Core Viewpoint - The 2025 Pujiang Innovation Forum will be held in Shanghai from September 20 to 22, highlighting the intersection of AI and photonic technology as a combination of "demand-driven" and "technology-pushed" approaches [1] Group 1: AI and Photonic Technology - The relationship between AI and photonic technology is characterized by a surge in AI computing demand, which is expected to push traditional chips to their physical limits [1] - Photonic technology is identified as the only next-generation solution capable of providing ultra-high bandwidth and ultra-low power consumption for interconnects and computing [1] - The industry is transitioning from "connection" to "computation," marking the beginning of a golden era for photonic technology [1]

Core Viewpoint - The announcement from Robotech highlights the growing importance of photonic technology, quantum technology, and optical chips as key competitive areas in the post-Moore's Law era, driven by advancements in semiconductor technology [1] Industry Summary - The development of photonic technology is becoming a core driving force in the 21st-century technological economy, impacting various sectors including telecommunications, data centers, autonomous driving, medical devices, and consumer electronics [1] - The demand for computing power driven by AI is accelerating advancements in the photonics field, particularly in technologies such as silicon photonics, CPO, and OIO, with global leaders actively investing in these areas [1] Company Summary - ficonTEC is positioned to benefit from the market developments in photonic technology by providing high-precision automated equipment and related technical services for the automated micro-assembly, coupling, and testing of optical chips, optical devices, and optical modules [1] - The future business prospects of ficonTEC are expected to support the company's performance positively, aligning with the broader market trends in photonics [1]

Core Insights - The 2025 Frontier Interdisciplinary Science Conference on Optical Engineering opened in Jinhua, Zhejiang, focusing on five cutting-edge interdisciplinary fields: new materials, aerospace technology, green energy, brain-machine interaction, and quantum computing [1] - The conference aims to enhance the capabilities of optical engineering and interdisciplinary fields in serving technological frontiers, accelerating technological progress and discipline integration in China's optical engineering sector [1] Group 1 - The conference theme is "Intersection, Integration, Innovation, Development," reflecting the ongoing global technological revolution and industrial transformation [1] - A total of 210 experts were invited to give keynote speeches, and 204 specialized sub-forums featured outstanding young and middle-aged leaders from various fields [2] Group 2 - The conference also included local industry technology demand matching, technology achievement transfer projects, high-level talent recruitment fairs, and site visits [2] - Over 140 companies participated in the talent recruitment section, with 287 job openings announced by 19 hiring units, including Jinhua Vocational and Technical University and Zhejiang Optoelectronic Research Institute [2]

Core Viewpoint - The article discusses the limitations and challenges of interposer line lengths in advanced packaging, highlighting the differences between electrical and optical interposers and the implications for signal integrity and transmission efficiency [1][11]. Group 1: Interposer Types and Challenges - There are two main types of interposers in production: organic interposers (RDL) and silicon interposers, with organic interposers being significantly cheaper to produce but having larger feature sizes [2]. - The use of silicon does not necessitate narrow lines, as wider signal lines require more signal layers, which is undesirable for manufacturers [2][3]. - The resistance of narrow lines in organic interposers leads to significant insertion loss, which is a major concern for clients [3][5]. Group 2: Signal Integrity and Grounding - Signal integrity is heavily reliant on good grounding, typically provided by ground layers, which can serve multiple functions including power delivery and impedance control [7]. - Controlled impedance is crucial for maintaining signal quality, and even short lines can suffer from interference or crosstalk [7][8]. - Designers strive to minimize loss and maintain grounding around high-speed lines, which can be challenging due to manufacturing constraints [8][10]. Group 3: Optical Interposers and Future Directions - Optical interposers face fewer limitations compared to electrical ones, as optical signals can transmit over longer distances [1][11]. - The integration of optical devices into packaging is a growing trend, with technologies like Lightmatter's Passage aiming to combine CMOS and silicon photonics within an interposer [11][12]. - While photonics offers a potential long-term solution to line length limitations, it is not yet ready for mass production [14].