Group 1: Financial Performance - The company achieved a revenue of 2.88 billion CNY in the first half of the year, representing a year-on-year growth of 14.27% [3] - The net profit attributable to the parent company was -471 million CNY, a reduction in losses by 638 million CNY compared to the same period last year, marking a year-on-year improvement of 57.53% [3] Group 2: Market Demand and Growth Drivers - Revenue growth is primarily driven by three sectors: the new energy vehicle market, high-end consumer market, and domestic substitution demand [4] - The new energy vehicle market is accelerating towards centralization, with the company expected to increase its market share due to technological advantages [4] - The high-end consumer market has seen a significant increase in product shipments, particularly with the growth of AI-related products [4] Group 3: Future Outlook - The company maintains a cautiously optimistic outlook for the second half of 2024, anticipating continued double-digit revenue growth driven by the recovery of the consumer market and the expansion of the new energy vehicle market [4] - The domestic substitution rate is expected to rise from 30% to over 90% as the market matures [5] Group 4: Strategic Initiatives - The company has established three core growth curves covering different product areas and application directions, ensuring stable revenue growth [3] - The company is actively expanding its overseas market presence, enhancing its competitiveness and market share [5] - The company plans to introduce new product lines, such as GaN MOS, to meet emerging demands in high-frequency power devices [6] Group 5: Competitive Landscape - The power device market is expected to face a situation of excess capacity in the low-end segment while high-end capacity remains tight [6] - The company aims to leverage its technological and scale advantages to capture a larger market share in the competitive landscape [6]

根据《上市公司股份回购规则》《上海证券交易所上市公司自律监管指引第 7 号——回购股份》的相关规定，公司在回购股份期间应当在每个月的前 3 个交易 日内公告截至上月末的回购进展情况。现将公司回购进展情况公告如下： 关于以集中竞价交易方式回购股份的进展公告 本公司董事会及全体董事保证本公告内容不存在任何虚假记载、误导性陈 述或者重大遗漏，并对其内容的真实性、准确性和完整性承担法律责任。 重要内容提示： | 回购方案首次披露日 | 2024/4/15，由董事长丁国兴先生提议 | | --- | --- | | 回购方案实施期限 | 2024/4/13~2025/4/12 | | 预计回购金额 | 20,000 万元~40,000 万元 | | 回购用途 | □减少注册资本 √用于员工持股计划或股权激励 □用于转换公司可转债 | | | □为维护公司价值及股东权益 | | 累计已回购股数 | 万股 8,890.0084 | | 累计已回购股数占总股本比例 | 1.2603% | | 累计已回购金额 | 万元 35,536.5948 | | 实际回购价格区间 | 3.80 元/股~4.13 元/股 | 一、 回购股份 ...

