■ 新华社记者 周科 杨深深 赵瑞希 发布5000余项前沿成果、超1700亿元意向成交与投融资、超45万人次参展……近日，第二十七届中国国 际高新技术成果交易会在深圳举行。3天时间里，这座因改革而生、因创新而兴的城市，再次汇聚全球 目光，展现中国科技创新的勃勃生机。 作为我国高新技术领域对外开放的重要窗口和成果转化的重要平台，延续二十七载的高交会，不仅是观 察中国高新技术发展的风向标，更是中国以开放姿态融入全球创新网络、以创新驱动赋能高质量发展的 生动实践。 高水平自立自强的"中国答卷" 高交会上，一只仿生机器鸟翩然起飞，自主穿梭于人群之中。"它全身搭载传感器、智能芯片，通过飞 行算法能够精准地绕过各类障碍物。"现场工作人员说。 这轻盈舞动的翅膀，扇动的不只是空气，更是中国科技迈向高水平自立自强的澎湃气流。 中海油的亚洲首艘圆筒型浮式生产储卸油装置"海葵一号"与亚洲第一深水导管架"海基二号"等模型，展 现我国深海能源开发能力；中广核的三代核电技术"华龙一号"和核级数字化仪控平台"和睦系统"等，均 具备自主知识产权…… 22大专业展区、5000多家知名企业和国际组织，如同星辰列阵，照亮科技天空。 "从高交会的变 ...

这是11月14日拍摄的第二十七届中国国际高新技术成果交易会现场。新华社记者 王丰 摄 在宇树科技展区，人形机器人演示着"近身对打"——出拳、闪避、侧踢动作连贯，面对推搡与冲撞依然 能稳住姿态；在傅利叶展区，两台负责搬运和分拣的机器人分工明确、流程清晰、节奏连贯，用"场景 链条"展示机器人的任务能力，呈现出具身智能在工业环境中的协作潜力…… 如凭一句话生成3D场景，腾讯混元大模型有望为工业设计、游戏开发等领域提供降本增效的新工具； 探迹科技现场展示了数字员工在制造业等复杂业务场景中的智能决策与执行能力；万兴科技通 过"AI+视频创意""AI+文档效率"等各类创新应用，展示"国产AI+创意软件"最新的市场化成果…… 值得关注的是，AI正从"头部专享"走向"普惠共享"。多家初创企业推出低代码AI开发平台，让非技术人 员也能微调模型、部署应用。一位参展工程师表示："AI的价值不在参数多少，而在解决多少真实问 题。" 机器人展区同样保持着超高热度。从走路、挥手到协同搬运、对抗稳定、工业交互，本届高交会上的人 形机器人正告别"炫技表演"，迈向"产线刚需"，它们不再只是"能动"，而是向"能做事"迈进。 新华社深圳11月18 ...

Core Insights - The 27th China International High-Tech Achievements Fair concluded in Shenzhen, attracting over 450,000 professional visitors, a 13% year-on-year increase, and resulting in over 1,023 on-site contracts with an intended transaction and investment amount exceeding 170 billion yuan [1][3]. Group 1: Event Overview - The fair featured over 5,000 new products and achievements, with more than 200 major events held during the three days [1]. - The event showcased 22 thematic exhibition areas, including major equipment, artificial intelligence, semiconductors, and commercial aerospace, with over 90% of physical exhibits being high-tech products [2]. Group 2: Participation and Engagement - Over 2,000 leading domestic companies and research institutions participated, including BYD, Tencent, Huawei, and others, presenting cutting-edge technologies and innovations [2]. - The event attracted over 1,036 international procurement teams and more than 3,000 investment institutions, including major firms like JPMorgan, Goldman Sachs, and Sequoia Capital, facilitating significant business interactions [3].

