深南电A、深南电B公告称，2026年1月29日，公司全资子公司深南电工程公司与柬埔寨BSE公司正式签 署《离岸供应与运维技术咨询协议》，合同预计金额1.04亿美元，占项目总金额50%。此金额基于运维 周期估算，实际以执行中确认金额为准。项目含2026 - 2027年建设阶段前期服务及2028 - 2042年商业运 营阶段运维服务。该项目预计扩大子公司业务规模，对公司未来经营产生积极影响，但履行期长，存一 定风险。 ...

Summary of Conference Call on China PCB Industry Industry Overview - The conference call focused on the PCB (Printed Circuit Board) and CCL (Copper Clad Laminate) industry in China, particularly in relation to AI infrastructure and its growth potential [1][2]. Key Trends and Insights - **Higher Speed and Capacity Expansion**: The demand for higher speed connections (800G / 1.6T) in AI servers is driving an increase in PCB and CCL dollar content. This is coupled with a significant ramp-up in AI server production, leading to overall growth in the Total Addressable Market (TAM) for PCBs and CCLs [1][2]. - **Revenue Growth**: Revenue growth for companies like Victory Giant, WUS, and Shengyi Tech is projected to increase from an average of +2% in 2022 to +58% YoY in 9M25, driven by the AI infrastructure cycle [2]. - **Future Projections**: The expected Compound Annual Growth Rate (CAGR) for net income (NI) for Victory Giant, WUS, and Shengyi Tech from 2026 to 2028 is forecasted at 57%, 47%, and 50% respectively, with operating profit margins (OPM) expanding to 33%, 26%, and 20% by 2028 [2]. Competitive Landscape - **Market Dynamics**: There is a debate among investors regarding the maturity of the AI infrastructure market, which could lead to slower growth and increased competition. However, the report argues that ongoing specification upgrades and the transition from copper cables to PCBs in AI servers will mitigate competitive intensity [3]. - **Customer Base Expansion**: The shift from GPU AI server clients to ASIC AI server clients is expected to increase, supported by local customer growth and strong commitments from Chinese suppliers to R&D and capacity expansion [2][3]. Financial Highlights - **Valuation and Price Targets**: - Victory Giant is initiated with a Buy rating and a target price (TP) of Rmb550, reflecting a 26.3x 2027E PE ratio and an expected +57% NI YoY growth on average in 2027-28E [36]. - WUS and Shengyi Tech are also rated Buy with target prices of Rmb127 and Rmb111 respectively, indicating strong growth potential [8]. - **Risks**: Key downside risks include slower-than-expected AI server ramp-up, increased competition, and delays in new capacity expansion [8]. Operational Efficiency - **R&D and Automation**: The companies are heavily investing in R&D and automation, which is expected to enhance yield rates, operational efficiency, and fast delivery times [37][40]. - **Financial Metrics**: The report anticipates a gross margin increase from 36% in 2025E to 42% in 2030E, driven by a product mix upgrade towards AI server PCBs [41]. Conclusion - The China PCB and CCL industry is poised for significant growth driven by the AI infrastructure boom, with key players like Victory Giant, WUS, and Shengyi Tech expected to benefit from rising demand, specification upgrades, and operational efficiencies. The overall sentiment is positive, with strong revenue and profit growth projections despite potential competitive challenges.

一、董事会会议召开情况 深圳南山热电股份有限公司（以下简称"公司"）第十届董事会第十二次临时会议于2026年1月19日上午9:30时以通 讯表决的方式召开，会议通知及文件已于2026年1月12日以书面和邮件方式送达全体董事。会议由孔国梁董事长召 集并主持表决。会议应参与表决董事7人，实际参与表决董事7人。参与会议表决的人数及会议的召集、召开程序 符合《中华人民共和国公司法》和《深圳南山热电股份有限公司章程》的有关规定。 二、董事会会议审议情况 登录新浪财经APP 搜索【信披】查看更多考评等级 本公司及董事会全体成员保证信息披露的内容真实、准确、完整，没有虚假记载、误导性陈述或重大遗漏。 （三）审议通过了《关于聘任公司审计风控部负责人的议案》 同意聘任饶雯君女士为公司审计风控部负责人。 该议案已经公司第十届董事会审计委员会第十五次会议以同意3票，反对0票，弃权0票审议通过。 （一）审议通过了《关于修订公司〈内部审计管理规定〉的议案》 同意公司对《内部审计管理规定》的修订，修订后的制度详见公司同日在巨潮资讯网上披露的《内部审计管理规 定》。 该议案已经公司第十届董事会审计委员会第十五次会议以同意3票，反对0票，弃 ...