Financial Performance - The company reported a revenue of RMB 1.2 billion for the first half of 2024, representing a year-over-year increase of 15%[1]. - The company's revenue for the first half of 2024 reached ¥2,879,569,269.66, representing a 14.27% increase compared to ¥2,519,890,395.68 in the same period last year[18]. - The company achieved operating revenue of 2.88 billion yuan, a year-on-year increase of 14.27%, with a main business revenue growth of 11.51%[78]. - The company reported a significant increase in competitiveness due to strategic collaborations with suppliers, contributing to revenue growth[19]. - The company’s EBITDA for the first half of 2024 was 1.123 billion yuan, an increase of 716 million yuan year-on-year, representing a 176% growth[57]. - The net profit attributable to shareholders improved to -¥470,756,855.48, a reduction in loss of 57.53% from -¥1,108,573,595.43 year-on-year[18]. - The net profit attributable to the parent company was -471 million yuan, a reduction in loss of 638 million yuan compared to the same period last year, marking a 58% year-on-year improvement[57]. Market Expansion and Product Development - The company plans to launch two new semiconductor products in Q3 2024, targeting a market share increase of 10% in the next year[1]. - The company is expanding its market presence in Southeast Asia, aiming for a 25% increase in sales in that region by the end of 2024[1]. - The company has expanded its product range to include BCD, SiC MOSFET, and VCSEL, while initiating the development of dedicated MCUs[28]. - The company is focusing on the development of high-value applications in automotive, industrial control, and high-end consumer sectors, continuously optimizing its product structure[49]. - The company has developed a complete series of power module products widely used in new energy vehicles, smart grids, and other fields, with its packaging technology reaching an international leading level[49]. Research and Development - Research and development expenses increased by 30% to RMB 150 million, focusing on advanced semiconductor technologies[1]. - Research and development expenses accounted for 30.19% of revenue, an increase of 4.40 percentage points compared to 25.79% previously[19]. - The company has established a comprehensive R&D system focusing on power, MEMS, BCD, and MCU technologies, aiming for seamless integration of R&D and mass production[31]. - The company has achieved significant breakthroughs in four major technology areas: power, MEMS, BCD, and MCU, with continuous expansion in market applications[34]. - The company has filed for 83 invention patents during the reporting period, with a total of 632 patents filed to date[37]. Financial Investments and Capital Management - The company invested a total of ¥35.22 billion during the reporting period, a 59.38% increase from ¥22.10 billion in the same period last year[85]. - The company has completed a capital increase of ¥28.875 billion for the "Phase III 12-inch integrated circuit analog mixed chip manufacturing project" in February 2024[85]. - The company has repurchased 88.9 million shares, accounting for 1.26% of the total share capital, with a total transaction amount of approximately 355.37 million yuan[63]. - The company plans to invest a total of 22.2 billion yuan in the 12-inch silicon wafer production line project, with 5.183 billion yuan of capital already paid in[63]. - The company has utilized idle raised funds for cash management, investing in related products[185]. Risk Management and Compliance - The company has identified potential risks related to supply chain disruptions and is implementing measures to mitigate these risks[1]. - The company is exposed to credit risk as it expands its scale and engages with numerous third parties[75]. - The company is subject to macroeconomic fluctuations that could affect demand in the semiconductor industry[77]. - The company has established strict risk management measures for derivative investments, including forward foreign exchange contracts, to mitigate exchange rate risks[90]. - The company has committed to ensuring the authenticity and completeness of the information disclosed, taking legal responsibility for any violations[167]. Environmental and Social Responsibility - The company invested ¥5,669.22 million in environmental protection during the reporting period[101]. - The company achieved compliance with all emission standards, with maximum concentrations for sulfur dioxide at 12 mg/m³, nitrogen oxides at 6 mg/m³, and particulate matter at 7 mg/m³[103]. - The company actively participates in poverty alleviation and rural revitalization initiatives, creating numerous job opportunities in the local area[112]. - The company has implemented a self-monitoring plan for emissions, with all indicators meeting standards during the reporting period[108]. - The company has established an emergency response plan for environmental incidents and conducts regular training and drills[107]. Shareholder Commitments and Governance - The company has established long-term commitments regarding the authenticity, accuracy, and completeness of the information provided, involving directors and major shareholders[119]. - The company commits to minimizing related party transactions without adversely affecting the interests of the issuer and other shareholders[124]. - The company will ensure compliance with relevant laws and regulations regarding share transfer and management during the lock-up period[130]. - The company’s major shareholders also commit to taking responsibility for any violations of the commitments made in the prospectus[154]. - The company will publicly disclose reasons for not implementing stabilization measures and apologize to investors if such measures are not taken[138].

芯联集成电路制造股份有限公司 独立意见 芯联集成电路制造股份有限公司 独立董事关于第一届董事会第二十五次会议 (本页以下无正文) 芯联集成电路制造股份有限公司 独立意见 （本页无正文,为《芯联集成电路制造股份有限公司独立董事关于第一届董事会 第二十五次会议相关事项的独立意见》之签署页 ) 相关事项的独立意见 根据《中华人民共和国公司法》《公司章程》等相关法律法规和公司制度的 规定,作为芯联集成电路制造股份有限公司(以下简称"公司")的独立董事,我 们对公司 2024 年 8 月 30 日召开的第一届董事会第二十五次会议审议的相关议 案进行了认真的核查,现就本次会议相关议案发表如下独立意见: 一、关于2024年半年度募集资金存放与实际使用情况的专项报告的独立意 風 独立董事认为:公司 2024 年半年度募集资金的存放与使用符合《上市公司 监管指引第2号一上市公司募集资金管理和使用的监管要求》及《上海证券交易 所科创板上市公司自律监管指引第1号 -- 规范运作》等相关法律法规的要求。 公司编制的《2024 年半年度募集资金存放与实际使用情况的专项报告》体现了 公司募集资金存放和使用的实际情况。公司已及时、真实、准 ...

证券代码：688469 证券简称：芯联集成 公告编号：2024-060 芯联集成电路制造股份有限公司 第一届监事会第十七次会议决议公告 （二）审议通过《关于 2024 年半年度募集资金存放与实际使用情况 的专项报告的议案》 1 监事会认为：公司 2024 年半年度募集资金的存放与使用符合《上市 公司监管指引第 2 号—上市公司募集资金管理和使用的监管要求》及 《上海证券交易所科创板上市公司自律监管指引第 1 号——规范运作》 等相关法律法规的要求，不存在违规使用募集资金的行为，不存在改变 或变相改变募集资金投向和损害股东利益的情况。公司已披露的相关信 息及时、真实、准确、完整地反映了募集资金管理情况，如实履行了信 息披露义务。 综上，监事会同意公司编制的 2024 年半年度募集资金存放与实际使 用情况的专项报告。 本公司监事会及全体监事保证本公告内容不存在任何虚假记载、误导性陈 述或者重大遗漏，并对其内容的真实性、准确性和完整性依法承担法律责任。 芯联集成电路制造股份有限公司（以下简称"公司"）第一届监事 会第十七次会议于 2024 年 8 月 30 日以现场结合通讯方式召开。会议通 知于 2024 年 8 ...

