金融界消息 截至2025年8月12日收盘，宝鼎科技（002552）报收于16.32元，下跌2.68%，换手率 3.15%，成交量10.08万手，成交金额1.64亿元。 资金流向方面，今日主力资金净流出2467.54万元，占比成交额15.01%。其中，超大单净流出698.35万 元、占成交额4.25%，大单净流出1769.19万元、占成交额10.76%，中单净流出流入284.54万元、占成交 额1.73%，小单净流入2183.00万元、占成交额13.28%。 通过天眼查大数据分析，宝鼎科技股份有限公司共对外投资了3家企业，参与招投标项目21次，专利信 息56条，此外企业还拥有行政许可40个。 来源：金融界 宝鼎科技最新一期业绩显示，截至2025一季报，公司营业总收入6.83亿元、同比减少0.47%，归属净利 润1796.51万元，同比减少78.22%，扣非净利润2003.55万元，同比增长3.61%，流动比率1.039、速动比 率0.757、资产负债率59.04%。 天眼查商业履历信息显示，宝鼎科技股份有限公司，成立于1999年，位于杭州市，是一家以从事金属制 品业为主的企业。企业注册资本38798.5331万 ...

Company Overview - Baoding Technology Co., Ltd. was listed on the Shenzhen Stock Exchange in February 2011, initially on the SME board and now on the main board [1] - The company specializes in large castings and forgings, with a significant shift in control to Shandong Zhaojin Group in 2019 [1] - In 2022, the company underwent a major asset restructuring, acquiring 63.87% of Shandong Jinbao Electronics Co., Ltd., expanding into copper-clad laminates and copper foil business [1] - In 2023, the company transferred control to Shandong Jindu State Capital Investment Group and acquired 100% of Zhaoyuan Hexi Gold Mine Co., Ltd., entering the gold mining sector [1] Business Structure - The current main business segments are electronic copper foil, copper-clad laminates, and gold mining [1][2] - Jinbao Electronics, acquired in 2022, has seen a decline in performance due to increased competition and cyclical industry impacts [2] - For 2024, Jinbao Electronics is projected to produce 19.09 million sheets of copper-clad laminates and 1.56 million tons of copper foil, with a capacity utilization rate that is considered sufficient [2] Future Plans - The company aims to enhance market share for copper-clad laminates and develop high-quality customers for copper foil products, particularly targeting 5G communication applications [3] - Expansion at Hexi Gold Mine is ongoing, with completion expected in August 2025 [3] - The company has no current plans for stock incentive programs [5] Financial and Operational Insights - The tax rate for Hexi Gold Mine is set at 25%, and the company does not engage in hedging activities [5] - The cost of gold production is expected to remain stable post-expansion [5] Governance and Strategic Direction - The controlling shareholder, Jindu State Capital Investment Group, aims to position Baoding Technology as a state-owned asset management entity [3][4] - Conditions for the potential injection of assets from Zhongkuang Group include ensuring normal operations and clear ownership of the underlying businesses [4]

Group 1 - The number of shareholders for Baoding Technology decreased to 23,779 as of July 31, representing a reduction of 4,770 shareholders or a decline of 16.71% compared to the previous period [1] - This marks the second consecutive period of decline in the number of shareholders for the company [1] - The closing price of Baoding Technology was 17.50 yuan, reflecting an increase of 5.04%, with a cumulative increase of 7.23% since the concentration of shares began [1] Group 2 - In the first quarter, the company reported a revenue of 683 million yuan, a year-on-year decrease of 0.47%, and a net profit of 17.9651 million yuan, down 78.22% year-on-year [1] - The basic earnings per share were 0.0400 yuan, with a weighted average return on equity of 1.23% [1] - The company issued a half-year performance forecast on July 15, estimating a net profit between 18 million yuan and 26 million yuan, indicating a year-on-year change of -82.22% to -74.32% [1]

