rights[158]. Risk Management - The company has faced various operational risks, which are detailed in the report's section on risk factors[5]. - The company has not reported any non-operational fund occupation by controlling shareholders or related parties[11]. - The company faces risks from high customer concentration, with significant reliance on a few major clients for revenue stability[90]. - The company is focused on risk management in foreign exchange hedging, implementing strict internal controls and monitoring market conditions[134]. Strategic Initiatives - The company is investing in new production capacity for copper-nickel-gold and palladium bumping processes to diversify its packaging solutions[43]. - The company is focusing on market expansion in high-end display driver chips and automotive chips, with ongoing R&D in flexible substrate packaging technology[72]. - The company is exploring potential acquisitions to further enhance its product offerings and market presence[166]. - The company is committed to improving its quality control system to enhance customer satisfaction and maintain product quality[150]. Employee and Management Structure - The total number of employees in the parent company and major subsidiaries is 1,559, with 926 in the parent company and 633 in subsidiaries[186]. - The company has a comprehensive compensation system and assessment mechanism for employees, including various bonuses and benefits[188]. - The total remuneration for core technical personnel at the end of the reporting period was 1.03 million RMB[175]. - The company has appointed several directors and supervisors across various subsidiaries, indicating a strategic focus on governance and oversight in the semiconductor and technology sectors[171].

重要内容提示： 每股分配比例：每 10 股派发现金红利 0.95 元（含税），不进行资本公积 金转增股本，不送红股。 本次利润分配拟以实施权益分派股权登记日登记的总股本扣减公司回购 专用证券账户中的股份余额为基数，登记日具体日期将在权益分派实施公告中 明确。 2024 年度利润分配预案公告 本公司董事会及全体董事保证本公告内容不存在任何虚假记载、误导性陈 述或者重大遗漏，并对其内容的真实性、准确性和完整性依法承担法律责任。 | 证券代码：688403 | 证券简称：汇成股份 | 公告编号：2025-008 | | --- | --- | --- | | 转债代码：118049 | 转债简称：汇成转债 | | 合肥新汇成微电子股份有限公司 如在实施权益分派的股权登记日前公司总股本发生变动的，公司拟维持 每股分配比例不变，相应调整利润分配总额，并将在权益分派实施公告中披露 具体调整情况。 本次利润分配预案已经公司第二届董事会第九次会议、第二届监事会第 八次会议审议通过，尚需提交公司 2024 年年度股东大会审议。 一、利润分配预案内容 经天健会计师事务所（特殊普通合伙）审计，合肥新汇成微电子股份有限 公司（以下简 ...

一、主要会计数据和财务指标 | 报告期指标 | 2024年年报 | 2023年年报 | 本年比上年增减(%) | 2022年年报 | | --- | --- | --- | --- | --- | | 基本每股收益（元） | 0.1900 | 0.2300 | -17.39 | 0.2400 | | 每股净资产（元） | 3.78 | 3.75 | 0.8 | 3.48 | | 每股公积金(元) | 2.61 | 2.56 | 1.95 | 2.52 | | 每股未分配利润(元) | 0.21 | 0.13 | 61.54 | -0.08 | | 每股经营现金流(元) | - | - | - | - | | 营业收入(亿元) | 15.01 | 12.38 | 21.24 | 9.4 | | 净利润(亿元) | 1.6 | 1.96 | -18.37 | 1.77 | | 净资产收益率(%) | 5.12 | 6.49 | -21.11 | 9.19 | 数据四舍五入，查看更多财务数据>> 二、前10名无限售条件股东持股情况 前十大流通股东累计持有： 17069.75万股，累计占流通股比： 29.48%，较上 ...