芯联集成电路制造股份有限公司 关于公司 2024 年度提质增效重回报专项行动方案的 一、聚焦经营主业，提升核心竞争力 上半年，公司上下紧紧围绕"持续提升公司核心竞争力，发挥一站式系统代 工模式的优势，聚焦重点客户的核心需求，抓住国产芯片导入时间窗口同时加强 研发力度，不断推出稀缺工艺技术平台"这一纲领，不断提升公司经营质量。 从公司上半年的经营业绩来看，公司精细化管理卓有成效。一方面，新能源 汽车与消费电子市场的需求持续增长，为公司带来了双引擎增长动力。另一方面， 公司推行的生产管理的持续优化也为公司提供了坚实的运营基础，并带来了显著 的成本效益。在上述因素的协同作用下，公司 2024 年上半年经营业绩实现了全 方位增长。 报告期内，公司实现营业收入 28.80 亿元，较上年同期增长 14.27%，其中 主营业务收入增幅 11.51%，保持了良好的增长势头。归属于上市公司股东的净 利润为-4.70 亿元，实现同比大幅减亏 57.53%。剔除年度折旧及摊销费用 20.46 亿元后，公司上半年实现 EBITDA（息税折旧摊销前利润）11.23 亿元，与上年同 期相比增加 7.16 亿元，同比增长 175.74%。 ...

证券代码：688469 证券简称：芯联集成 公告编号：2024-057 芯联集成电路制造股份有限公司 关于发行股份及支付现金购买资产事项的进展公告 本公司董事会及全体董事保证本公告内容不存在任何虚假记载、误导性陈 述或者重大遗漏，并对其内容的真实性、准确性和完整性承担法律责任。 二、本次交易的进展情况 2024 年 6 月 21 日，公司第一届董事会第二十四次会议审议通过了《关于公 司发行股份及支付现金购买资产暨关联交易方案的议案》等与本次交易相关的议 案。具体内容详见公司于 2024 年 6 月 22 日在上海证券交易所网站 （www.sse.com.cn）披露的《芯联集成电路制造股份有限公司发行股份及支付现 金购买资产暨关联交易预案》等相关公告。 2024 年 7 月 20 日，公司披露了《芯联集成电路制造股份有限公司关于发行 股份及支付现金购买资产事项的进展公告》（公告编号：2024-055 号）。 自预案披露以来，公司、各中介机构及其他相关方正在积极推进本次交易的 相关工作。截至本公告披露日，本次交易所涉及的审计、评估及尽职调查等工作 尚未完成。在审计、评估及尽职调查等工作完成后，公司将再次召开董事会 ...

证券代码：688469 证券简称：芯联集成 公告编号：2024-056 芯联集成电路制造股份有限公司 关于以集中竞价交易方式回购股份的进展公告 本公司董事会及全体董事保证本公告内容不存在任何虚假记载、误导性陈 述或者重大遗漏，并对其内容的真实性、准确性和完整性承担法律责任。 重要内容提示： | 回购方案首次披露日 | 2024/4/15，由董事长丁国兴先生提议 | | --- | --- | | 回购方案实施期限 | 2024/4/13~2025/4/12 | | 预计回购金额 | 万元~40,000 万元 20,000 | | 回购用途 | □减少注册资本 √用于员工持股计划或股权激励 | | | □用于转换公司可转债 | | | □为维护公司价值及股东权益 | | 累计已回购股数 | 万股 8,890.0084 | | 累计已回购股数占总股本比例 | 1.2603% | | 累计已回购金额 | 万元 35,536.5948 | | 实际回购价格区间 | 元/股~4.13 元/股 3.80 | 特此公告。 芯联集成电路制造股份有限公司董事会 2024 年 8 月 2 日 二、 回购股份的进展情况 根据《上市 ...

Summary of Conference Call Industry Overview - The discussion focuses on the semiconductor industry, particularly the automotive chip market, from the perspective of chip manufacturers [1] Core Insights and Arguments - The speaker, Yuan Feng, emphasizes the importance of understanding the automotive chip market dynamics and trends [1] - There is a growing demand for automotive chips due to the increasing integration of technology in vehicles [1] - The speaker highlights the challenges faced by chip manufacturers, including supply chain disruptions and the need for innovation to meet evolving automotive requirements [1] Additional Important Content - The call aims to provide insights while allowing ample time for investor questions, indicating a focus on transparency and engagement with stakeholders [1]