【长江电子】Feynman问世在即，LPU芯片开启PCB又一增长极 英伟达计划在GTC 2026大会上推出Feynman架构芯片，该产品的发布节奏较市场预期有所提前。 这一架构的核心技术突破在于采用3D堆叠方式，将专为推理任务优化的LPU芯片直接集成在GPU计算核心之上， 从而实现通用计算与专用计算在物理层面的深度融合。 新架构LPU芯片主要用于推理，以高多层方案为主，单芯片PCB价值量有望达到300-500美金，核心供应商建议关 注#胜宏科技、沪电股份、深南电路、景旺电子。 #坚定看好高确定性CoWoP技术+正交背板方案 CoWoP方案有望提前至27年底小批量、28年大批量，PCB单平米价值量或提升数倍至十倍，该方向下推荐关注 正交背板当前仍在正常稳步推进中，3月初计划进行新一轮样品测试，该方案预计在27年H2步入批量生产阶段，该 方向下看好低估值龙头公司，性价比凸显，推荐关注 英伟达计划在GTC 2026大会上推出Feynman架构芯片，该产品的发布节奏较市场预期有所提前。 这一架构的核心技术突破在于采用3D堆叠方式，将专为推理任务优化的LPU芯片直接集成在GPU计算核心之上， 从而实现通用计算与专用计算 ...

Summary of Conference Call on PCB Industry Industry Overview - The conference call discusses the PCB (Printed Circuit Board) industry, highlighting the significant demand driven by advancements in AI and data centers, particularly due to NVIDIA's investment in OpenAI of 100 billion RMB, indicating a robust demand for GPU and ASIC chips, which in turn boosts PCB demand [1][2]. Key Insights and Arguments - **NVIDIA's Product Evolution**: NVIDIA's transition from the eight-card architecture to the GB200/GB300 series and now to the Ruby series has led to significant enhancements in PCB specifications, including increased layers and density, which raises the value of single-chip PCBs [1]. - **Market Demand Projections**: The global PCB market demand is expected to exceed 90 billion RMB by 2026, but supply-side capacity remains tight due to the heavy asset nature of the industry and long production cycles, with overseas production lagging behind expectations [1][8]. - **Supply-Demand Dynamics**: The PCB industry is anticipated to experience a relative shortage of capacity in the coming years, as companies like Huadian Technology and Shenghong Technology are accelerating expansion, but at a pace slower than the explosive demand growth [1][9]. - **Investment Potential**: Companies such as Huadian Technology, Shenghong Technology, and Pengding possess significant investment potential due to their client progress and capacity expansion. Additionally, upstream material suppliers like Shengyi Technology are gaining traction within the NVIDIA and Amazon supply chains, indicating strong future growth [1][10]. Additional Important Points - **Role of PCBs in Data Centers**: PCBs play a crucial role in data centers for carrying and transmitting signals, with specifications improving significantly with each chip iteration. The shift towards PCBs over traditional copper cables is driven by better heat dissipation and lower maintenance costs [3]. - **Specific Requirements of NVIDIA's Series**: The Ruby series introduces an orthogonal backplane solution, replacing some copper cable connections, which enhances assembly efficiency and significantly increases the value of single-chip PCBs to approximately 150,000 to 200,000 RMB [6]. - **Material Upgrades**: The PCB market's growth is also tied to advancements in upstream materials, particularly in copper-clad laminates (CCL) and copper foil, with companies like Shengyi Technology adapting production lines to meet demand surges [11][12]. - **Future Supply-Demand Structure**: The supply-demand structure in the PCB industry is expected to remain tight due to rapid demand growth and the heavy asset nature of the industry, which prolongs new factory setups and customer validation cycles [13]. - **NVIDIA's Orthogonal Backplane Progress**: The orthogonal backplane solution from NVIDIA is still in the validation phase, with expectations of adoption, indicating a potential upward valuation for the PCB segment [14].