转债代码：118049 转债简称：汇成转债 证券代码：688403 证券简称：汇成股份 公告编号：2025-007 合肥新汇成微电子股份有限公司 关于更换持续督导保荐代表人的公告 本公司董事会及全体董事保证本公告内容不存在任何虚假记载、误导性陈述或者 重大遗漏，并对其内容的真实性、准确性和完整性依法承担法律责任。 合肥新汇成微电子股份有限公司董事会 2025年3月12日 2 / 3 附件：赵庆辰先生简历 本次保荐代表人的变更不会改变相关材料中保荐机构及保荐代表人已出具文件的 结论性意见，不涉及更新保荐机构已出具的相关材料；保荐机构及保荐代表人将继续 对之前所出具的相关文件之真实性、准确性和完整性承担相应的法律责任。 本次保荐代表人更换后，公司首次公开发行股票并在科创板上市项目的持续督导 保荐代表人为赵庆辰先生、何立先生。 公司董事会对吴俊先生在公司首次公开发行股票并在科创板上市及持续督导期间 为公司所做出的杰出贡献表示衷心的感谢！ 特此公告。 1 / 3 合肥新汇成微电子股份有限公司（以下简称"公司"）于近日收到持续督导机构海 通证券股份有限公司（以下简称"海通证券"）关于更换公司持续督导保荐代表人的书 面函 ...

Financial Performance - The total operating revenue for 2024 reached RMB 150,101.97 million, representing a year-on-year increase of 21.22%[4] - The net profit attributable to the parent company was RMB 15,976.42 million, a decrease of 18.48% compared to the previous year[4] - The net profit attributable to the parent company after deducting non-recurring gains and losses was RMB 13,399.41 million, down 20.33% year-on-year[4] - The basic earnings per share decreased to RMB 0.19, down 17.39% from RMB 0.23 in the previous year[4] - The weighted average return on equity fell to 5.12%, a decrease of 1.37 percentage points compared to the previous year[4] Assets and Equity - The total assets at the end of the reporting period were RMB 459,122.37 million, an increase of 27.67% from the beginning of the period[6] - The equity attributable to the parent company was RMB 320,107.09 million, reflecting a growth of 2.20% from the beginning of the period[5] Financial Costs and Production Capacity - The company experienced increased financial costs due to higher borrowing interest and convertible bond interest after the issuance[7] - The company’s production capacity is still ramping up, which has affected the gross profit margin and overall operating performance[6] Data Consistency - There were no financial data or indicators with a change of 30% or more during the reporting period[9]

| 证券代码：688403 | 证券简称：汇成股份 | 公告编号：2025-005 | | --- | --- | --- | | 转债代码：118049 | 转债简称：汇成转债 | | 合肥新汇成微电子股份有限公司 关于注销可转换公司债券部分募集资金专户的公告 本公司董事会及全体董事保证本公告内容不存在任何虚假记载、误导性陈述或者 重大遗漏，并对其内容的真实性、准确性和完整性依法承担法律责任。 一、募集资金基本情况 根据中国证券监督管理委员会出具的《关于同意合肥新汇成微电子股份有限公司 向不特定对象发行可转换公司债券注册的批复》（证监许可〔2024〕883 号），合肥新汇 成微电子股份有限公司（以下简称"公司"）获准于 2024 年 8 月 7 日向不特定对象发行 11,487,000 张可转换公司债券，每张面值为人民币 100.00 元，按面值发行，募集资金总 额为人民币 1,148,700,000.00 元，扣除不含税发行费用人民币 6,172,108.48 元，实际募 集资金净额为人民币 1,142,527,891.52 元。上述募集资金已于 2024 年 8 月 13 日到位。 天健会计师事务所（特 ...

证券代码：688403 证券简称：汇成股份 公告编号：2025-004 转债代码：118049 转债简称：汇成转债 合肥新汇成微电子股份有限公司 关于可转债投资者适当性要求的风险提示性公告 本公司董事会及全体董事保证本公告内容不存在任何虚假记载、误导性陈述或者 重大遗漏，并对其内容的真实性、准确性和完整性依法承担法律责任。 重要内容提示： 根据相关法律法规规定以及《合肥新汇成微电子股份有限公司向不特定对象发 行可转换公司债券募集说明书》的约定，合肥新汇成微电子股份有限公司（以下简称 "公司"）2024 年发行的"汇成转债"自 2025 年 2 月 13 日起可转换为公司股份。转股 起止日期为 2025 年 2 月 13 日至 2030 年 8 月 6 日（如遇法定节假日或休息日则延至其 后的第一个工作日，顺延期间付息款项不另计息）。 公司对不符合上海证券交易所科创板股票投资者适当性要求的投资者所持"汇成 转债"不能转股的风险，提示如下： 一、可转债发行上市概况 公司为科创板上市公司，本次向不特定对象发行可转换公司债券，参与可转债转 股的投资者，应当符合科创板股票投资者适当性管理要求。参与科创板可转债的投资 者 ...