Summary of Shennan Circuits Conference Call Company Overview - **Company Name**: Shennan Circuits Co Ltd (SCC) - **Ticker**: 002916.SZ - **Sector**: Technology, specifically in PCB (Printed Circuit Board) and IC substrate manufacturing - **Headquarters**: Shenzhen, Guangdong, China Key Industry Insights - **AI Networking and Server Growth**: SCC is positioned as a leading supplier of high layer count (HLC) PCBs for AI networking equipment, benefiting from the upward trend in AI investments in China [1][2] - **IC Substrate Demand**: The company is also a key player in the IC substrate market, which is expected to grow significantly due to China's self-reliant AI roadmap [3] Financial Performance and Forecasts - **Revenue Growth**: Revenue forecasts for FY25-27F have been increased by 0.8-5.8%, reflecting stronger demand in both IC substrate and AI PCB sectors [1][14] - **Earnings Growth**: Earnings forecasts for FY25-27F have been raised by 1.6-17%, driven by improved margins and product mix [1][14] - **Target Price**: The target price has been raised to CNY263, implying an 18% upside from the current trading price of CNY222.82 [1][5] Segment Performance - **PCB Segment**: Expected to contribute 20-30% of revenue from AI server and networking applications in FY26F, with a projected CAGR of 30% for FY25-27F [2] - **IC Substrate Segment**: Anticipated to grow at a CAGR of 21% from FY25-27F, contributing 17% of total revenue by FY27F [3] Financial Metrics - **Revenue Estimates**: - FY25F: CNY22,736 million - FY26F: CNY29,039 million - FY27F: CNY35,601 million [4] - **Net Profit Estimates**: - FY25F: CNY2,968 million - FY26F: CNY4,377 million - FY27F: CNY5,826 million [4] - **EPS Growth**: Normalized EPS is expected to grow from CNY5.79 in FY26F to CNY8.74 in FY27F, reflecting a strong growth trajectory [4] Risks and Challenges - **Capacity Constraints**: SCC is facing capacity constraints in the AI PCB market for FY25F, which could impact growth [1] - **Market Competition**: Increased competition in the PCB market and potential sanctions on telecom companies in China pose risks to achieving the target price [12][19] Valuation Methodology - The target price of CNY263 is based on a P/E ratio of 40x FY26F EPS of CNY6.56, aligned with a projected earnings CAGR of 40% for FY25-27F [1][19] Additional Insights - **Market Capitalization**: Approximately USD 21.3 billion [5] - **Dividend Yield**: Expected to increase from 0.8% in FY25F to 1.6% in FY27F [4] - **ROE Improvement**: Projected ROE to rise from 18.9% in FY25F to 26.5% in FY27F, indicating improved profitability [4] This summary encapsulates the key points from the conference call regarding Shennan Circuits, highlighting its growth potential, financial forecasts, and the challenges it faces in the current market environment.

Summary of Shennan Circuit Conference Call Company Overview - **Company**: Shennan Circuit (002916.SZ) - **Industry**: Printed Circuit Board (PCB) and Copper Clad Laminate (CCL) Key Points Incentive Plan - Shennan announced a Phase II Restricted Stock Incentive Plan, granting **15.16 million shares** (2.27% of total issued capital) to **667 key personnel** at a price of **RMB 114.72/share** [1][2] - The plan aims to align key talent with shareholder interests during the AI upcycle, with stringent unlocking criteria including: - Recurring net profit CAGR of **≥13%** compared to 2024 - Continuous ROE improvement to **>12.8%** by 2028 - Performance in the **75th percentile** of industry peers [1][2] Financial Performance Expectations - The incentive scheme is designed to ensure double-digit year-on-year growth during **2026-2028E** and to outperform major peers [2] - The exercise price reflects a **40% discount** from the closing price of **RMB 191.2/share** prior to the announcement [2] Market Position and Valuation - Shennan's target price is set at **RMB 281**, indicating an expected share price return of **46.1%** and a total return of **47.1%** [3] - The company is positioned as a key player in the domestic AI server and auto segments, contributing over **55%** of total PCB sales [7] - The target PE of **48x** forward reflects a **40-50% premium** to the sector average, justified by Shennan's leading position and technology leadership [7] Risks - Potential downside risks include: - Slower-than-expected growth in the China AI server market - Weaker demand for auto and ADAS systems - Lower-than-expected profits from the new plant in Wuxi - Higher laminate cost inflation [8] Conclusion - The recent stock price retreat of over **20%** from the year-to-date peak in early October has led to a reiteration of the **Buy** rating [1]

