Core Viewpoint - Chengdu Shuchuang Huanyu Technology Co., Ltd. has been established with a registered capital of 10 million RMB, fully owned by Beijing Fifth City Technology Co., Ltd. [1] Company Summary - The legal representative of Chengdu Shuchuang Huanyu Technology Co., Ltd. is Zou Siguai [1] - The company is registered in the China (Sichuan) Pilot Free Trade Zone, specifically in Chengdu High-tech Zone [1] - The business scope includes various services such as cultural relic sales, telecommunications, broadcasting, internet services, software development, and artificial intelligence services [1] Shareholder Information - Beijing Fifth City Technology Co., Ltd. holds 100% of the shares in Chengdu Shuchuang Huanyu Technology Co., Ltd. [1] Business Operations - The company is involved in multiple sectors including information transmission, software, and information technology services, with a focus on software development [1] - The operational period is set until May 15, 2025, with no fixed term thereafter [1]

Company Overview - Zhongtian Chengbao (Shenzhen) Technology Co., Ltd. has been established with a registered capital of 5 million RMB [1] - The legal representative of the company is Li Weishao, and it is wholly owned by Guangdong Chengbao Information Service Co., Ltd. [1] Shareholder Information - Guangdong Chengbao Information Service Co., Ltd. holds 100% of the shares in Zhongtian Chengbao [2] Business Scope - The company's business scope includes a wide range of services such as transportation equipment leasing, fire technology services, sales of intelligent unmanned aerial vehicles, and various electronic and communication products [2] - Additional services include data processing and storage support, satellite technology integration, 5G communication technology services, and industrial internet data services [2]

Group 1 - The article discusses the characteristics of 5G communication technology, emphasizing the need for high-frequency electromagnetic waves to meet the increasing data transmission demands due to the development of information technology [4][5][6]. - It highlights the relationship between signal transmission loss and dielectric properties, indicating that higher communication frequencies require materials with lower dielectric constants and loss factors [7][8]. - The article outlines the requirements for circuit substrates in high-frequency communication, including low dielectric constant, high thermal conductivity, solvent resistance, and dimensional stability [10][11]. Group 2 - The preparation and performance study of fluorinated thermosetting polyphenylene ether (PPO) is presented, focusing on the effects of physical and chemical modifications on dielectric properties [12][14]. - The article details the curing behavior of PPO-Allyl-F, noting that the conversion rate of double bonds increases with curing time, indicating a first-order reaction [17][18]. - It compares the dielectric performance of various modified PPOs, showing that the dielectric constant and loss vary with the type of modification, with PPO-vinyl exhibiting lower values due to its cross-linked structure [38][39]. Group 3 - The article discusses the preparation and performance of hydrocarbon-based thermosetting polyphenylene ether, emphasizing the impact of different side groups on thermal and dielectric properties [25][26]. - It presents the curing characteristics of hydrocarbon-based PPOs, noting that the conversion rates of carbon-carbon double bonds vary significantly based on curing conditions [30][31]. - The dielectric performance of hydrocarbon-modified PPOs is analyzed, revealing that the introduction of hydrocarbon chains can slightly reduce the dielectric constant while affecting the dielectric loss [37][38]. Group 4 - The article explores the application of modified boron nitride/thermosetting polyphenylene ether composites in circuit boards, highlighting their thermal and mechanical properties [58][59]. - It details the effects of filler content on the thermal conductivity and dielectric properties of the composites, indicating that higher boron nitride content can enhance thermal performance while affecting dielectric characteristics [62][66]. - The study compares the mechanical performance of different composite formulations, noting that excessive filler can lead to reduced mechanical strength due to poor polymer-filler interaction [63][72].

Group 1 - A new company, Yiyang Hexi District Hanmo Technology Co., Ltd., has been established with a registered capital of 2 million RMB [1] - The company is wholly owned by Yiyang Yutong E-commerce Co., Ltd., which holds 100% of the shares [1] - The legal representative of the company is Guo Jiawei [1] Group 2 - The business scope of the company includes technology intermediary services, IoT technology research and development, and various manufacturing services related to smart devices and robotics [1] - The company is classified under the manufacturing industry, specifically in the sector of computer, communication, and other electronic device manufacturing [1] - The registered address of the company is located in Ping'an Lane, Taijia Section, Hexi District, Yiyang City, Hunan Province [1]

Company Overview - Tianjin Gongmei Technology Development Co., Ltd. has been established with a registered capital of 45.219 million yuan [1] - The legal representative of the company is Li Xingfang [1] Business Scope - The company is involved in the production of Class II and Class III medical devices, which require approval from relevant authorities before operations can commence [1] - General business activities include manufacturing of various electronic and communication devices, software development, and technology services [1] - The company also engages in the manufacturing and sales of batteries, photovoltaic equipment, and components, as well as the recycling and utilization of used power batteries from new energy vehicles [1] Ownership Structure - The company is wholly owned by Zhuoyue Technology [1]

经营范围含技术服务、技术开发、技术咨询、技术交流、技术转让、技术推广；数据处理和存储支持服 务；工程管理服务；交通安全、管制专用设备制造；航空运输设备销售；运输设备租赁服务；紧急救援 服务；以自有资金从事投资活动；环境保护监测；生态资源监测；智能无人飞行器制造；智能无人飞行 器销售；会议及展览服务；航空商务服务；体育赛事策划；科普宣传服务；园区管理服务；5G通信技 术服务；电子产品销售；物联网技术研发；人工智能行业应用系统集成服务；软件开发；信息系统集成 服务；工程技术服务（规划管理、勘察、设计、监理除外）；企业管理咨询；信息技术咨询服务；公共 安全管理咨询服务；气象信息服务；卫星通信服务；信息系统运行维护服务；航空运营支持服务；计算 机软硬件及辅助设备批发；网络与信息安全软件开发。（除依法须经批准的项目外，凭营业执照依法自 主开展经营活动） 企业名称北斗星航（深圳）低空产业控股有限公司法定代表人刘晓方注册资本1000万人民币国标行业交 通运输、仓储和邮政业>航空运输业>航空客货运输地址深圳市罗湖区笋岗街道田心社区梨园路与梅园 路交汇处东北侧深业泰富广场B座608企业类型有限责任公司（法人独资）营业期限202 ...

