MEMS技术
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中国移动旗下基金入股MEMS晶圆制造商,下一个风口是?
Sou Hu Cai Jing· 2026-01-05 06:13
公开信息显示,该公司主要从事MEMS晶圆制造,可加工产品涵盖惯性传感器、压力传感器、光MEMS器件、环境传感器、喷墨打印头等,产品主要应用 于高端装备、汽车电子、工业控制与仪表、石油化工、智能家居、消费电子等应用领域。 | | | 煎公司 在用的商业资间工具 | 童老板 童关系 音风险 | | | | | | | | --- | --- | --- | --- | --- | --- | --- | --- | --- | --- | | | | 中小企业发展子基金旗下机构 | 安徽华鑫微纳集成电路有限公司 | 区 | 天眼一下 | 盤 应用 ▼ | 商务合作 企业级产品 | | 此处有 ... ▼ | | 基本信息 52 | | 法律诉讼 | 经营风险 | 经营信息 999+ | | 公司发展 29 | 知识产权 42 | | 历史信息 40 2 | | 股东信息 ● 富股权结构 | | | | | | | | | 2天眼查 | | 股东信息9 | | MIP 历史股东信息 6 股权变更历程42 | | | | | | 股东类型, | ® 음田 | | 序号 | | 股东名称 | | 持股比例÷ | 认缴出 ...
2026年中国MEMS微纳米制造零部件行业产业链、市场规模、竞争格局及发展趋势研判:随着MEMS技术在多个领域加速渗透,市场规模有望达到77亿元[图]
Chan Ye Xin Xi Wang· 2026-01-03 02:50
Core Insights - The MEMS micro-nano manufacturing components industry is experiencing rapid growth due to increased penetration in consumer electronics, automotive electronics, industrial automation, and healthcare sectors, with the global market expected to reach 7.3 billion yuan by 2025 and 7.7 billion yuan by 2026 [1][5][10] Industry Definition and Classification - MEMS (Micro-Electro-Mechanical Systems) combines electronic and mechanical technologies to create devices at micro or nano scales, enabling smart and integrated systems [2][3] - Key components include sensors, acoustic modules, optical modules, pressure sensors, and inertial sensors, characterized by miniaturization, integration, and mass production [3][4] Current Industry Status - The MEMS micro-nano manufacturing components market is expanding, driven by technological advancements and increasing demand for miniaturized and intelligent devices [4][5] - The largest segment within this market is sensors, followed by acoustic modules, with significant growth projected in various subcategories [5] Industry Chain - The upstream of the MEMS industry includes high-grade metals, silicon-based materials, polymers, and precision equipment, with high technical barriers and reliance on imports for some high-end materials [6] - The midstream focuses on the production of MEMS components, characterized by high technology barriers and added value [6] - The downstream applications span aerospace, automotive, biomedical, and consumer electronics sectors [6] Competitive Landscape - The MEMS micro-nano manufacturing components market in China is primarily dominated by foreign companies, with domestic firms accelerating their efforts to replace imports and enhance core technologies [7] - Key players include AAC Technologies, Huazhong University of Science and Technology, Goertek, and others, with ongoing advancements in various segments [7][8] Development Trends - The MEMS industry is evolving towards micro-nano precision manufacturing of integrated functional components, emphasizing miniaturization, integration, and mass production [9][10] - Future growth is anticipated as technological advancements lower production costs and expand applications across various sectors, including IoT, consumer electronics, and automotive industries [10]
芯动联科(688582):强芯强国之特种模块/芯片系列报告之八:MEMS惯性传感器领军者,国产替代叠加场景拓展驱动高增长
Shenwan Hongyuan Securities· 2025-12-29 06:52
同研究 /公司深 2025 年 12 月 29 日 下载动联科 (688582) 强芯强国之特种模块/芯片系列报告之八: MEMS 惯性 传感器领军者,国产替代叠加场景拓展驱动高增长 型入(首次评级) | 市场数据: 2025 年 12 月 26 日 | | | --- | --- | | 收盘价(元) 68.25 | | | 一年内最高/最低(元) 88.95/45.57 | | | 市净率 | 11.3 | | 股息率%(分红/股价) | 0.56 | | 流通 A 股市值 (百万元) 17,077 | | | 上证指数/深证成指 3,963.68/13,603.89 | | | 注:"股息率"以最近一年已公布分红计算 | | | 基础数据: | 2025年09月30日 | | --- | --- | | 每股净资产(元) | 6.05 | | 资产负债率% | 3.13 | | 总股本/流通 A 股 (百万) | 402/250 | | 流通 B 股/H 股 (百万) | -/- | 年内股价与大盘对比走势: 沪深300指数 证券分析师 韩强 A0230518060003 hanqiang@swsres ...