Summary of Shennan Circuits (002916.SZ) Conference Call Company Overview - **Company**: Shennan Circuits (002916.SZ) - **Market Cap**: Rmb102.6 billion / $14.4 billion - **Target Price**: Rmb254.00, raised by approximately 70% from previous estimates - **Current Price**: Rmb199.96 - **Upside Potential**: 27.0% [1][30] Key Industry Insights - **Industry Focus**: Transition from telecom PCB to AI PCB, targeting compute and networking demands, particularly in the context of the growing market for 800G and 1.6T optical transceivers [1][22] - **Growth Drivers**: - Expansion of high-end PCB capacity in Jiangsu and Thailand factories [1][23] - Increased demand for AI PCB from AI accelerators, optical transceivers, and switches [1][22] - Strong growth in IC substrate business driven by memory chips [1][24] Financial Performance and Projections - **Earnings Growth**: Expected net income growth of 44% CAGR from 2025 to 2027 [1] - **Revenue Estimates**: - 2025: Rmb22,775 million (up 7% from previous estimates) - 2026: Rmb28,491 million (up 15%) - 2027: Rmb35,503 million (up 29%) [1][27] - **Gross Margin Improvement**: Anticipated increase in gross margin by 2.6ppts, 2.7ppts, and 3.4ppts for 2025, 2026, and 2027 respectively [1][26] Competitive Positioning - **Market Position**: Shennan has established long-term partnerships in the telecom sector, which aids its entry into the data center PCB market [4] - **Competitive Risks**: Potential competition from peers with higher exposure to AI and data centers, which could impact pricing and margins [4][37] Capacity and Production - **Capacity Expansion**: Significant ramp-up in production capacity expected from the Jiangsu Nantong factory and Thailand factory in 2026 [19][23] - **Product Mix Upgrade**: Transition towards high-layer count PCBs and optical transceivers, with a projected increase in AI PCB revenue contribution to 28%, 36%, and 41% of total PCB revenues from 2025 to 2027 [22] Investment Thesis - **Recommendation**: Maintain Buy rating based on strong growth prospects in AI PCB and IC substrate markets, supported by capacity expansion and product upgrades [1][30] - **Risks**: Slower-than-expected expansion into AI PCB, increased competition, customer concentration risks, and slower growth in server/automotive PCB and IC substrate markets [37] Conclusion - Shennan Circuits is positioned to benefit from the growing demand for AI PCBs and high-end IC substrates, with significant revenue and earnings growth projected over the next few years. The company's strategic expansion and product upgrades are expected to enhance its competitive edge in the evolving technology landscape.

Summary of Shennan Circuit (002916.SZ) Conference Call Company Overview - **Company**: Shennan Circuit - **Industry**: PCB (Printed Circuit Board) manufacturing - **Market Position**: Leading PCB supplier in China, focusing on telecom and aeronautics sectors, with a "3-in-1" model encompassing PCB, PCB assembly, and IC substrate packaging [20][21] Key Financial Highlights - **Revenue Growth**: - 9M25 revenue increased by 28.4% year-over-year (YoY) to RMB 16.754 billion, with 3Q25 growth at 33.3% compared to 25.6% in 1H25 [1] - **Net Profit**: - Attributable net profit surged 56.3% YoY to RMB 2.326 billion, with 3Q25 growth accelerating to 92.9% compared to 37.8% in 1H25 [1] - **Earnings Estimates**: - 2025-27 earnings estimates raised by 13-15%, target price increased to RMB 281 from RMB 230 based on a 48x PE for 2026E [1][22] 4Q25 Outlook - **Revenue Forecast**: Expected 4Q25 revenue growth of 33% YoY to RMB 6.427 billion, similar to 3Q growth [3] - **Net Profit Forecast**: Anticipated net profit growth of 115% to RMB 838 million, driven by a low base in 4Q24 [3] Capacity Expansion Plans - **New Plants**: - Thai plant to start in mid-2025, targeting annual revenue of RMB 1.3 billion - Nantong Phase 4 for AI-PCB to commence in 4Q25, with projected annual revenue of RMB 1.5 billion [4] - **Capital Expenditure**: High capex of around RMB 3 billion per annum planned to support AI infrastructure growth [4] Margin and Cost Insights - **Gross Margin**: - 3Q25 gross margin improved to 31.4%, with net margin rising to 15.3% [11] - **Material Cost Inflation**: - Major CCL players increased ASP by RMB 5-10 per sheet in October due to a ~10% rise in copper costs [12] Segment Performance - **PCB and Substrate Segments**: - PCB segment gross margin reached a record high of 36% in 3Q25, with AI-PCB margins estimated at over 40% [10] - Substrate gross margin improved significantly to ~20% in 3Q25 from 15% in 1H25 [10] Investment Strategy - **Recommendation**: Buy rating maintained, with a preference for Shengyi Tech over Shennan due to higher operating leverage in the CCL industry [1][21] - **Market Exposure**: Over 80% revenue exposure to PCB-related businesses, with strong growth potential in AI servers and automotive sectors [21] Risks - **Downside Risks**: - Slower-than-expected growth in AI server demand, weaker automotive demand, and higher laminate cost inflation could impact performance [23] Conclusion - Shennan Circuit is positioned for significant growth driven by its strong market position in the PCB sector, ongoing capacity expansions, and favorable industry dynamics, despite potential risks from market fluctuations and cost pressures [1][21][23]

