Core Viewpoint - Shengjian Technology has decided to terminate the issuance of convertible bonds to unspecified objects and withdraw the application documents due to changes in external environment and its own development plans [1] Group 1: Announcement Details - The company held its 15th meeting of the third board of directors and the 13th meeting of the third supervisory board on August 8, 2025, where the decision to terminate the bond issuance was approved [1] - The proposed issuance aimed to raise a total of RMB 492.80 million, which was intended for projects related to domestic semiconductor process auxiliary equipment and working capital replenishment [1] Group 2: Bond Issuance Specifications - The type of securities to be issued is convertible bonds that can be converted into the company's A-shares, with a face value of RMB 100 per bond [2] - The bonds were set to have a term of six years from the date of issuance, with interest paid annually and the principal returned at maturity [3] - The conversion period for the bonds was to start six months after issuance and last until the maturity date [4] Group 3: Underwriting and Regulatory Aspects - The lead underwriter for the bond issuance was Guotai Junan Securities Co., Ltd., with representatives Hu Panpan and Zhou Hangning [5]

Core Viewpoint - Sanxin Medical (300453) announced a plan to issue convertible bonds to unspecified investors, aiming to raise a total of no more than 530 million yuan, including the principal amount [1] Summary by Categories Fundraising Details - The company plans to issue convertible bonds that can be converted into A-shares [1] - The total amount to be raised is capped at 530 million yuan [1] Investment Projects - The fundraising will support four main projects: 1. Expansion project for the annual production of 10 million blood dialysis membranes and 10 million blood dialysis devices [1] 2. Establishment of a new production line for high-performance blood purification equipment and supporting consumables, with an annual capacity of 30 million sets of blood dialysis tubing [1] 3. Expansion of the irradiation sterilization production line for Jiangxi Chengtukang Electronics [1] 4. Supplementing working capital [1]

Core Viewpoint - ZTE Corporation has successfully completed the issuance of H-share convertible bonds totaling RMB 3.584 billion, which are zero-coupon, US dollar-settled, and will mature in 2030 [1] Financial Data - Issuance Scale: RMB 3.584 billion [1] - Net Proceeds: Approximately USD 494.3 million (equivalent to about RMB 3.543 billion) [1] - Purpose of Funds: To enhance the company's investment in computing power product research and development [1] Important Timelines - Issuance Completion Date: August 5, 2025 [1] - Expected Listing Date: August 6, 2025, on the Hong Kong Stock Exchange [1] - Maturity Date: 2030 [1] Additional Points - All preconditions of the subscription agreement have been fulfilled [1] - Convertible shares have received listing and trading approval from the Hong Kong Stock Exchange [1] - The company will comply with relevant filing procedures as per the China Securities Regulatory Commission [1] - Joint Global Coordinators are CITIC Securities and CITIC Jinshi International [1]

Core Viewpoint - The company Jingyan Technology (300709) plans to issue convertible bonds to raise funds for various projects, including the production of precision MIM components for new consumer electronics and data servers, as well as the construction of its headquarters and R&D center [1][2]. Group 1: Convertible Bond Issuance - The company intends to issue convertible bonds with a face value of 100 yuan each, with a total fundraising amount not exceeding 577.89 million yuan [2][4]. - The bonds will have a term of six years and will be listed on the Shenzhen Stock Exchange's Growth Enterprise Market [1]. - The initial conversion price will be determined based on the average stock price over the 20 trading days prior to the announcement, ensuring it does not fall below the latest audited net asset value per share [1][2]. Group 2: Fund Allocation - The total investment for the projects funded by the bond issuance is approximately 588.42 million yuan, with the following allocations: - New consumer electronics and data server precision MIM components production project: 405.34 million yuan - Headquarters and R&D center construction project: 122.06 million yuan - Precision mold center construction project: 61.02 million yuan [4]. - The net proceeds from the bond issuance will be used specifically for these projects after deducting issuance costs [2][4]. Group 3: Shareholder Rights and Prioritization - Existing shareholders will have priority in the allocation of the convertible bonds, with specific ratios to be determined by the board of directors [4]. - The bonds will not be guaranteed, and a qualified credit rating agency will conduct credit ratings and follow-up ratings for the bonds [4].

