公众号记得加星标⭐️，第一时间看推送不会错过。 来源：内容 编译自 semiengineering 。 光学技术在长距离通信方面已经非常成熟，但其服务的距离正在缩短——尤其是在数据中心。 垂直腔面发射激光器 (VCSEL) 已经能够驱动短光纤链路。但人们正在努力进一步缩小其尺寸，以便 通过波导提供比光纤更多的连接。 Amkor Technology封装开发高级总监 Suresh Jayaraman 表示："我们已经见证了从长途网络到城域 网、局域网，再到数据中心的转变。光纤已经从卡的边缘转移到板载，最近又转移到了封装上。" 目前，许多研究正在进行中，旨在将光纤更靠近数据中心的服务器。目前，该技术通常用于机架间通 信，而大多数机架内线缆仍采用铜线。用光纤取代铜线仍然是一个发展机遇。 将激光器与硅集成 尤其令人感兴趣的是光纤将如何连接到处理器。标准可插拔格式可能会被线性可插拔光学器件 (LPO) 和共封装光学器件 (CPO) 所取代。但这些器件仍在开发中。 在如何集成光通信方面，激光器的三个主要特性是可靠性、温度敏感性和能耗。可靠性一直是首要考 虑因素，尽管它已经有所改进，但开发人员仍然担心激光器焊接到电路板上时 ...

Core Insights - The article discusses the growing importance of integrated semiconductor optical modules, specifically On-Board Optical (OBO), Near-Package Optical (NPO), and Co-Packaged Optical (CPO) solutions, which are expected to see a compound annual growth rate of 50% in shipment volume by 2033 [2][4]. Group 1: Market Trends - Integrated optical solutions are significantly improving transmission capacity and processing for AI systems, providing higher bandwidth at lower power consumption [2][4]. - The transition from copper to optical solutions is anticipated to lead to a non-linear performance enhancement, with potential performance increases of up to 80 times compared to existing solutions [7]. Group 2: Key Players and Future Projections - Major companies like NVIDIA, Intel, Marvell, and Broadcom are currently leading the development of CPO technology, which is expected to drive substantial revenue growth and shipment volume by 2027 [4]. - By 2033, it is projected that over half of the revenue and shipment volume will come from integrated semiconductor optical I/O solutions [4].

Core Viewpoint - A multidisciplinary academic team has successfully integrated quantum light sources and electronic devices into a single silicon chip, marking a significant advancement in quantum technology [3][4]. Group 1: Technological Breakthrough - The researchers developed the first chip that integrates electronic, photonic, and quantum components, utilizing standard 45-nanometer semiconductor manufacturing processes [3][4]. - This integrated technology enables the chip to produce a continuous stream of correlated photon pairs, which are fundamental for many quantum applications [4]. Group 2: Future Implications - The breakthrough signifies an important step towards the mass production of "quantum light factory" chips and the development of more complex quantum systems composed of multiple interconnected chips [4]. - The research indicates that quantum computing, communication, and sensing could transition from concept to reality over the next few decades [4]. Group 3: System Design and Stability - The chip features a system that actively stabilizes the quantum light sources, specifically the silicon micro-ring resonators, which are sensitive to temperature and manufacturing variations [6][7]. - Each chip contains 12 parallel-operating quantum light sources, with integrated photodiodes to monitor and maintain the alignment of the incident laser [7]. Group 4: Collaborative Efforts - The project required interdisciplinary collaboration among fields such as electronics, photonics, and quantum measurement, essential for transitioning quantum systems from the lab to scalable platforms [4][8]. - The chip is manufactured using a commercial 45-nanometer complementary metal-oxide-semiconductor (CMOS) platform, developed in collaboration with various institutions and companies [7][8]. Group 5: Industry Impact - The advancements in silicon photonics and quantum technology are expected to serve as a foundation for technologies ranging from secure communication networks to advanced sensing and ultimately quantum computing infrastructure [8]. - Several researchers involved in the project have moved into the industry, reflecting the growing momentum of silicon photonics and its potential in expanding AI computing infrastructure and scalable quantum systems [8].

