中国经济网北京7月22日讯 北京君正(300223.SZ)昨日晚间披露《部分股东及董事、高级管理人员减 持股份预披露公告》。 根据公告，股东北京四海君芯有限公司(以下简称"四海君芯")、控股股东暨实际控制人之一、董事 李杰；董事兼副总经理冼永辉；董事张燕祥；副总经理兼董事会秘书张敏计划在2025年8月12日至2025 年11月11日的三个月内以集中竞价方式减持公司股份合计2,630,000股，占公司总股本比例0.5450%。 2021年度向特定对象发行股票募集资金。经中国证监会出具的《关于同意北京君正集成电路股份有 限公司向特定对象发行股票注册的批复》(证监许可[2021]3097号)核准，公司2021年度向特定对象发行 人民币普通股(A股)股票12,592,518股，发行价格为每股人民币103.77元。截至2021年10月29日，公司募 集资金总额为人民币1,306,725,592.86元，扣除证券承销费及保荐费用(含税)后，实际收到募集资金 1,282,076,091.37元。募集资金总额扣除全部不含税发行费用26,039,208.28元后的净额为1,280,686,384.58 元。 据新浪财经报道，数 ...

部分股东及董事、高级管理人员减持股份预披露公告 公司股东北京四海君芯有限公司、控股股东暨实际控制人之一/董事李杰、 董事冼永辉、董事张燕祥、高级管理人员张敏保证向本公司提供的信息内容真实、 准确、完整，没有虚假记载、误导性陈述或重大遗漏。 本公司及董事会全体成员保证公告内容与信息披露义务人提供的信息一致。 特别提示： 证券代码：300223 证券简称：北京君正 公告编号：2025-039 北京君正集成电路股份有限公司 1、持有本公司股份 6,818,009 股（占本公司总股本比例 1.41%）的股东北京 四海君芯有限公司（以下简称"四海君芯"）计划在 2025 年 8 月 12 日至 2025 年 11 月 11 日的三个月内以集中竞价方式减持本公司股份 800,000 股（占本公司 总股本比例 0.1658%）； 2、持有本公司股份 18,717,785 股（占本公司总股本比例 3.88%）的控股股 东暨实际控制人之一、董事李杰计划在 2025 年 8 月 12 日至 2025 年 11 月 11 日 的三个月内以集中竞价方式减持本公司股份 800,000 股（占本公司总股本比例 0.1658%）； 3、持 ...

电子行业 行业研究 | 动态跟踪 需求端迭代滞后于原厂产能收缩，利基 DRAM 行情景气度有望持续 核心观点 投资建议与投资标的 ⚫ 利基存储市场供需格局重塑中，同时叠加 AI 驱动和国产替代机遇，建议关注兆易创 新、北京君正、复旦微电、德明利、朗科科技、东芯股份、江波龙、佰维存储、恒 烁股份、万润科技、深科技、同有科技、普冉股份、聚辰股份等。 风险提示 ⚫ 下游需求增长不及预期；原厂退出进展不及预期。 国家/地区 中国 行业 电子行业 报告发布日期 2025 年 07 月 17 日 看好（维持） | 薛宏伟 | xuehongwei@orientsec.com.cn | | --- | --- | | | 执业证书编号：S0860524110001 | | 蒯剑 | 021-63325888*8514 | | | kuaijian@orientsec.com.cn | | | 执业证书编号：S0860514050005 | | | 香港证监会牌照：BPT856 | | 韩潇锐 | hanxiaorui@orientsec.com.cn | | | 执业证书编号：S0860523080004 | 朱茜 zhu ...

证券代码：300223 证券简称：北京君正 公告编号：2025-038 二○二五年七月十七日 | 1.基本情况 | | | | | --- | --- | --- | --- | | 信息披露义务人 | 北京屹唐盛芯半导体产业投资中心（有限合伙） | | | | 住所 | 北京市北京经济技术开发区景园北街 2 号 52 幢 309 室 | | | | 权益变动时间 | 2025 年 6 月 30 日到 2025 年 7 月 16 日 北京屹唐盛芯半导体产业投资中心（有限合伙）根据自身经营 | | | | 安排，于 | 2025 年 6 月 30 日至 2025 年 7 月 16 日，通过集中竞 价方式减持公司股份 万股。北京屹唐盛芯半导体产 | | | | 权益变动过程 | 482.5372 业投资中心（有限合伙）不属于公司的控股股东和实际控制人， | | | | | 本次权益变动不会导致公司控制权发生变更，不会对公司的持 | | | | | 续性经营产生影响。 | | | | 股票简称 北京君正 | 股票代码 300223 | | | | 变动方向 上升□ | 下降√ 一致行动人 有□ | 无√ | | | ...