Company and Industry Summary Company: 深南电路 (Shennan Circuits) Key Financial Performance - Q3 revenue reached 6.3 billion RMB, a quarter-on-quarter increase of 11% and a year-on-year increase of 11% [2][3] - Year-to-date revenue for the first three quarters was 16.75 billion RMB, a year-on-year increase of 28% [3] - Net profit for Q3 was 966 million RMB, with a year-on-year growth of 11% [2][3] - Year-to-date net profit was 2.33 billion RMB, a year-on-year increase of 56% [3] Business Segments Performance - PCB business contributed approximately two-thirds of revenue growth, while substrate business contributed about one-third [2] - Electronic assembly business saw a slight decline in revenue [2] - Demand from data centers and AI-related devices was the main driver for PCB growth, while increased storage market demand boosted substrate business [2][5] Margin Analysis - PCB business contributed over 60% to gross margin, but substrate business showed more significant margin growth due to improved utilization rates and enhancements at the Guangzhou plant [2][6] - Substrate gross margin improved significantly in Q3 compared to the first half of the year, while PCB gross margin saw only slight growth [6][35] Raw Material and Pricing Dynamics - Rising raw material prices were the main factor driving up substrate prices [2][10] - The increase in gold prices significantly impacted narrow board gross margins [11][30] - The company anticipates that storage market price increases may continue to push upstream prices higher, but the specific impact will depend on market dynamics and supply chain conditions [10] Ongoing Projects and Capacity - Major ongoing projects include Nantong Phase IV and a project in Thailand, with an expected input-output ratio between 1:1 and 1:1.2 [2][6] - Automotive-related business saw a slight decrease in proportion but an absolute increase, constrained by capacity [7] - The company does not plan to shift automotive capacity to AI products due to differing product characteristics and customer supply chain stability requirements [8] R&D and Future Outlook - R&D expenses increased, primarily focused on data centers, communications, and new products [9] - The company is preparing for potential delivery pressures and bottlenecks due to expected growth in the optical module market [4][15] - AI remains a significant growth driver, with strong demand expected to continue in the coming years [36] Market Trends and Competitive Landscape - Domestic PCB growth outpaced international growth in Q3, with local demand showing an increase [19] - The company is focused on maintaining resource allocation to meet customer needs without adjusting for domestic and international market differences [38] Challenges and Risks - The shortage of glass fiber cloth is impacting raw material supply and costs, leading to potential pressure on gross margins in Q4 [34] - Management expenses are expected to rise due to increased salaries and personnel, which may affect overall profitability in the short term [20][33] Conclusion - 深南电路 is experiencing robust growth driven by demand in the PCB and substrate markets, particularly from AI and data center applications. The company is actively managing its projects and R&D investments to capitalize on these trends while navigating challenges related to raw material costs and capacity constraints.