Core Viewpoint - The Taiwanese semiconductor industry is making significant strides in Singapore, with a new 22nm foundry set to open in April 2025, expected to create 700 jobs and produce 30,000 wafers monthly, primarily for mobile display and IoT chips [2][3]. Group 1: Economic Contribution - The semiconductor sector's contribution to Singapore's GDP has increased from 2.8% in 2014 to 5.6% in 2022, with output rising from SGD 48.9 billion to SGD 156.7 billion [3][9]. - Singapore produces 10% of the world's chips, highlighting its critical role in the global semiconductor landscape [3][9]. Group 2: Talent Attraction and Development - Taiwanese semiconductor companies are attracting both Taiwanese and local talent, with initiatives to collaborate with local educational institutions to enhance industry knowledge [4][5]. - Engineers from Taiwan share positive experiences about Singapore's multicultural environment and the rapid work pace, indicating successful adaptation over time [3][4]. Group 3: Regional Expansion and Investment - Taiwanese semiconductor firms are expanding into Southeast Asia to mitigate tariff issues, with Singapore planning to invest approximately SGD 1 billion in a new semiconductor R&D center [5][9]. - Other Southeast Asian countries are also investing in their semiconductor capabilities, with Malaysia committing at least USD 5.3 billion over the next decade [5]. Group 4: Technological Advancements and Future Outlook - The rise of AI is driving demand for advanced semiconductor technologies, with Singapore's companies exploring opportunities in data centers, electric vehicles, IoT, and 5G [8][21]. - The global semiconductor market is projected to reach USD 1.06 trillion by 2030, with a CAGR of 7%, driven primarily by automotive, computing, and wireless communication sectors [20][21]. Group 5: Challenges and Competitive Landscape - The geopolitical tensions between the US and China have intensified competition in the semiconductor sector, with companies diversifying production to manage risks [9][22]. - Singapore's semiconductor industry, while currently dominated by multinational corporations, is encouraged to foster local startups and innovation to remain competitive [15][19].

Core Viewpoint - TSMC partners with startup Avicena to produce MicroLED-based interconnect products, aiming to replace electrical connections with optical ones to meet the increasing communication demands between GPUs in AI data centers [1][4]. Group 1: Technology Overview - The collaboration focuses on using optical connections to address unprecedented demands for data volume, bandwidth, latency, and speed in AI clusters due to large language models [1]. - Avicena's LightBundle platform utilizes hundreds of blue MicroLEDs connected through imaging-type optical fibers to transmit data, avoiding the complexities associated with lasers [1][4]. - The technology allows for a simple optical fiber link that can transmit data at 10 Gb/s over distances exceeding 10 meters, achieving net transmission rates of up to 3 Tb/s [4]. Group 2: Industry Context - The optical interconnect technology is positioned as a solution to the challenges faced by laser-based optical interconnects, which struggle with reliability, manufacturing, and cost issues [3][4]. - Avicena's approach leverages existing technologies in LEDs, cameras, and displays, which are already mature industries, allowing for quicker adjustments in production methods [6][7]. - TSMC's involvement in producing optical detector arrays for Avicena highlights the potential for lower costs and higher efficiency compared to traditional laser-based systems [7]. Group 3: Competitive Advantage - Avicena claims that their technology can achieve energy consumption as low as sub-picojoules per bit, outperforming other optical methods that find it difficult to reach 5 picojoules per bit [7]. - The simplicity of the LightBundle design, requiring only minor modifications to existing camera and display technologies, positions it favorably against more complex silicon photonics solutions [6][7].

Core Viewpoint - The article discusses Nvidia's announcement of a co-packaged optics (CPO) switch aimed at significantly reducing power consumption in AI data centers, marking a potential breakthrough in optical networking technology [1][5][18]. Group 1: Technology Overview - The CPO switch integrates optical and electronic components to enhance bandwidth and reduce power consumption by minimizing the distance electronic signals must travel [2][4]. - Nvidia's CPO technology claims to reduce power consumption by 70%, from 30W per 1.6T pluggable transceiver to just 9W per CPO port [5][17]. - The CPO switch is designed to handle data rates of 1.6 Tb/s, utilizing micro-ring modulators (MRM) for improved power efficiency [13][17]. Group 2: Market Implications - The introduction of CPO technology is seen as a significant advancement that could lead to a reduction in the number of lasers required in AI data centers by 75%, thus saving substantial energy [18][19]. - Nvidia's CPO switch is expected to enhance the reliability of data transmission by 63% and improve the ability to withstand network interruptions by 10 times [18]. - The company plans to launch two types of switches, Spectrum-X and Quantum-X, with Quantum-X expected to be available later this year [19]. Group 3: Competitive Landscape - Other companies, such as Broadcom, are also developing CPO switches, but Nvidia's approach with micro-ring modulators differs fundamentally from Broadcom's use of Mach-Zehnder modulators [20][24]. - Micas Networks has announced a 51.2T product based on Broadcom's CPO platform, which offers a 50% reduction in power consumption [22][23]. - The competition in the CPO market is intensifying, with various companies exploring different optical technologies to meet the growing demands of data centers [20][22]. Group 4: Future Developments - Nvidia is actively researching new optical technologies to enhance the scalability of its networking solutions, with plans for future integration of optical interconnects into GPUs [28][29]. - The company is collaborating with multiple partners, including TSMC and Coherent, to optimize the technology for AI data center needs [19][14]. - The ongoing development of CPO technology is expected to lead to further innovations in optical networking, potentially transforming data center architectures [26][28].