一、股东股份质押基本情况 1、本次股份质押基本情况 | 股东 | 是否为控 股股东或 第一大股 | 本次质押 | 占其所 持股份 | 占公司 总股本 | 是否 为限 | 是否为 补充 | 质押起 | | 质押到 | | 质权人 | 质押 | | --- | --- | --- | --- | --- | --- | --- | --- | --- | --- | --- | --- | --- | | 名称 | | 数量（股） | | | | | 始日 | | 期日 | | | 用途 | | | 东及其一 | | 比例 | 比例 | 售股 | 质押 | | | | | | | | | 致行动人 | | | | | | | | | | | | | 李杰 | 是 | 635,600 | 3.40% | | | | 2025 | | 9999 | | 国泰海通 | 个人资 | | | | | | 0.13% | 否 | 否 | 年 7 | 月 | 年 1 | 月 | 证券股份 | 金需求 | | | | | | | | | 15 日 | | 1 日 | | 有限公司 | | 2、股东股份累计质押情况 截至公告披露日 ...

证券代码：300223 证券简称：北京君正 公告编号：2025-036 北京君正集成电路股份有限公司 股东部分股份质押和解除质押的公告 本公司及董事会全体成员保证信息披露内容的真实、准确和完整，没有虚假 记载、误导性陈述或重大遗漏。 北京君正集成电路股份有限公司（以下简称"公司"）近日收到控股股东李 杰的通知，获悉其所持有本公司的部分股份办理了质押和解除质押手续，具体事 项如下： 一、股东股份质押基本情况 | 股东 | 是否为控 股股东或 | 本次质押 | 占其所 | 占公司 | 是否 | 是否为 | 质押起 | | 质押到 | | 质押 | | --- | --- | --- | --- | --- | --- | --- | --- | --- | --- | --- | --- | | 名称 | 第一大股 | 数量（股） | 持股份 | 总股本 | 为限 | 补充 | 始日 | | 期日 | 质权人 | 用途 | | | 东及其一 | | 比例 | 比例 | 售股 | 质押 | | | | | | | | 致行动人 | | | | | | | | | | | | 李杰 | 是 | 4,448,800 | ...

Industry Overview - The Internet of Things (IoT) chip industry has a comprehensive supply chain, with upstream suppliers providing raw materials and equipment, midstream manufacturers handling design, production, and testing, and downstream application service providers integrating chips into various devices [1][2]. Key Players - Major upstream suppliers include SMIC, Zhonghuan, Nanda Optoelectronics, and others, while midstream manufacturers consist of ZTE, Tailin Microelectronics, and others. Downstream service providers include Alibaba Cloud, China Mobile IoT, and Xiaomi [2]. Regional Distribution - Key IoT chip companies are concentrated in economically developed regions such as Jiangsu, Guangdong, Beijing, and Shanghai, with Jiangsu and Shanghai showing rapid development in the IoT chip sector [4]. Business Layout Comparison - Companies like Silan Micro, SiTewave, and Allwinner Technology focus primarily on the domestic market, while Beijing Junzheng, Zhaoyi Innovation, and Ankai Micro target international markets. Tailin Microelectronics has a significant focus on IoT chips, with 90.62% of its revenue coming from this sector [6][8]. Investment Trends and Business Plans - Companies are increasing R&D investments to enhance chip performance. For instance, Ruixin Micro plans to launch a new AI vision chip by May 2025, while Allwinner Technology is focusing on low-power designs for its IoT Bluetooth audio chips [9][10].