Summary of the Conference Call for ShenNan Circuit Company Overview - ShenNan Circuit is a leading domestic PCB supplier, particularly in the AI PCB sector, with significant experience in the power supply segment of AI servers and has achieved substantial shipments to overseas core ASIC customers [2][3] Financial Performance - In Q2 2025, the company reported a profit of 890 million RMB, exceeding expectations of 800 million RMB, driven by AI-related demand in the PCB business and a high demand for packaging substrates [2][5] - The company anticipates a profit exceeding 4 billion RMB by 2026, with a valuation higher than peers due to its strong performance in the packaging substrate business [4][15] Business Segments - The main business segments include: - PCB: 60% of revenue, serving data centers, communications, automotive electronics, industrial control, and military sectors [10] - Packaging Substrates: 20% of revenue, primarily BT substrates, with ABF substrates also showing growth [10][12] - Electronic Assembly: 15-20% of revenue, related to SMT services [10] AI PCB Business Impact - The AI PCB business is expected to significantly contribute to the company's performance starting in 2024, focusing on wired communication devices such as optical modules, switches, and routers [9][2] - The company has established a strong position in the AI power supply segment, particularly in the three-stage power supply architecture for servers, which has high gross margins [14] Expansion Plans - ShenNan Circuit is actively pursuing expansion plans in: 1. Thailand: New products expected to launch in the second half of the year [7] 2. Nantong: Four-phase expansion focusing on high-end HDI and multilayer products [7] 3. Shenzhen: Upgrading equipment and capacity for high-end HDI and multilayer products [7][6] Market Position and Client Base - The company has a strong presence in both domestic and international markets, serving major clients in the optical module sector and achieving significant shipments to overseas ASIC customers [3][11] - Key clients include major tech companies like Google and Amazon, with expectations of onboarding Meta as a significant customer by 2026 [11] Industry Trends and Competitive Advantages - The PCB industry is experiencing a supply-demand imbalance, particularly for high-layer and HDI PCBs related to AI [16] - ShenNan Circuit's advantages include a broad product range, extensive experience in high-end technology, and strong relationships with leading North American clients [16][17] Conclusion - ShenNan Circuit is positioned for growth with its strategic focus on AI PCB, robust financial performance, and ongoing expansion efforts, making it a noteworthy investment opportunity in the PCB sector [17]

Summary of Shennan Circuits Earnings Call Company Overview - **Company**: Shennan Circuits - **Industry**: PCB (Printed Circuit Board) and IC (Integrated Circuit) substrates manufacturing - **Market Position**: Fourth-largest PCB manufacturer globally as of 2024 [16] Key Financial Results - **Q2 2025 Revenue**: Rmb 5.7 billion, representing an increase of 18.6% QoQ and 30.1% YoY, exceeding consensus estimates by 4% and 6% [2][9] - **Net Profit**: Rmb 869 million, up 77% QoQ and 43% YoY; adjusted net profit (after non-recurring items) was Rmb 780 million, reflecting a 61% QoQ and 37% YoY increase [2][9] - **Gross Profit Margin (GPM)**: Improved to 27.6%, a record high since Q3 2020, up 2.9 percentage points QoQ and 0.5 percentage points YoY [3][9] Revenue Growth Drivers - **PCB Sales Growth**: Increased by 29% YoY, driven by robust demand in data centers, wired communications, and automotive sectors [3] - **Data Center PCB**: Significant growth attributed to global AI capital expenditure upcycle, with revenue mix exceeding 25% compared to 20% in FY24 [3] - **IC Package Substrate Sales**: Rose by 9% YoY, supported by better BT substrate orders due to tight raw material supply [3] Operational Insights - **Utilization Rates**: High utilization rates for both PCB and BT substrates, with ongoing efforts to ramp up production capacity at new plants in Thailand and Nantong [4] - **Future GPM Expectations**: Anticipated recovery of GPM by 4-5 percentage points in H2 2025 [4] Market Outlook - **AI-Related Orders**: Management maintains a positive outlook for AI-related orders, particularly from North American customers, expecting data center revenue to lead growth in 2025 [4] - **Supply Constraints**: The company is currently supply-constrained for high-end PCBs, indicating potential for future growth as capacity expands [4] Investor Sentiment - **Expected Market Reaction**: Anticipated positive reaction from investors due to the earnings beat and favorable outlook for the second half of the year, following significant stock price increases since April [5] Valuation Metrics - **Market Capitalization**: Rmb 86.9 billion (approximately US$12.1 billion) [6] - **12-Month Price Target**: Rmb 171.00, with a current price of Rmb 169.50 [6][31] - **P/E Ratio (2025E)**: 34.3x, with projected EPS of Rmb 4.94 [8] Risks and Considerations - **Downside Risks**: Include slower-than-expected server demand, pricing pressure from clients, and longer breakeven times for new business segments [17] Conclusion Shennan Circuits demonstrated strong financial performance in Q2 2025, driven by robust demand in key sectors, particularly data centers and AI-related applications. The company is well-positioned for future growth, although it faces supply constraints and market risks that could impact its performance.