芯动联科(688582):强芯强国之特种模块、芯片系列报告之八:MEMS惯性传感器领军者,国产替代叠加场景拓展驱动高增长
Shenwan Hongyuan Securities· 2025-12-29 03:21
上 市 公 司 公 司 研 究 / 公 司 深 度 2025 年 12 月 29 日 芯动联科 (688582) ——强芯强国之特种模块/芯片系列报告之八:MEMS 惯性 传感器领军者,国产替代叠加场景拓展驱动高增长 报告原因:首次覆盖 买入(首次评级) | 市场数据: 2025 年 12 月 26 日 | | | --- | --- | | 收盘价(元) | 68.25 | | 一年内最高/最低(元) | 88.95/45.57 | | 市净率 | 11.3 | | 股息率%(分红/股价) | 0.56 | | 流通 A 股市值(百万元) | 17,077 | | 上证指数/深证成指 3,963.68/13,603.89 | | | 注:"股息率"以最近一年已公布分红计算 | | | 基础数据: | 2025 年 09 月 30 日 | | --- | --- | | 每股净资产(元) | 6.05 | | 资产负债率% | 3.13 | | 总股本/流通 A 股(百万) | 402/250 | | 流通 B 股/H 股(百万) | -/- | 一年内股价与大盘对比走势: -50% 0% 50% 100% ...
英唐智控:公司MEMS微振镜采用电磁驱动技术,实现激光束的水平与垂直双维扫描
Zheng Quan Ri Bao Wang· 2025-12-18 14:17
证券日报网讯12月18日,英唐智控(300131)在互动平台回答投资者提问时表示,公司MEMS微振镜采 用电磁驱动技术,实现激光束的水平与垂直双维扫描,大幅降低体积、功耗及成本,公司在MEMS领域 具有专业的技术实力和市场竞争力,公司已拥有MEMS器件级别以及LBS(基于激光束扫描的投影方案) 全套系统开发能力,且自有的MEMS器件自动化生产线已经实现了量产。 ...
英唐智控:自有的MEMS 器件自动化生产线已经实现了量产
Ge Long Hui· 2025-12-18 09:20
格隆汇12月18日丨英唐智控(300131.SZ)在互动平台表示,公司MEMS微振镜采用电磁驱动技术,实现 激光束的水平与垂直双维扫描,大幅降低体积、功耗及成本,公司在MEMS领域具有专业的技术实力和 市场竞争力,公司已拥有MEMS器件级别以及LBS(基于激光束扫描的投影方案)全套系统开发能力, 且自有的MEMS 器件自动化生产线已经实现了量产。 ...
敏芯股份:公司致力于成为一家MEMS技术平台型公司
Zheng Quan Ri Bao Wang· 2025-12-18 07:44
证券日报网讯12月17日,敏芯股份在互动平台回答投资者提问时表示,公司致力于成为一家MEMS技术 平台型公司,目前公司产品的收入结构体现出齐头并进的均衡发展态势,公司已从原先的"单一产品"发 展道路成功开辟出第二乃至第三产品增长极,进一步验证了公司是基于MEMS技术的平台型公司的定 位,从而向打造全品类传感器矩阵的目标迈出了坚实的一步。公司希望通过2-3年的周期,布局完成: 高信噪比的声学、压力/压感/微差压、惯性/姿态感知(加速度+陀螺、IMU)、磁、光等全物理量传感器 的产品布局,从而更好地应对消费类电子、机器人、汽车、AI产品等各下游新兴应用场景的产品需 求。 ...