Core Viewpoint - The AI camera glasses market in China is experiencing a paradox where local products are available, yet the market remains stagnant despite significant global growth, primarily dominated by Ray-Ban Meta's offerings [2][3]. Group 1: Market Dynamics - In Q1 2025, the global AI smart glasses market saw a dramatic increase in sales, reaching 600,000 units, a 216% year-on-year growth, with Ray-Ban Meta capturing 528,000 units [2]. - The Chinese market has local products like Raybird V3 and Xiaomi AI glasses, but the overall market is characterized by a disconnect between hype and actual sales [2][3]. Group 2: Industry Challenges - The market faces dual industrial bottlenecks: a lack of mature adaptation solutions beyond Qualcomm AR1, leading to "patchwork innovation," and an underestimation of the system-level design complexity required for AI glasses [3]. - The technical complexity of AI camera glasses is significantly higher than traditional wearables, with challenges in achieving a balance between weight (50g) and performance (12MP camera and 4-hour battery life) [3][6]. Group 3: Technological Developments - The cost reduction of AI models has led to increased confidence among chip manufacturers to enter the AI glasses market, which was previously met with skepticism [5][6]. - AI audio glasses have made headway by leveraging existing TWS earphone supply chains, while AI camera glasses struggle due to their complex technology stack [6][8]. Group 4: Chip Innovations - Companies like Junzheng are proactively providing dedicated chips for AI glasses, marking a shift in the industry landscape [8][10]. - Junzheng's C100 chip, with a size of 5mm x 6mm and a weight of 0.053g, achieves 1080P video recording at a power consumption of 280mW, showcasing advancements in low power and miniaturization [8][9]. Group 5: Future Outlook - The global smart glasses shipment is projected to reach 12.8 million units by 2025, growing at 26%, driven by advancements in Chinese chip technology and market demand [11]. - Junzheng is developing the next generation CW series ISP, aiming for further miniaturization and lower power consumption, which could redefine the AI camera glasses market in China [11][10].

Group 1 - The core viewpoint of the article highlights the continuous growth of China's semiconductor materials market, with Taiwan being the largest consumer market globally [2] - The semiconductor materials are categorized into front-end manufacturing materials and back-end packaging materials, with specific components listed for each category [1] - The market size for semiconductor silicon wafers in China is projected to exceed $2 billion in 2024, reflecting significant growth driven by policy support and technological advancements [3] Group 2 - China's semiconductor equipment market has become the largest globally, with a market size of $366 billion in 2023, showing a 29% year-on-year increase [6] - The demand for thin film deposition equipment in China has been steadily increasing, with the market size growing from 16.8 billion yuan in 2018 to 60 billion yuan in 2023, indicating a compound annual growth rate of 28.99% [8] - The semiconductor materials market in mainland China reached $131 billion in 2023, with projections of $142 billion for 2024 [2]

Core Viewpoint - The Internet of Things (IoT) chip market in China is experiencing significant growth, with projections indicating a market size of approximately 4.3 trillion yuan in 2024 and 5.1 trillion yuan in 2025, driven by the increasing number of IoT connected devices and advancements in technology such as 5G and AI [1][4][8]. Industry Definition and Classification - IoT chips are integrated circuits specifically designed for IoT devices, serving as core hardware components that connect physical devices to the internet. They are categorized into various types, including security chips, mobile payment chips, communication RF chips, and identity recognition chips [2][4]. Current Development Status - The number of IoT connected devices in China is expected to grow from 2.43 billion in 2019 to 15.11 billion in 2024, with the market size increasing from 1.7556 trillion yuan to 4.307 trillion yuan during the same period. By 2025, the number of devices is projected to reach approximately 17.34 billion, with a market size of about 5.0608 trillion yuan [4][6]. Industry Chain - The IoT chip industry chain consists of upstream raw materials (silicon wafers, packaging materials), midstream chip manufacturing (design, testing), and downstream applications (smart cities, smart homes, industrial IoT) [10][12]. Competitive Landscape - The competitive landscape of the IoT chip market is characterized by international giants dominating the high-end sector (e.g., Qualcomm, Intel) while domestic companies focus on the mid-to-low-end market. Key domestic players include Huawei, ZTE Microelectronics, and several others [16][19]. Industry Development Trends - The IoT chip industry is expected to see continuous advancements in performance and quality, with a significant focus on low power consumption as a key development direction. The integration of microprocessors, memory, and network interfaces in IoT chips facilitates data collection, processing, and transmission [23].