Group 1 - The Shenzhen Stock Exchange announced the 13th review meeting of the listing committee for 2025 was held on August 1, 2025, with no major questions raised during the inquiry session regarding Jinlang Technology Co., Ltd [1] - Jinlang Technology plans to issue convertible bonds to unspecified investors, with a total fundraising amount not exceeding RMB 167,658.38 million, including the principal [1] - The bonds will be issued at a face value of RMB 100 each, and the underwriting institution for this issuance is Guotai Junan Securities Co., Ltd [1]

中国经济网北京8月3日讯福能股份（600483）(600483.SH)8月1日晚间披露关于向不特定对象发行可转 换公司债券申请获得上海证券交易所上市审核委员会审核通过的公告。 福能股份本次可转债的发行对象为持有中国证券登记结算有限责任公司上海分公司证券账户的自然人、 法人、证券投资基金、符合法律规定的其他投资者等(国家法律、法规禁止者除外)。本次可转债每张面 值为100元人民币，按面值发行。 上海证券交易所上市审核委员会于2025年8月1日召开2025年第28次审议会议，对福能股份向不特定对象 发行可转换公司债券的申请进行了审议。根据会议审议结果，福能股份本次向不特定对象发行可转换公 司债券的申请符合发行条件、上市条件和信息披露要求。 福能股份表示，公司本次向不特定对象发行可转换公司债券事项尚需获得中国证券监督管理委员会(以 下简称证监会)作出同意注册的决定后方可实施。本次发行最终能否获得证监会同意注册的决定及其时 间尚存在不确定性。 根据福能股份于2025年2月28日披露的向不特定对象发行可转换公司债券募集说明书(申报稿)，该公司 本次向不特定对象发行可转债拟募集资金总额不超过人民币380,200.00万元 ...

格隆汇8月1日丨精研科技(300709.SZ)公布向不特定对象发行可转换公司债券预案，本次发行募集资金 总额不超过5.7789亿元(含本数)，扣除发行费用后，募集资金净额拟投资于新型消费电子与数据服务器 精密MIM零部件及组件生产项目，总部及研发中心建设项目，精密模具中心建设项目等。 ...

Core Viewpoint - The company, Shenglan Co., Ltd. (300843), has received approval from the China Securities Regulatory Commission to issue convertible bonds, aiming to raise up to 450 million yuan for the development of high-voltage connectors and components for new energy vehicles, as well as industrial control connectors [1] Company Summary - Shenglan Co., Ltd. specializes in the research, production, and sales of electronic connectors and precision components, particularly focusing on connectors for new energy vehicles [1] - In the first quarter of 2025, the company reported a total operating revenue of 337 million yuan and a net profit attributable to shareholders of 30.14 million yuan [1] Industry Summary - The high-voltage connector project is positioned within the upstream supply chain of the new energy vehicle industry, which is facing increasing market concentration, intensified competition, price pressures, and ongoing technological advancements that may affect future capacity absorption [1] - The competition in the industrial control connector sector is intensifying, with domestic manufacturers like Direction Electronics and Weifeng Electronics expanding their production scale in the industrial automation equipment sector, which may further squeeze market share for Shenglan's industrial control connector project [1]

Issuance Overview - The company plans to issue zero-coupon convertible bonds amounting to RMB 35.84 billion, maturing in 2030 [1][3] - The initial conversion price is set at HKD 30.25 per share, representing a 15.90% premium over the closing price of HKD 26.1 on July 28 [3] - The potential conversion shares amount to approximately 129.7 million H-shares, accounting for about 17.17% of existing H-shares and approximately 2.71% of total equity [3] Use of Proceeds - The net proceeds from the fundraising are approximately USD 494.3 million (equivalent to about RMB 35.43 billion) [3] - The funds will be utilized to enhance the company's research and development in computing power products [3] Bond Terms - The bonds will be redeemable at the issuer's option if the unredeemed principal is less than 10% of the initial total issuance [3] - Bondholders have the right to request redemption on August 5, 2028 [3] - The issuance is authorized by the general mandate granted at the 2025 shareholders' meeting, thus no further shareholder approval is required [3] - The bonds will be offered to no fewer than six independent subscribers [3] - The issuance has received approval from the National Development and Reform Commission for corporate foreign debt borrowing [3]

Group 1 - The company, ZTE Corporation, has entered into a subscription agreement to issue bonds amounting to RMB 3,584 million [1] - The bonds can be converted into H-shares at an initial conversion price of HKD 30.25 per share, which is subject to adjustment [1] - If fully converted at the initial price, the bonds will convert into approximately 129,726,464 H-shares, representing about 17.17% of the total H-share capital and 2.71% of the total issued share capital of the company as of the announcement date [1] Group 2 - The net proceeds from the bond issuance are intended to enhance the company's investment in computing power product research and development [1]