序号股东名称持股比例1安徽舜时通科技有限公司51%2李洋洋22%3王玉洁22%4枣庄市舜时通科技产品 有限公司5% 天眼查App显示，近日，舜时通（江苏）科技有限公司成立，法定代表人为王玉洁，注册资本1000万人 民币，安徽舜时通科技有限公司、枣庄市舜时通科技产品有限公司持股。 企业名称舜时通（江苏）科技有限公司法定代表人王玉洁注册资本1000万人民币国标行业信息传输、软 件和信息技术服务业>软件和信息技术服务业>软件开发地址江苏省苏州市相城区望亭镇望亭大街16号 207室企业类型有限责任公司(自然人投资或控股)营业期限2025-4-27至无固定期限登记机关苏州市相城 区数据局 来源：金融界 经营范围含许可项目：第一类增值电信业务；第二类增值电信业务（依法须经批准的项目，经相关部门 批准后方可开展经营活动，具体经营项目以审批结果为准）技术服务、技术开发、技术咨询、技术交 流、技术转让、技术推广；软件开发；软件销售；网络与信息安全软件开发；人工智能应用软件开发； 软件外包服务；信息系统集成服务；信息系统运行维护服务；计算机系统服务；通讯设备销售；通信交 换设备专业修理；运行效能评估服务；电子产品销售；文化用品设 ...

转自：前瞻产业研究院 智能焊接爬行机器人产业链结构分析 智能焊接爬行机器人产业链上游主要为关键零部件与原材料，包括控制系统、爬行机构、焊接跟踪系统等; 中游为系统集成，中游企业负责将上游的零部件集成到机器人本体中，从而建设焊接爬行机器人产线;下游 为应用领域，包括钢结构行业、船舶行业等。 本文核心数据：中国智能焊接爬行机器人市场规模;中国智能焊接爬行机器人市场占比;企业市占率等 智能焊接爬行机器人概述 智能焊接爬行机器人是一种结合了智能化控制技术与焊接技术的自动化设备，主要用于复杂工件或特殊环境 下的焊接任务。智能焊接爬行机器人核心组成部分一般包括爬行机构、控制系统、传感系统与焊接系统。 中国智能焊接爬行机器人市场现状 ——中国智能焊接机器人市场现状 根据全球知名调研机构Verified Market Reports公布的数据，2022-2024年全球智能焊接机器人市场规模逐年 增长，2024年全球智能焊接机器人市场规模约15.13亿美元。根据国际机器人联合会披露的信息，中国工业 机器人市场约占据全球市场的52%左右，根据此比例与全球智能焊接机器人市场规模进行测算，2022-2024 年中国智能焊接机器人市场 ...

科创板风险提示 本次发行股票拟在科创板上市，科创板公司具有研发投入大、经营风险 高、业绩不稳定、退市风险高等特点,投资者面临较大的市场风险。投资者应 充分了解科创板的投资风险及本公司所披露的风险因素，审慎作出投资决定。 广州慧智微电子股份有限公司 Smarter Microelectronics （Guangzhou）Co., Ltd. 广州市高新技术产业开发区科学城科学大道 182 号创新大厦 C2 第三层 307 单元 首次公开发行股票并在科创板上市 招股说明书 保荐人（主承销商） （深圳市前海深港合作区南山街道桂湾五路128号前海深港基金小镇B7栋401） guoun 广州慧智微电子股份有限公司 招股说明书 声 明 中国证监会、交易所对本次发行所作的任何决定或意见，均不表明其对发行 人注册申请文件及所披露信息的真实性、准确性、完整性作出保证，也不表明其 对发行人的盈利能力、投资价值或者对投资者的收益作出实质性判断或保证。任 何与之相反的声明均属虚假不实陈述。 根据《证券法》规定，股票依法发行后，发行人经营与收益的变化，由发行 人自行负责；投资者自主判断发行人的投资价值，自主作出投资决策，自行承担 股票依 ...

科创板风险提示 本次股票发行后拟在科创板市场上市，该市场具有较高的投资风险。科 创板公司具有研发投入大、经营风险高、业绩不稳定、退市风险高等特点， 投资者面临较大的市场风险。投资者应充分了解科创板市场的投资风险及本 公司所披露的风险因素，审慎作出投资决定。 广州慧智微电子股份有限公司 Smarter Microelectronics （Guangzhou）Co., Ltd. 广州市高新技术产业开发区科学城科学大道 182 号创新大厦 C2 第三层 307 单元 首次公开发行股票并在科创板上市 招股说明书 （注册稿） 保荐机构（主承销商） （深圳市前海深港合作区南山街道桂湾五路128号前海深港基金小镇B7栋401） 广州慧智微电子股份有限公司 招股说明书（注册稿） 声明：本公司的发行申请尚需经上海证券交易所和中国证监会履行相应程序。本招股说明书 不具有据以发行股票的法律效力，仅供预先披露之用。投资者应当以正式公告的招股说明书作为 投资决定的依据。 声 明 发行人及全体董事、监事、高级管理人员承诺招股说明书及其他信息披露资 料不存在虚假记载、误导性陈述或重大遗漏，并对其真实性、准确性、完整性承 担个别和连带的法律 ...