Core Insights - The 27th China International High-Tech Achievements Fair (CIHTAF) concluded with a focus on "Technology Empowering Industrial Integration for a Shared Future" [1] - The event attracted over 450,000 attendees from more than 120 countries, marking a 13% year-on-year increase [1][5] - A total of 5,000 new products and achievements were launched, with 1,023 supply-demand matches and investment projects signed, amounting to over 170 billion yuan in intended transactions and investments [1][6] Exhibition Highlights - Over 20% of the exhibits were debut products, showcasing cutting-edge technologies across 22 major exhibition areas, including aerospace, AI, semiconductors, and low-altitude economy [3][4] - More than 90% of the physical exhibits featured high-tech products, emphasizing China's advancements in technology [3] Major Participants and Innovations - Key state-owned enterprises such as China Aerospace Science and Technology Corporation and China National Offshore Oil Corporation presented significant technological innovations, including the Long March rocket and the Hualong One nuclear power plant [4] - The event featured a variety of innovative products, including the world's first "imaging" MRI and autonomous driving aircraft, attracting considerable attention from attendees [4] Regional and International Collaboration - The fair served as a platform for regional collaborative innovation, showcasing achievements from various regions in China, including clean energy and digital economy initiatives [4] - International participation included organizations and enterprises from countries like Germany, the USA, and the UK, highlighting the fair's role as a window for showcasing Chinese technology to the world [4] Transaction and Investment Focus - The event emphasized practical outcomes and transactions, with a strategic plan involving 10% international buyers, 30% local buyers, and 60% buyers from outside Guangdong [5] - Over 1,000 procurement teams from countries such as the UK, Russia, and Canada attended, with participation from over 3,000 domestic and international investment institutions [5]

Core Insights - The 27th China International High-tech Achievements Fair concluded successfully in Shenzhen, attracting over 450,000 attendees from more than 120 countries, marking a 13% year-on-year increase [1] - The event showcased over 5,000 new products and achievements, with more than 1,023 supply-demand matches and investment projects signed, exceeding 170 billion yuan in intended transactions and financing [1] Group 1: Event Overview - The fair featured 22 major exhibition areas, highlighting cutting-edge technologies in fields such as aerospace, artificial intelligence, semiconductors, consumer electronics, and commercial space [1] - Over 90% of the physical exhibits were categorized as "high, precision, and advanced" technologies and products [1] Group 2: Notable Exhibitors and Innovations - Major state-owned enterprises like China Aerospace Science and Technology Corporation and China National Offshore Oil Corporation presented advanced manufacturing technologies, including the Long March rocket and EH216-S unmanned aerial vehicle [1] - Over 2,000 leading companies, including BYD, Tencent, and Huawei, showcased innovative products such as the HarmonyOS ecosystem and satellite communication technologies [2] Group 3: New Product Launches - The event featured over 20% of the physical exhibits as first-time launches, including the Avant Robotics Gen1 inspection robot and the Avant Hub intelligent inspection platform, which demonstrated significant efficiency improvements in various applications [2] - Bern Optical introduced an AI digital twin system for coating design and the world's first variable thickness ultra-thin glass, showcasing advancements in optical materials and manufacturing techniques [4] Group 4: Business Engagement - The fair emphasized practicality and transaction facilitation, with international, provincial, and local buyers accounting for 10%, 30%, and 60% of attendees, respectively [4] - A total of 1,036 purchasing groups from countries like the UK, Russia, and Canada participated, alongside over 3,000 domestic and international investment institutions [4]

Core Insights - Huawei is set to release a groundbreaking AI technology next week aimed at improving the efficiency of computing resource utilization, potentially increasing GPU and NPU utilization rates from the industry average of 30%-40% to 70% [1] - The new technology is designed to unify resource management across different computing platforms, including Nvidia and Huawei's Ascend, by leveraging software innovations to mask hardware differences [1] - Nvidia's recent acquisition of Israeli company Run:ai for $700 million is a strategic move to enhance its dominance in the AI chip market, where it holds 80% of the high-end GPU market share [2] Group 1 - Huawei's upcoming technology focuses on solving the challenge of computing resource efficiency, which is critical for AI training and inference [1] - The technology aims to provide a competitive alternative to Nvidia's Run:ai, which has been successful in improving GPU utilization for various companies, including Wayve, which increased its GPU cluster efficiency from below 25% to over 80% [2] - The software-centric approach of Huawei's technology is particularly important for smaller companies and non-AI industries that may struggle with hardware limitations [1][2] Group 2 - Huawei has previously introduced key technologies to address its chip shortcomings, such as the Ascend 384 super node, which leverages its strengths in communication and storage to overcome bottlenecks [3] - The Unified Cache Manager (UCM) technology recently open-sourced by Huawei reduces reliance on high-end memory and balances costs, showcasing its commitment to enhancing AI capabilities [3] - The upcoming technology release is significant for the Chinese industry, which seeks to reduce dependence on Nvidia amid constraints in advanced chip manufacturing [2][3]