证券代码：002552 证券简称：宝鼎科技 公告编号：2025-033 宝鼎科技股份有限公司 关于子公司出售存货资产暨关联交易的公告 本公司及董事会全体成员保证信息披露的内容真实、准确、完整，没有虚假 记载、误导性陈述或重大遗漏。 宝鼎科技股份有限公司（以下简称"公司"）于2025年7月25日召开第五届董 事会第二十四次会议，审议通过了《关于子公司出售存货资产暨关联交易的议案》， 具体情况如下： 一、关联交易概述 公司全资子公司招远市河西金矿有限公司（以下简称"河西金矿"）的一批废 钢存货已成为闲置资产，为进一步优化资产结构，提高资产使用效率，河西金矿 拟通过浙江产权交易所以公开挂牌的方式出售该批废钢存货资产。 根据银信资产评估有限公司出具的《招远市河西金矿有限公司拟资产转让涉 及的单项资产评估项目资产评估报告》[银信评报字（2025）第C00087号]，该批 废钢存货共3,868.48吨，评估值990.8454万元，挂牌价格1,005.00万元（此为含税 价，增值税率13%）。 2025年6月24日至7月21日，该批废钢在浙江产交所公开挂牌，期间征得包括 宝鼎万企集团有限公司（以下简称"宝鼎集团"）在内的2 ...

证券代码：002552 证券简称：宝鼎科技 公告编号：2025-032 宝鼎科技股份有限公司 第五届监事会第二十次会议决议公告 1、审议通过《关于子公司出售存货资产暨关联交易的议案》 经审核，监事会成员一致认为：本次出售存货资产符合公司整体发展战略规 划的需要，本次交易事项遵循了平等自愿、公平合理原则，交易定价以评估值为 参考依据，不存在利用关联交易损害公司和全体股东利益，尤其是非关联股东和 中小股东利益的情形，不会对公司经营造成不利影响。 表决结果：同意 2 票，反对 0 票，弃权 0 票，关联监事陈聪回避表决。 三、备查文件 1、第五届监事会第二十次会议决议。 特此公告。 本公司及监事会全体成员保证信息披露内容的真实、准确和完整，没有虚 假记载、误导性陈述或重大遗漏。 一、监事会会议召开情况 宝鼎科技股份有限公司（以下简称"公司"）第五届监事会第二十次会议于 2025 年 7 月 25 日上午 10：30 在宝鼎科技办公楼会议室以现场结合通讯表决方式召开。 本次会议的会议通知已于 2025 年 7 月 22 日以专人、邮件和电话方式送达全体监 事。会议应到表决监事 3 人，实到表决监事 3 人，会议由监事 ...

证券代码：002552 证券简称：宝鼎科技 公告编号：2025-031 宝鼎科技股份有限公司 第五届董事会第二十四次会议决议公告 本公司及董事会全体成员保证信息披露内容的真实、准确和完整，没有虚 假记载、误导性陈述或重大遗漏。 一、董事会会议召开情况 宝鼎科技股份有限公司（以下简称"公司"） 第五届董事会第二十四次会议 于 2025 年 7 月 25 日上午 9：30 在宝鼎科技办公楼五楼会议室以现场结合通讯的 方式召开。本次会议的会议通知已于 2025 年 7 月 22 日以专人、邮件和电话方式 送达全体董事。会议应出席表决董事 9 人，实出席表决董事 9 人，公司监事和高 级管理人员列席了会议。会议由董事长张旭峰先生主持，会议的召开和表决程序 符合《公司法》等法律、法规和规范性文件及《公司章程》的相关规定。 公司董事会 2025 年第二次独立董事专门会议对本次关联交易进行了审议。 全体独立董事一致同意该议案，并同意将该议案提交董事会审议。全体独立董事 一致认为：本次关联交易履行了法定程序，定价公允、合理，未发现利用关联交 易调控利润、向关联人输送利益的行为，不存在损害公司及中小股东利益的情形； 严格遵守关 ...

Core Viewpoint - Baoding Technology Co., Ltd. has approved a change in registered capital and amendments to its Articles of Association due to the repurchase and cancellation of 20,556,708 shares for performance compensation in 2024, reducing the registered capital from 408,542,039 yuan to 387,985,331 yuan [1][2] Group 1 - The company held the 22nd meeting of the fifth board of directors on March 27, 2025, and the annual general meeting on April 29, 2025, to discuss the capital change [1] - The company has completed the industrial and commercial change registration and the filing of the amended Articles of Association, obtaining a new business license issued by the Zhejiang Provincial Market Supervision Administration [1] - The company’s business scope includes various activities such as technology consulting, nuclear power equipment manufacturing, metal processing, and import-export operations [1]

