Core Insights - The company, Sytak (301568.SZ), has indicated that its core products, 3D SPI (3D Solder Paste Inspection) and 3D AOI (3D Automated Optical Inspection), are applicable in the aerospace sector for quality control in critical processes [1] Product Application - The 3D SPI and 3D AOI technologies are utilized for quality inspection in PCB SMT (Surface Mount Technology) production lines and chip packaging processes [1] - The company refrains from disclosing specific customer information due to confidentiality [1]

Core Viewpoint - The company, Sytak (301568.SZ), emphasizes the application of its core products, 3D SPI and 3D AOI, in the detection of chip packaging processes, specifically for assessing the quality of solder balls and solder paste [1] Group 1 - The 3D SPI (3D Solder Paste Inspection) and 3D AOI (3D Automated Optical Inspection) are key products that can be utilized in chip packaging quality detection [1] - The company plans to launch a new optical inspection device, referred to as the "third optical inspection machine," in 2024, which will focus on detecting processes such as flux, chip bonding, wire bonding, and flip chip connections [1] - This new device is positioned as a critical inspection tool within the chip packaging industry [1]

Group 1 - The core products of the company, 3DSPI (3D Solder Paste Inspection Equipment) and 3DAOI (3D Automated Optical Inspection Equipment), are utilized in the quality control of core processes in the commercial aerospace sector [1] - These products are specifically applied in the quality inspection of PCB (Printed Circuit Board) production processes and chip packaging processes [1]

Core Insights - The company, Sytak (301568), announced on December 8 that its core products, 3D SPI (3D Solder Paste Inspection) and 3D AOI (3D Automated Optical Inspection), have been applied in the commercial aerospace sector for quality control in core processes [1] Group 1 - The 3D SPI and 3D AOI technologies are utilized for quality inspection in PCB (Printed Circuit Board) production processes [1] - These technologies are also employed in the chip packaging process for quality detection [1]

Group 1 - The company, Sytak, has confirmed that its core products, 3D SPI (3D Solder Paste Inspection) and 3D AOI (3D Automated Optical Inspection), are being utilized in the commercial aerospace sector for quality control in critical processes [2] - These products cover quality inspection in PCB SMT (Surface Mount Technology) production lines and chip packaging processes [2]

Core Viewpoint - The aerospace sector has a high demand for PCB (Printed Circuit Board) performance, reliability, and environmental adaptability, which exceeds that of ordinary industrial or consumer electronics [2] Company Insights - The company, Stitek, specializes in 3D SPI (3D Solder Paste Inspection) and 3D AOI (3D Automated Optical Inspection) equipment, which are primarily used for quality inspection in the SMT (Surface Mount Technology) production lines of various PCBs [2] - The end products of the company's core offerings are utilized in the aerospace field [2]

Core Viewpoint - The company, Stitek, confirms that its core products, 3D SPI and 3D AOI, are widely used in the aerospace sector for quality inspection of PCBs, which have higher performance and reliability requirements compared to ordinary industrial or consumer electronics [2]. Group 1 - The aerospace field extensively utilizes PCBs, with stringent demands on performance, reliability, and environmental adaptability [2]. - Stitek's main products, 3D SPI (3D Solder Paste Inspection) and 3D AOI (3D Automated Optical Inspection), are primarily applied in the quality inspection phase of SMT production lines for various PCBs [2]. - The end products of Stitek's technology cover the aerospace sector [2].

Core Viewpoint - The company, STK, has shown significant growth in revenue and net profit, while its stock performance and financing activities indicate a low level of market engagement and high potential for future investment opportunities [1][2]. Group 1: Stock Performance - On December 2, STK's stock price decreased by 0.97%, with a trading volume of 78.74 million yuan [1]. - The financing buy-in amount for STK on the same day was 13.21 million yuan, while the financing repayment was 7.93 million yuan, resulting in a net financing buy-in of 5.28 million yuan [1]. - As of December 2, the total financing and securities lending balance for STK was 141 million yuan, which is 6.12% of its circulating market value, indicating a low financing balance compared to the past year [1]. Group 2: Financing and Securities Lending - On December 2, STK had no securities lent or repaid, with a securities lending balance of 0 shares, which is at a high level compared to the past year [1]. - The current financing balance of 141 million yuan is below the 30th percentile level of the past year, suggesting a low engagement in financing activities [1]. Group 3: Company Financials - As of September 30, STK had 13,800 shareholders, a decrease of 17.31% from the previous period, while the average number of circulating shares per person increased by 20.93% to 3,456 shares [2]. - For the period from January to September 2025, STK reported a revenue of 311 million yuan, representing a year-on-year growth of 44.13%, and a net profit attributable to shareholders of 77.81 million yuan, up 48.55% year-on-year [2]. - Since its A-share listing, STK has distributed a total of 128 million yuan in dividends [2].

Core Viewpoint - The company has developed a proprietary multimodal AI-assisted re-evaluation system, which enhances the speed and accuracy of machine vision inspection equipment used in electronic assembly production lines [1] Group 1: Technology Development - The multimodal AI-assisted re-evaluation system was independently developed by the company and obtained intellectual property rights in 2020 [1] - This system is applied in the company's 3D solder paste inspection (3D SPI) and 3D automated optical inspection (3D AOI) equipment [1] - The system focuses on processing and analyzing modal information of electronic components being tested [1] Group 2: Future Outlook - Currently, the company's products have not integrated external large models [1] - The company plans to closely monitor advancements in cutting-edge technologies and explore the feasibility of integrating these technologies into research and application based on business needs [1]

格隆汇11月25日丨思泰克(301568.SZ)公布，截至本公告披露日，公司通过股份回购专用证券账户以集 中竞价交易方式实施回购股份677,049股，占公司目前总股本（未扣除公司回购专用证券账户中的股 份，下同）的比例为0.66%，回购最高成交价为34.60元/股，回购最低成交价为29.86元/股，已支付的资 金总额为人民币21,900,331.25元（不含交易费用）。公司本次回购股份方案已实施完毕，回购的资金总 额已达到回购方案中的回购资金总额下限，且不超过回购资金总额上限，符合公司既定的回购方案要 求，且符合相关法律法规的要求。 ...