Core Insights - The 27th China International High-Tech Achievements Fair (高交会) showcases significant advancements in high-tech industries, emphasizing "high, precision, and cutting-edge" technologies and products, with over 90% of exhibits being physical items and more than 20% being debut displays [1][2] Group 1: Key Technologies and Exhibitors - The 9th hall features critical technologies and products related to national security and technological innovation, including aerospace, high-end marine engineering, and intelligent manufacturing [2] - Notable exhibitors include China Aerospace, China National Offshore Oil Corporation (CNOOC), BYD, and the Shenzhen Advanced Institute of Technology, showcasing their latest technological achievements [2][3] - The "Shenzhen Star," the world's first high-throughput satellite customized for mobile communication, is displayed by Asia-Pacific Satellite Broadband Communication (Shenzhen) Co., highlighting its role in disaster communication [2] Group 2: Innovations in Energy and Computing - CNOOC presents advanced marine energy equipment, including the "Deep Sea No. 1" energy station and "Sea Anemone No. 1" FPSO, showcasing its latest technological advancements in deep-water oil and gas exploration [3] - The Guangming Laboratory has acquired four sets of Huawei's self-developed computing clusters, each containing 384 domestic GPUs, for large model training and multimedia processing, transitioning from NVIDIA due to export restrictions [4] - The Shenzhen Advanced Institute of Technology introduces the HYPIR image restoration model and the HYPVR video enhancement model, which significantly improve the quality of old films and video content [4] Group 3: Medical and Biotechnological Innovations - The "Results Supermarket" at the fair features 125 achievements in fields such as high-end medical devices and brain-machine interfaces, allowing visitors to interactively learn about technological highlights and application scenarios [5][6] - The world's first "imaging" magnetic resonance device, uMRUltra, developed in collaboration with United Imaging Healthcare, has received regulatory approvals and is set for global launch [6] - A novel multi-modal imaging-guided pulsed electric field ablation device is showcased, which integrates various imaging technologies for precise treatment of complex medical conditions [6]

Core Points - The 27th China International High-tech Achievements Fair (referred to as the High-tech Fair) is held at the Shenzhen International Convention and Exhibition Center from November 14 to 16, with the theme "Technology Empowers Industrial Integration to Create the Future" [1] - The fair focuses on international technological development, high-level innovation achievements in China, and Shenzhen's "20+8" industrial clusters, featuring 22 major exhibition areas including key equipment, artificial intelligence, semiconductors, consumer electronics, and commercial aerospace [1] - Over 5,000 new products, technologies, and achievements from more than 100 countries and regions are showcased, aiming to accelerate the implementation of global cutting-edge results and promote leapfrog development in China's technological innovation [1] Industry Highlights - Many companies are showcasing their products with a focus on artificial intelligence (AI) [2] - The exhibition features innovative products such as smart glasses and AI-driven dining solutions, attracting significant interest from attendees [3][17] - The event includes discussions on low-altitude operation risk assessment tools and compliance solutions, indicating a focus on regulatory aspects of emerging technologies [20]

