证 券 研 究 报 告 碳化硅：国内弯道超车趋势已现 ——化合物半导体系列报告之三 证券分析师： 杨海晏 A0230518070003 杨紫璇 A0230524070005 联系人：杨紫璇 A0230524070005 2025.6.27 主要内容 2 1. 海外大厂收缩，SiC竞争格局或收敛 2. 国内厂商在各环节打破垄断 3. 标的梳理 4. 风险提示 投资要点 www.swsresearch.com 证券研究报告 3 ◼ 碳化硅具有耐高温、高压等优势，渗透率提升空间大。随着应用场景提出更高的要求，以碳化硅、氮化镓等 为代表的第三代半导体材料发展迅速。与第一代半导体材料硅相比，碳化硅具备更高的击穿电场强度、饱和 电子漂移速率、热导性和热稳定性，更适合在高压、高频、高功率等领域中应用，并且能实现器件小型化、 轻量化。根据Yole数据，2024年SiC材料渗透率从2020年4%提升到15%。 ◼ 海外大厂发生较多变动，SiC竞争格局或收敛。Wolfspeed在2024年关闭达勒姆6英寸工厂，2025年5月正 式启动破产保护申请程序，近期宣布将依据重组协议申请破产；瑞萨电子终止原定2025年量产的群马县SiC ...

Group 1 - The semiconductor industry relies heavily on both wafer fabs and packaging/testing plants, with wafer fabs responsible for manufacturing chips from designs and cutting them into individual dies, while packaging/testing plants focus on the subsequent packaging and testing processes [1] - Hanxin Technology has invested 1.2 billion in a packaging/testing plant in Zhejiang, which has recently completed its main structure, and upon full production, it is expected to achieve an annual output of 300,000 silicon carbide power modules and 50 million silicon carbide power devices, addressing the growing demand in the high-voltage silicon carbide market [1][4] - The establishment of this plant will enhance Hanxin Technology's annual shipment capacity of silicon carbide devices, alleviating market supply and demand pressures [1] Group 2 - The new packaging/testing project by Hanxin Technology's subsidiary in Lishui marks significant progress in the industrialization of third-generation semiconductors, improving production autonomy and accelerating R&D iterations [3] - The project site is strategically located near transportation hubs, with the nearest high-speed rail station approximately 25 km away and the nearest airport about 163 km away, facilitating logistics and operations [4] - Hanxin Technology, established in October 2019, focuses on the R&D and production of third-generation wide bandgap semiconductor power devices and modules, with its silicon carbide products covering voltage platforms from 650V to 3300V, achieving international leading technology levels [4]

Core Viewpoint - The change of control in *ST Huamei from Shanghai Pengsheng to Jilin Yadong State Capital Investment aims to resolve financial issues and promote the high-quality development of the semiconductor industry in Jilin Province [1][2]. Group 1: Shareholder Change and Financial Implications - The controlling shareholder, Shanghai Pengsheng, will transfer 214 million shares (22.32% of total shares) to Jilin Yadong, with the transfer price primarily used to repay 1.556 billion yuan of occupied funds and interest [1]. - The transaction is expected to resolve the issue of 1.491 billion yuan of non-operational fund occupation by Shanghai Pengsheng and its affiliates, as mandated by the China Securities Regulatory Commission [2]. Group 2: Strategic Importance and Industry Impact - The strategic takeover by state capital is seen as beneficial for creating a sustainable development foundation for the company and addressing historical financial issues caused by the previous controlling shareholder [2]. - The transaction aligns with the broader goal of stabilizing the domestic semiconductor industry and is expected to inject new vitality into the sector by diversifying development paths [2][3]. Group 3: Company Operations and Future Focus - *ST Huamei specializes in power semiconductor devices and is one of the few domestic companies adopting the IDM model, focusing on full industry chain project construction and product innovation [3]. - The company plans to enhance its chip manufacturing capabilities and establish production bases centered on strategic emerging fields such as automotive electronics and renewable energy [3]. Group 4: Governance and Operational Mechanism - Post-transaction, *ST Huamei will become a mixed-ownership listed company with relative state capital control, aiming to establish a market-oriented governance structure and operational mechanism [3][4]. - Jilin Yadong has committed to maintaining the flexibility and dynamism of the company's market operations while ensuring compliance and stimulating innovation [4].