关于完成工商变更登记并换发营业执照的公告 本公司及董事会全体成员保证信息披露内容的真实、准确和完整，没有虚 假记载、误导性陈述或重大遗漏。 证券代码：002552 证券简称：宝鼎科技 公告编号：2025-030 宝鼎科技股份有限公司 宝鼎科技股份有限公司（以下简称"公司"）分别于 2025 年 3 月 27 日、2025 年 4 月 29 日召开第五届董事会第二十二次会议和 2024 年年度股东大会，审议通 过了《关于拟变更公司注册资本及修订<公司章程>的议案》，因 2024 年度业绩 补偿股份 20,556,708 股回购注销的原因，同意将公司注册资本由 408,542,039 元 变更为 387,985,331 元，并对《公司章程》中部分条款进行修订。具体内容详见 公司于 2025 年 3 月 29 日在巨潮资讯网上披露的《关于拟变更公司注册资本及修 订<公司章程>的公告》（公告编号：2025-016）。 根据《公司章程》及上述决议，公司于近日已办理完成工商变更登记及《公 司章程》备案手续，并取得由浙江省市场监督管理局核发的新《营业执照》。相 关信息如下： 7、经营范围：一般项目：新材料技术推广服务；技术 ...

Core Viewpoint - Baoding Technology (002552) has released its semi-annual performance forecast, indicating a net profit of 20 million to 28 million yuan for the first half of the year, with basic earnings per share ranging from 0.04 to 0.06 yuan [1] Group 1: Company Performance and Operations - The company reported a production capacity of 300,000 tons per year at the Hexi Gold Mine, with an expected output of 527.09 kilograms of finished gold in 2024, all of which will be self-produced [1] - Baoding Technology's subsidiary, Jinbao Electronics, is a key player in the domestic PCB supply chain, providing integrated services from design to production for electronic copper foil and copper-clad laminates [1] - The company completed the acquisition of 100% equity in Hexi Gold Mine in November 2023, which will contribute to revenue growth through gold mining and sales [4] Group 2: Industry Growth and Market Trends - The high-frequency copper-clad laminate market in China is projected to grow from 950 million yuan in 2017 to 4.334 billion yuan by 2024, with a compound annual growth rate of 24.21% [2] - The demand for electronic copper foil and copper-clad laminates is driven by applications in 5G communications, smart devices, and automotive electronics, indicating a broad development space for the industry [2] - The gold market in China is experiencing rapid growth, with significant increases in trading volumes and values, reflecting heightened market activity and consumer interest in gold products [4][5] Group 3: Research and Development - Jinbao Electronics emphasizes enhancing its R&D capabilities, with 50% of its R&D personnel having over ten years of experience, focusing on electrochemistry, electroplating alloys, and chemical engineering [3] - The company has undertaken over 30 national and provincial major technology projects and has received multiple awards for technological advancements [3] - Jinbao Electronics is involved in setting industry standards, contributing to the establishment of national standards for copper foil and laminated boards, thereby strengthening its competitive edge [3]

Industry Overview - The high-frequency copper clad laminate (HFCCL) industry in China is experiencing rapid growth, driven by increasing demand in sectors such as 5G base station construction, autonomous driving millimeter-wave radar, and satellite navigation [1][13] - The market size of the HFCCL industry is projected to grow from 950 million yuan in 2017 to 4.334 billion yuan in 2024, with a compound annual growth rate (CAGR) of 24.21% [1][13] - HFCCL is essential for 5G communication due to its low dielectric constant and low dielectric loss, making it a key material for base station antennas and RF modules [1][11] Industry Chain - The upstream of the HFCCL industry includes raw materials such as copper foil, resin, fiberglass cloth, and silica powder, with copper foil being critical for signal transmission efficiency [7][9] - The midstream involves the manufacturing of HFCCL, while the downstream applications span across 5G communication, wireless networks, and automotive radar [7] Key Companies - Leading companies in the HFCCL industry include Shengyi Technology, Zhongying Technology, and Huazheng New Materials, which leverage their technological expertise and manufacturing scale to drive industry development [16] - Other notable companies include Nanya New Materials, Jinan Guoji, and Baoding Technology, which focus on niche markets and product differentiation [16] Market Trends - The HFCCL industry is moving towards miniaturization, with demands for smaller sizes and thinner thicknesses driven by 5G millimeter-wave communication and consumer electronics [23] - There is a trend towards higher-layer structures, evolving to more than 16 layers to meet the complex interconnection needs of high-performance computing and AI chips [24] - Flexibility is becoming a key focus, with innovations in bendable materials to cater to the growing market for wearable devices and flexible displays [26] - The integration of smart technologies is also on the rise, with HFCCL incorporating passive components and sensors for enhanced functionality [27]