Core Points - Aoshikang Technology Co., Ltd. has completed its response to the Shenzhen Stock Exchange regarding the inquiry letter for issuing convertible bonds to unspecified objects [1][2] - The issuance of convertible bonds is subject to approval from the Shenzhen Stock Exchange and the China Securities Regulatory Commission, with uncertainties regarding the final implementation [1][2] Group 1 - Aoshikang received the inquiry letter from the Shenzhen Stock Exchange on October 27, 2025, regarding its application to issue convertible bonds [1] - The company has worked with relevant intermediaries to address the questions raised in the inquiry letter and has completed the response and updated the fundraising prospectus [1] - The updated response and fundraising documents have been disclosed on the official information platform [1] Group 2 - The issuance of convertible bonds requires the completion of the Shenzhen Stock Exchange's review process and approval from the China Securities Regulatory Commission [2] - There are uncertainties regarding the review and registration process, including the timing and the possibility of approval [2] - The company will fulfill its information disclosure obligations based on the progress of this matter [2]

Core Viewpoint - The company, Lite-On Optoelectronics (688150.SH), plans to issue convertible bonds to raise a total amount of no more than 766 million yuan, including issuance costs [1] Fund Utilization - The net proceeds from the fundraising, after deducting issuance costs, will be used for the construction of the production workshops 1, 3, and 4 at the Pucheng Lite-On Optoelectronics new materials R&D base [1] - Funds will also be allocated for the digital transformation upgrade of the Pucheng production workshops [1] - Additionally, the proceeds will support the research and development of perovskite materials and the establishment of an innovative platform for device verification [1] - A portion of the funds will be used to supplement working capital [1]

Core Viewpoint - The company, 莱特光电, plans to issue convertible bonds to raise a total amount of no more than 766 million yuan, including issuance costs [1] Fund Utilization - The net proceeds from the fundraising, after deducting issuance costs, will be used for the construction of the production workshops 1, 3, and 4 at the Pu Cheng 莱特光电 new materials R&D base [1] - Funds will also be allocated for the digital transformation upgrade project of the Pu Cheng production workshops [1] - Additionally, the funds will support the research and development of perovskite materials and the establishment of an innovative platform for device verification [1] - A portion of the funds will be used to supplement working capital [1]

格隆汇11月14日｜莱特光电公告，拟发行可转债募资不超过7.66亿元，募资金额用于蒲城莱特光电新材 料生产研发基地建设项目生产车间 1、生产车间 3 和生产车间 4 项目，蒲城莱特生产车间数智化升级改 造项目，钙钛矿材料研发及器件验证创新平台建设项目等。 ...

Core Viewpoint - The company plans to issue convertible bonds to raise funds for the development of an ASIC chip testing system, with a total fundraising amount not exceeding RMB 74,947.51 million [2][3]. Group 1: Convertible Bond Details - The company intends to issue up to 7,494,751 convertible bonds, each with a face value of RMB 100, and a maturity period of six years from the date of issuance [2]. - The initial conversion price will be determined based on the average trading price of the company's stock over the twenty trading days prior to the announcement of the prospectus, adjusted for any stock splits or dividends [2]. - The specific issuance method will be determined by the board of directors and authorized personnel in consultation with the lead underwriter [3]. Group 2: Fund Utilization - The net proceeds from the bond issuance will be allocated to the research and innovation project based on the self-developed ASIC chip testing system, with a total investment amount of RMB 75,888 million [4]. - The company will prioritize the allocation of convertible bonds to existing shareholders [4]. Group 3: Regulatory and Advisory Aspects - The company will engage a credit rating agency to provide a credit rating report for the bond issuance, and the bonds will not be guaranteed [4]. - The lead underwriter for this issuance is China International Capital Corporation, with designated representatives [4].

双乐股份本次拟向不特定对象发行可转债，预计募集资金8.00亿元。本次发行保荐机构为浙商证券 （601878）股份有限公司。 双乐股份（301036）向不特定对象发行可转债申请审核状态变更为提交注册。 ...

Group 1 - The stock price of Wankai New Materials (301216.SZ) fell by 3.82% to 18.62 yuan, currently in a state of breaking issue [1] - Wankai New Materials was listed on the Shenzhen Stock Exchange's Growth Enterprise Market on March 29, 2022, with an initial public offering (IPO) of 85.85 million shares at a price of 35.68 yuan per share [1] - The total amount raised from the IPO was 3.063 billion yuan, with a net amount of 2.915 billion yuan, exceeding the planned amount by 1.411 billion yuan [1] Group 2 - The company plans to use the raised funds for a 1.2 million tons food-grade PET polymer new materials project (Phase II), multifunctional green and environmentally friendly polymer new materials project, and to supplement working capital [1] - The total issuance costs for the IPO were 148 million yuan, including underwriting fees of 123 million yuan [1] - On May 31, 2023, Wankai New Materials announced a dividend plan of 3 yuan (pre-tax) per 10 shares and a bonus issue of 5 shares [1] Group 3 - On September 4, 2024, Wankai New Materials disclosed a plan to issue convertible bonds to raise up to 2.7 billion yuan, with the net proceeds intended for a 1.2 million tons MEG and 100,000 tons electronic-grade DMC new materials project (Phase I) and to supplement working capital [2] - The total amount raised from both fundraising activities is 5.763 billion yuan [2]