Industry Overview - The semiconductor industry is a core foundation of modern information technology and electronic products, becoming a major battleground for technological competition [1] - The 2025 World Semiconductor Conference showcased nearly 200 exhibitors, highlighting advancements in EDA tools, high-performance computing chips, advanced packaging solutions, and key semiconductor materials [1][3] - Emerging "chip" forces are presenting innovations that make chips smaller, thinner, and faster [1] Company Innovations - Jiangsu Xinkang Microelectronics Technology Co., Ltd. introduced a gallium nitride fast-charging chip that reduces heat generation while increasing power and efficiency, achieving a size reduction of one-third and lowering costs [2] - Jiangsu Superchip Semiconductor Co., Ltd. focuses on silicon carbide, a core material for third-generation semiconductors, which is suitable for high-speed, high-power applications in sectors like high-speed rail and new energy vehicles [2] - The company has developed a proprietary silicon carbide crystal growth technology, winning a gold medal at the 50th Geneva International Invention Exhibition [2] Market Dynamics - The World Semiconductor Conference has attracted over 160,000 professional visitors from 23 countries and regions over six years, showcasing over 1,300 top exhibitors [3] - Nanjing is recognized as a national innovation center for third-generation semiconductor technology, fostering a conducive environment for the semiconductor industry to grow from weak to strong [3][4] - The establishment of national-level technology innovation centers in Nanjing promotes deep integration of innovation chains, industry chains, funding chains, and talent chains [4]

内容概况：作为半导体封装环节的核心设备，塑封机的技术升级与产业布局深刻影响着中国半导体产业 链的自主化进程。2025年1-4月，中国半导体塑封机进口金额为3144.82万美元，同比增长29.46%；出口 金额为1605.21万美元，同比下降28.05%。进口增长方面，一是国内先进封装产能扩张，尤其是第三代 半导体（SiC、GaN）封装线建设，对日本东和半导体、荷兰ASMPT等企业的超高压塑封机需求激增。 二是高端设备国产替代率不足，500MPa级超高压成型机、激光辅助成型设备等仍依赖进口，单台设备 价格超50万美元，推高进口总额。出口下降则反映全球市场压力。一方面，东南亚、印度等新兴市场本 土封装厂崛起，以价格优势挤压中国设备出口；另一方面，美国《芯片与科学法案》限制中国设备进入 高端市场，叠加欧盟碳关税（CBAM）政策，导致出口成本上升。此外，国产设备在稳定性、精度 （±1μm以下）等指标上仍落后于国际巨头，难以满足台积电、三星等大客户要求。 相关上市企业：耐科装备（688419）、三佳科技（600520）、长电科技（600584） 相关企业：衡所华威电子有限公司、北京科化新材料科技有限公司、宁波博威合金材 ...

Group 1 - The market experienced a general decline, with financial and cyclical sectors performing the best, while the STAR 50, consumer, and CSI 2000 indices lagged behind [3][9] - Among industries, non-ferrous metals, petroleum and petrochemicals, and agriculture, forestry, animal husbandry, and fishery showed the highest gains, while household appliances, food and beverage, and building materials performed the weakest [11][12] - The relative PE of the ChiNext index to the CSI 300 decreased, and the relative PB also declined [16] Group 2 - The overall valuation of broad market indices fell, with the current valuations of major indices above the 50% historical percentile level, while the ChiNext index is at a low valuation compared to the past year [24] - Valuation differentiation is evident across industries, with financial real estate valuations above the 50% historical percentile, while materials, equipment manufacturing, industrial services, transportation, consumption, and technology are at or below the 50% level [26] Group 3 - The current valuation of the food and beverage, agriculture, forestry, animal husbandry, and public utilities sectors is relatively cheap, indicating potential investment opportunities [37] - The PB-ROE perspective shows that non-bank financials, public utilities, agriculture, food and beverage, and social services have lower PB-ROE ratios, suggesting they may be undervalued [40] Group 4 - Current popular concepts such as autonomous driving, cultivated diamonds, third-generation semiconductors, digital currency, 6G, robotics, central state-owned enterprises, and large aircraft are at historically high valuation percentiles over the past three years [43]

Core Viewpoint - The event "I am a shareholder" organized by the Shanghai Stock Exchange aims to enhance communication between listed companies and investors, promoting rational investment awareness and understanding of investment value in the Shanghai market [1] Company Overview - Jiangsu Hongwei Technology Co., Ltd. (Hongwei Technology) is a leading enterprise in the domestic power semiconductor sector, listed on the Shanghai Stock Exchange since September 1, 2021 [3] - The company focuses on the design, research and development, production, and sales of power semiconductor chips, with a strong emphasis on IGBT and FRD technologies [3] - Hongwei Technology has established unique technological barriers through innovations in third-generation semiconductor materials and processes, achieving key performance indicators that match international advanced levels with its self-developed seventh-generation power chips [3] Product Applications - The company's products cover various fields including new energy vehicles (electric control systems, charging piles, and OBC power supplies), renewable energy generation (photovoltaic inverters, wind energy converters, and power quality management), energy storage, industrial control (inverters, servo motors, UPS, and various switch power supplies), and consumer appliances [3] Strategic Development - The company plans to enhance product competitiveness through technological iteration and production line optimization, focusing on the industrialization of third-generation semiconductor devices [5] - Hongwei Technology aims to diversify its technology system with a core focus on SiC and GaN, while also exploring applications in robotics and mechanical arms [5] Industry Collaboration - The company has deepened cooperation with industry chain partners like Huahong Hongli, achieving breakthroughs in 12-inch wafer mass production processes [6] - Hongwei Technology's seventh-generation IGBT module products have entered the supply chain of leading automotive manufacturers, demonstrating its competitive edge in the automotive-grade sector [6] Investor Engagement - The event allowed investors to gain insights into the company's operational status and strategic direction, enhancing their confidence in Hongwei Technology [7] - The interactive session provided a platform for discussions on market space, product competitive barriers, and technological iterations, further deepening investors' understanding of the company [6]