证券代码：688403 证券简称：汇成股份 公告编号：2025-003 转债代码：118049 转债简称：汇成转债 合肥新汇成微电子股份有限公司 关于可转债投资者适当性要求的风险提示性公告 本公司董事会及全体董事保证本公告内容不存在任何虚假记载、误导性陈述或者 重大遗漏，并对其内容的真实性、准确性和完整性依法承担法律责任。 重要内容提示： 根据相关法律法规规定以及《合肥新汇成微电子股份有限公司向不特定对象发 行可转换公司债券募集说明书》的约定，合肥新汇成微电子股份有限公司（以下简称 "公司"）2024 年发行的"汇成转债"自 2025 年 2 月 13 日起可转换为公司股份。转股 起止日期为 2025 年 2 月 13 日至 2030 年 8 月 6 日（如遇法定节假日或休息日则延至其 后的第一个工作日，顺延期间付息款项不另计息）。 经上海证券交易所自律监管决定书〔2024〕114 号文同意，公司发行的 114,870.00 万元可转换公司债券已于 2024 年 9 月 2 日起在上海证券交易所上市交易，债券简称 "汇成转债"，债券代码"118049"。 公司本次发行的可转债转股期自可转债发行结束之日（202 ...

证券代码：688403 证券简称：汇成股份 公告编号：2025-002 转债代码：118049 转债简称：汇成转债 合肥新汇成微电子股份有限公司 关于"汇成转债"开始转股的公告 本公司董事会及全体董事保证本公告内容不存在任何虚假记载、误导性陈述或者 重大遗漏，并对其内容的真实性、准确性和完整性依法承担法律责任。 重要内容提示： 转股价格：7.70 元/股 转股起止日期：自 2025 年 2 月 13 日起至 2030 年 8 月 6 日止（如遇法定节假日 或休息日则延至其后的第一个工作日，顺延期间付息款项不另计息） 一、可转债发行上市概况 根据中国证券监督管理委员会出具的《关于同意合肥新汇成微电子股份有限公司 向不特定对象发行可转换公司债券注册的批复》（证监许可〔2024〕883 号），合肥新汇 成微电子股份有限公司（以下简称"公司"或"本公司"）获准于 2024 年 8 月 7 日向不 特定对象发行 11,487,000 张可转换公司债券，每张面值为人民币 100.00 元，按面值发 行，募集资金总额为人民币 1,148,700,000.00 元，扣除不含税发行费用人民币 6,172,108.48 元，实际 ...

一、可转换公司债券发行上市概况 根据中国证券监督管理委员会出具的《关于同意合肥新汇成微电子股份有限公司 向不特定对象发行可转换公司债券注册的批复》（证监许可〔2024〕883 号），公司获准 于 2024 年 8 月 7 日向不特定对象发行了 11,487,000 张可转换公司债券，每张面值为人 民币 100.00 元，按面值发行，募集资金总额为人民币 1,148,700,000.00 元，扣除不含税 发行费用人民币 6,172,108.48 元，实际募集资金净额为人民币 1,142,527,891.52 元。发 行方式采用向股权登记日收市后中国证券登记结算有限公司上海分公司登记在册的公 司原股东优先配售，原股东优先配售后余额（含原股东放弃优先配售部分）通过上海 证券交易所系统网上向社会公众投资者发售的方式进行，余额由保荐人（主承销商） 包销。 关于可转债投资者适当性要求的风险提示性公告 本公司董事会及全体董事保证本公告内容不存在任何虚假记载、误导性陈述或者 重大遗漏，并对其内容的真实性、准确性和完整性依法承担法律责任。 重要内容提示： 证券代码：688403 证券简称：汇成股份 公告编号：2025-001 ...