周四，阿里巴巴(BABA.US)盘前涨近4%，现报175.20美元。消息面上，据报道，阿里巴巴正准备将推 动其芯片制造部门平头哥半导体上市，此举得益于投资者对这一领域内少数几家试图与英伟达竞争的企 业的浓厚兴趣。据知情人士透露，作为第一步，阿里巴巴计划将该部门改组为部分由员工持股的商业实 体。随后，该公司将考虑进行首次公开募股(IPO)，但具体时间尚不明确。据悉目前仍处于这一过程的 初期阶段，尚不清楚平头哥半导体能获得多少估值。 ...

智通财经APP获悉，周四，阿里巴巴(BABA.US)盘前涨近4%，现报175.20美元。消息面上，据报道，阿 里巴巴正准备将推动其芯片制造部门平头哥半导体上市，此举得益于投资者对这一领域内少数几家试图 与英伟达竞争的企业的浓厚兴趣。据知情人士透露，作为第一步，阿里巴巴计划将该部门改组为部分由 员工持股的商业实体。随后，该公司将考虑进行首次公开募股(IPO)，但具体时间尚不明确。据悉目前 仍处于这一过程的初期阶段，尚不清楚平头哥半导体能获得多少估值。 ...

红星资本局1月22日消息，阿里巴巴美股（BABA.US）盘前突然走高，一度涨超5%。 消息面上，有报道称，阿里巴巴已决定支持旗下芯片公司平头哥未来独立上市，具体时间尚不明确。对此，红星资本局向阿里巴巴方面求证，截至发稿，暂 未获得回复。 图片来自老虎App 公开信息显示，平头哥全称为平头哥（上海）半导体技术有限公司，是阿里巴巴在半导体领域的重要布局主体。 平头哥成立于2018年，由阿里收购的中天微系统有限公司与达摩院芯片团队整合而成。公开信息显示，平头哥的业务覆盖端云一体全栈产品系列，涵盖数据 中心芯片、IoT芯片等，实现芯片端到端设计链路全覆盖。 红星新闻记者 强亚铣 编辑 余冬梅 审核 高升祥 | | 11 | | I | | --- | --- | --- | --- | | 100 19 10 10 10 1 | 0 | 10 | | ...

北京时间1月22日，阿里巴巴美股夜盘突然走高，一度涨超5%。 | 阿里巴巴 ( | | | --- | --- | | BABA.N | | | 万得 １６８.６７０ 量１７１万 股本 190亿 市盈" 22.81 | | | 营口 +6.280 +3.87% 换 0.49% 市值4027亿 市净" 2.74 | | | 盘前 177.33 8.66 5.13% 05:30 美东 \ | | | 港股 164.800 1.600 0.98% | 溢价(H/US) 0.24% | | 盘前・ 五日 日Ｋ 月Ｋ 月Ｋ 更多 ◎ | | | 膏加 均价:55卖1 177.330 107 | | | 1177-830 "" 5.43% 买1 177.290 98 | | | 15:59 168.650 200 | | | 15:59 168.650 1600 | | | 168.670 0.00% | 15:59 168.650 200 | | 15:59 168.650 1600 | | | 15:59 168.650 200 | | | 15:59 168.650 200 | | | 159.510 -5.43% ...

| 阿里巴巴 < ロ | | --- | | BABA.N | | 168.670 量 1171.4万 股本 190.99亿 市盈 10 22.8 万得 | | 盘口 6.280 3.87% 换 0.49% 市值 4027亿 市净 2.74 | | 盘前 177.480 +8.810 +5.22% 美东 05:12 √ | | 溢价(H/US) +0.23% 港股 164.800 +1.600 +0.98% | | ■ ▼ 五日 日K 周K 月K 更多 ◎ | | 量加 均价:176.961 | | 1 // Mich 5.43% 卖一 177.530 40 | | 买一 177.420 1158 | | 400 15:59 168.650 | | 15:59 168.650 200 | | 168.670 0.00% 15:59 168.650 800 | | 15:59 168.650 200 | | 15:59 168.650 1600 | | 15:59 168.650 200 | | 15:59 168.650 1600 | | 15:59 168.650 200 159.510 -5.43% | ...

| 阿里巴罗 く 白 | | | --- | --- | | BABA.N | | | １６８６７０ 量１７１万 股本 190亿 市盈" 22.81 | 万得 | | +6.280 +3.87% 换 0.49% 市值 4027亿 市净 2.74 | 참□ | | 盘前 177.33 8.66 5.13% | 05:30 美东 √ | | 港股 164.800 1.600 0.98% | 溢价(H/US) 0.24% | | 盘前・ 五日 日Ｋ 月Ｋ 月Ｋ 更多 ◎ | | | 叠加 1177880 " | 均价：55卖1 177.330 107. | | 5.43% | 买1 177.290 98 15:59 168.650 200 | | 15:59 168.650 1600 | | | 168.670 | 15:59 168.650 200 0.00% | | 15:59 168.650 1600 | | | 15:59 168.650 200 | | | 15:59 168.650 200 | | | 159.510 | 15:59 168.650 200 -5.43% | | 04:00 | 09:3 ...

Core Viewpoint - Howie Group has submitted an application for H-share listing on the Hong Kong Stock Exchange, aiming to enhance its market presence and capitalize on growth opportunities in the semiconductor industry [1]. Group 1: Company Overview - Howie Group, formerly known as Shanghai Weir Semiconductor Co., Ltd., was renamed to align with its strategic planning and business operations [2]. - The company is the third-largest digital image sensor supplier globally, with a market share of 10.5% in the smartphone CMOS image sensor (CIS) sector for 2024 [1]. - Howie Group is the largest automotive CIS supplier, holding a significant market share of 32.9% in 2024 [1]. Group 2: Financial Performance - In 2024, Howie Group reported revenue of approximately 25.707 billion RMB, representing a year-on-year growth of 22.51% [1]. - The company's gross profit reached about 7.239 billion RMB, with a substantial increase of 73.04% compared to the previous year [1]. - Net profit for 2024 was approximately 3.279 billion RMB, showing an impressive growth of 502.75% year-on-year [1]. Group 3: Business Segments - Howie Group operates in three main product lines: image sensor solutions, display solutions, and analog solutions [1]. - The company has been increasing its R&D investment and actively expanding its market presence, contributing to its strong financial performance [1].