Core Viewpoint - Jinpan Technology (688676.SH) has received approval from the Shanghai Stock Exchange's Sci-Tech Innovation Board for its application to issue convertible bonds to unspecified investors, pending final approval from the China Securities Regulatory Commission (CSRC) [1][2]. Group 1: Convertible Bond Issuance - The total amount to be raised from the issuance of convertible bonds is not to exceed 1.6715 billion yuan, which will be allocated to various projects including intelligent manufacturing for data center power modules and high-efficiency energy-saving equipment [2][3]. - The convertible bonds will be issued at face value of 100 yuan each, with a term of six years from the date of issuance [4][5]. - The bonds will have an annual interest payment structure, with the principal and final year's interest paid upon maturity [5]. Group 2: Project Investment Allocation - The investment projects include: 1. Intelligent manufacturing for data center power modules and high-efficiency energy-saving equipment, with a total investment of approximately 523.42 million yuan, of which 473.37 million yuan will be funded by the bond issuance [3]. 2. High-efficiency liquid-immersed transformers and amorphous alloy core intelligent manufacturing projects, with a total investment of approximately 734.22 million yuan, of which 616.53 million yuan will be funded by the bond issuance [3]. 3. Construction of a research and development office building, with an investment of approximately 82.97 million yuan, funded entirely by the bond issuance [3]. 4. Supplementing working capital with 501.40 million yuan from the bond issuance [3]. Group 3: Regulatory and Market Considerations - The listing committee raised questions regarding the reasonableness of the production capacity planning for the digital factory project and potential risks related to capacity digestion, emphasizing the need for sufficient information disclosure [1].

Group 1 - The core point of the news is that Wankai New Materials (301216.SZ) is currently experiencing a decline in stock price, closing at 19.36 yuan with a drop of 4.58%, indicating a state of being below its initial public offering price [1] - Wankai New Materials was listed on the Shenzhen Stock Exchange's ChiNext on March 29, 2022, with an initial public offering of 85.85 million shares at a price of 35.68 yuan per share, raising a total of 3.063 billion yuan [1] - The company raised a net amount of 2.915 billion yuan after deducting issuance costs of 148 million yuan, which included underwriting fees of 123 million yuan [1] Group 2 - The company announced a dividend plan on May 31, 2023, proposing a distribution of 3 yuan per 10 shares (pre-tax) and a bonus issue of 5 shares, with the record date set for June 6, 2023 [1] - On September 4, 2024, Wankai New Materials disclosed a plan to issue convertible bonds to raise up to 2.7 billion yuan, with the net proceeds intended for a project to produce 1.2 million tons of MEG and 100,000 tons of electronic-grade DMC [2] - The total amount raised by Wankai New Materials from the two fundraising activities is calculated to be 5.763 billion yuan [3]

Group 1 - The stock of Wankai New Materials (301216.SZ) closed at 19.36 yuan, with a decline of 4.58%, currently in a state of breaking issue [1] - Wankai New Materials was listed on the Shenzhen Stock Exchange's Growth Enterprise Market on March 29, 2022, with an initial public offering (IPO) of 85.85 million shares at a price of 35.68 yuan per share [1] - The total amount raised from the IPO was 3.063 billion yuan, with a net amount of 2.915 billion yuan, exceeding the planned amount by 1.411 billion yuan [1] Group 2 - The company plans to use the raised funds for a 1.2 million tons per year food-grade PET polymer new materials project (Phase II), a multifunctional green and environmentally friendly polymer new materials project, and to supplement working capital [1] - The total issuance costs for the IPO were 148 million yuan, including underwriting fees of 123 million yuan [1] - On May 31, 2023, Wankai New Materials announced a dividend plan, distributing 3 yuan (pre-tax) for every 10 shares and a bonus issue of 5 shares [1] Group 3 - On September 4, 2024, Wankai New Materials disclosed a listing announcement for the issuance of convertible bonds to unspecified objects, with a total fundraising amount (including issuance costs) not exceeding 2.7 billion yuan [2] - The net amount raised from the convertible bond issuance will be used for a 1.2 million tons per year MEG and 100,000 tons of electronic-grade DMC new materials project (Phase I) and to supplement working capital [2] - The total amount raised from both fundraising activities is calculated to be 5.763 billion yuan [2]