Core Insights - Innovation is not an individual capability but a consensus formed within the industrial ecosystem, with China's technological strength becoming a significant driver in the global innovation wave [1] - Intellectual property (IP) is emerging as a key variable influencing industrial patterns, serving as a bridge connecting innovators, supply chains, and global markets [1] - Huawei's commitment to open innovation is evident in its substantial R&D investments, totaling over 1.24 trillion yuan in the past decade, with 179.7 billion yuan allocated in 2024 alone, representing 20.8% of its sales revenue [1][2] - The number of valid invention patents in China reached 5.689 million by the end of 2024, marking a 14.0% year-on-year increase [1] Huawei's Innovation and IP Strategy - Huawei's sixth "Top Ten Inventions" event showcased significant technological breakthroughs and emphasized the importance of open collaboration [1][3] - The company holds over 150,000 valid patents globally, covering key areas such as communication, computing, operating systems, and intelligent driving [2][3] - Huawei promotes technology sharing and ecosystem collaboration through patent licensing, standard co-construction, and open-source cooperation [2] Key Technological Innovations - The sixth "Top Ten Inventions" includes advancements in computing architecture, communication networks, operating systems, optical interconnection, storage technology, green energy, and intelligent driving [4] - The Scale-Up ultra-large-scale super-node computing platform aims to address long-standing communication efficiency bottlenecks in AI computing clusters [5] - The Harmony full-stack architecture enhances system fluidity and security through hardware-software collaboration, improving user experience and data control [5] Impact of Innovations - The innovations presented are designed to be replicable within the industry, allowing for broader adoption and integration into various supply chains [6] - Huawei has made over 200,000 patents available in the public domain for free use, further promoting innovation [6] - The "Chasi Patent" section on Huawei's website has seen over 2 million visits, facilitating access to patent resources for industry partners and research institutions [6] Specific Innovations and Their Applications - The Ascend 384 super-node, supported by eight key patents, represents a breakthrough in computing architecture, enabling high-speed interconnection and low-latency collaboration among AI processors [7][9] - Innovations such as the intelligent dynamic power supply patent address challenges in AI training load fluctuations, enhancing power distribution efficiency [9] - The system of interconnected patents creates a comprehensive innovation loop, ensuring stability and scalability in industrial environments [9] Conclusion - Huawei's innovation trajectory over the past decade has been characterized by a stable and continuous rhythm, treating patents as integral parts of the technology system rather than barriers [10] - The concept of "openness" has evolved to encompass a long-term attitude of respecting knowledge, collaboration, and the complexity of technology [10] - Huawei's ongoing efforts in patent licensing, open-source communities, and standard contributions reflect a commitment to fostering an ecosystem of shared innovation [10]

Core Viewpoint - The year 2025 is anticipated to be a breakthrough year for domestic supernodes, with major companies like Inspur, ZTE, Huawei, Alibaba, and Sugon making significant advancements in computing cluster construction, enhancing computing power integration, density, and ecosystem compatibility [2]. Group 1: Product Developments - Huawei's Ascend 384 has set a new industry standard as the largest high-speed bus interconnected supernode, featuring 32 cards per cabinet across 12 cabinets, showcasing Huawei's comprehensive capabilities in communication and computing [2]. - Alibaba's Panjiu AL128 supernode has achieved a record of supporting 128 accelerator cards in a single cabinet, with a computing power integration level four times that of the Ascend 384, demonstrating rapid advancements in software and hardware optimization [2]. - The Sugon scaleX640 supernode is the world's first single-cabinet 640-card supernode, achieving 20 times the computing power integration of the Ascend 384, designed on an open AI computing architecture to ensure compatibility with mainstream intelligent computing ecosystems [2]. Group 2: Performance Comparison - Domestic supernodes have undergone three significant leaps, overcoming barriers in performance and ecosystem, with the scaleX640 showing core advantages over NVL72 in comprehensive performance metrics [3]. - The scaleX640 has implemented advanced immersion phase change liquid cooling technology, achieving a minimum PUE of 1.04 and providing 1.72MW of cooling capacity for high-caliber computing units, validated through over 30 days of reliability testing [3]. - Despite a gap in single-card computing power compared to NV, the engineering characteristics of computing clusters present systemic opportunities for domestic manufacturers to catch up, with ongoing innovations in integration, compatibility, and reliability [3].