Group 1: Industry Overview - Yangzhou has a rich historical background and has experienced significant industrial growth, particularly in the 1990s with its manufacturing sector achieving prominence through eight key industries [1] - The city has developed a "613" industrial system that combines traditional industries with emerging sectors such as aerospace, smart grids, integrated circuits, and artificial intelligence [1] Group 2: Company Spotlight - Yangjie Technology is a leading player in China's semiconductor power device sector and is a core component of the integrated circuit industry chain within the "613" industrial system [2] - The company has established a full-chain R&D and production system for third-generation semiconductors, including chip design, packaging testing, and module integration [2] - Yangjie Technology has received significant accolades, including the Huawei Best Partner Award and recognition from CATL as a key supplier for industry breakthroughs [2] Group 3: Collaborative Efforts - Yangzhou has launched a shared experimental platform for the integrated circuit industry chain to enhance collaboration and innovation among upstream and downstream enterprises [2] - The establishment of the Jiangsu Province Key Laboratory for Third-Generation Semiconductor Power Chips and Module Integration Technology, co-founded by Yangjie Technology and Southeast University, aims to tackle critical technology challenges in the semiconductor field [2]

Group 1: Company Strategy and Development - The company focuses on product and market structure adjustments, emphasizing both internal development and external expansion in the power semiconductor sector [2] - In 2025, the company aims to develop pulse power devices, IGBTs, new optical switches, and IGCTs, targeting high-end application fields such as digital energy and smart manufacturing [2] - The company is committed to reducing costs and optimizing the supply chain to better meet market demands [2] Group 2: Product Innovation and Market Position - The company specializes in power semiconductor technology and products, continuously achieving import substitution [3] - The company maintains a leading position in the domestic industry for high-power semiconductor device technology, with its pulse switch technology reaching international standards [3] - The company collaborates with research institutions and universities to advance the development and application of third-generation wide bandgap semiconductor technologies [3] Group 3: Investor Relations and Market Management - The company has developed a "Quality Return Dual Improvement" action plan to enhance shareholder interests and investor confidence [3] - The company emphasizes the importance of market capitalization management to promote long-term sustainable development [3] - The company has established a complete integrated production line for wafer processing, chip processing, and packaging testing [3]

Core Viewpoint - The silver sintering chip mounting machine market is expected to reach a size of 200 million USD by 2031, with a compound annual growth rate (CAGR) of 6.7% in the coming years, driven by advancements in technology and increasing performance requirements in power semiconductor devices [1]. Market Overview - The silver sintering chip mounting machine is a specialized device used in the semiconductor packaging manufacturing process, responsible for attaching chips to substrates using silver sintering materials to achieve high thermal conductivity and reliability [1]. - The market for silver sintering chip mounting machines is currently experiencing rapid technological evolution, with manufacturers innovating in precision, efficiency, intelligence, and process compatibility to meet diverse application needs [1]. Market Size and Growth - According to QYResearch, the global market for silver sintering chip mounting machines is projected to grow significantly, with the market size expected to reach 200 million USD by 2031, reflecting a CAGR of 6.7% [1]. - The power semiconductor device segment is the largest downstream market, accounting for approximately 74.4% of the demand for silver sintering chip mounting machines [8]. Competitive Landscape - The top five manufacturers in the global silver sintering chip mounting machine market hold about 59.0% of the market share as of 2023 [7]. - Key players in the market include Boschman, AMX Automatrix, NIKKISO, PINK GmbH Thermosysteme, and Zhuhai Silicon Cool Technology [7]. Regional Insights - China is identified as the largest end-user market, benefiting from the growth of the new energy vehicle and third-generation semiconductor industries [8]. - Europe is noted for its high requirements in equipment precision and automation [8]. Technological Trends - The industry is witnessing significant advancements in technology, particularly in areas such as glue dispensing precision control, temperature control systems, and fixture stability, which have historically posed high technical barriers [8]. - Recent breakthroughs by domestic manufacturers in China, particularly in mid-to-high-end mounting processes, are enhancing competitiveness, especially with the integration of silver sintering furnaces for automated processes [8].