英唐智控(300131.SZ):MEMS微振镜的偏转速度是微秒级别
Ge Long Hui· 2025-12-11 15:20
Core Viewpoint - The company, Yintan Zhikong (300131.SZ), confirmed that the deflection speed of its OCS MEMS micro-mirror is at the microsecond level, which is a critical feature for achieving millisecond-level overall optical path switching in OCS systems [1] Group 1 - The deflection speed of the MEMS micro-mirror is at the microsecond level [1] - This fast mechanical response supports OCS in achieving millisecond-level optical path switching [1] - Faster deflection speeds lead to higher switching frequencies for OCS [1]
英唐智控(300131) - 2025年11月26日投资者关系活动记录表
2025-11-26 14:40
Group 1: Company Overview - The company, Shenzhen Yingtang Intelligent Control Co., Ltd., focuses on electronic component distribution and has built a global multi-regional network covering various product categories including main chips, storage, RF, display drivers, power/amplifier devices, MEMS sensors, and passive components [2][3]. - The company has successfully introduced automotive display chip business into several leading screen manufacturers, with the first automotive-grade TDDI/DDIC entering mass production [2][3]. Group 2: Technology and R&D - The company is increasing R&D investment, with a 90.06% year-on-year growth in R&D expenses in the first three quarters, primarily focusing on display chip development [4]. - The company is preparing to acquire Guilin Guanglong Integrated and Shanghai Aojian Microelectronics to strengthen its layout in optical communication chips and analog integrated circuits [3]. Group 3: Product Development and Market Strategy - The company is developing laser scanning projection (LBS) technology, which offers advantages over traditional high-power light sources used in high-end vehicles, such as color, high resolution, and compact size [2][3]. - The OCS (Optical Circuit Switching) business is gradually increasing its revenue share, with plans to expand product series and ensure supply chain stability for larger-scale production [7][9]. Group 4: Production and Quality Assurance - The company has achieved mass production for OCS products with channel specifications of 32×32, 64×64, and 96×96, while preparing for the mass production of 128×128 channels expected in early to mid-2026 [10]. - The production yield for Guanglong Integrated's OCS chips is at a good industry level, with ongoing investments in process optimization and technology iteration to enhance competitiveness [8]. Group 5: Risks and Regulatory Compliance - There are risks associated with the asset purchase transaction, including potential delays or cancellations due to regulatory review processes [11]. - The company assures that the investor relations activities do not involve any undisclosed significant information [11].
赛微电子(300456):MEMS代工领域龙头,智能传感时代迎成长机遇——公司首次覆盖报告
Huafu Securities· 2025-11-07 09:20
Investment Rating - The report assigns a "Buy" rating for the company, citing its status as a domestic leader in MEMS foundry with certain scarcity in the market [5][7]. Core Insights - The company is a leading player in the MEMS foundry sector, having acquired Silex Microsystems, a global leader in MEMS chip manufacturing, and is focusing on semiconductor business [3][16]. - The MEMS market is expected to grow from USD 14.6 billion in 2023 to USD 20 billion by 2029, with a CAGR of 5%, presenting significant growth opportunities for the company [4]. - The company is actively developing key technologies in "bottleneck" areas such as filters and LiDAR, which are becoming new growth drivers [5]. Summary by Sections Company Overview - Established in May 2008 and listed on the Shenzhen Stock Exchange in May 2015, the company specializes in high-end integrated circuit chip wafer manufacturing and has independent intellectual property rights [3][16]. - The company acquired Silex in 2016 and has since focused on integrating MEMS business while divesting from aerospace electronics [16][19]. Business Operations - The company's main revenue sources are MEMS wafer manufacturing and process development, accounting for over 80% of total revenue [22]. - The company manufactures various MEMS sensors and devices, serving clients in diverse sectors including communication, biomedical, industrial automotive, and consumer electronics [22][26]. Financial Analysis - Revenue projections for 2025, 2026, and 2027 are estimated at CNY 896 million, CNY 580 million, and CNY 766 million, respectively, with corresponding growth rates of -25.63%, -35.23%, and 31.97% [5][6]. - The company expects a significant increase in net profit in 2025 due to the sale of Silex shares, with a projected net profit of CNY 1.132 billion [5][37]. Research and Development - The company emphasizes R&D, with a spending rate of 30% to 40% of revenue, and has a strong team of experts in MEMS technology [48]. - Ongoing projects include MEMS resonator manufacturing technology and MEMS gas sensor chip development, which are expected to open new market opportunities [47][48].