Core Viewpoint - The article discusses the advancements and investments in EUV lithography technology, highlighting the significant role of the United States in this field, particularly through collaborations and new facilities aimed at enhancing semiconductor manufacturing capabilities [1][3][5]. Group 1: US Investments in EUV Technology - The US has launched the CHIPS for America EUV accelerator, establishing a $10 billion partnership with major semiconductor companies to create a next-generation semiconductor research center in Albany, New York [3][5]. - New York State has invested $1 billion to expand the Albany NanoTech Complex, which will include a High NA EUV center, marking it as the first public High NA EUV center in North America [5][6]. - The EUV accelerator will focus on developing advanced High NA EUV technology, which is crucial for producing chips with 7nm and smaller transistors [5][6]. Group 2: Collaboration and Research Environment - The EUV accelerator aims to provide collaborative space and resources for industry, academia, and government partners to drive technological innovation [6][7]. - The facility is expected to enhance the US's technological leadership and support the semiconductor workforce ecosystem [7][8]. Group 3: Alternative Technologies to EUV - US companies are exploring alternative technologies to EUV lithography, such as xLight's particle accelerator-driven free electron lasers (FEL), which aim to produce light more efficiently than current methods [8][9]. - Inversion Semiconductor is developing a "desktop" particle accelerator to generate high-power light, potentially reducing the size of traditional accelerators significantly [11][12]. - Lace Lithography AS from Norway is working on atomic lithography technology that could surpass the resolution limits of EUV, potentially offering lower costs and energy consumption [15][16]. Group 4: Global Efforts in EUV Alternatives - Japanese researchers at KEK are investigating the use of particle accelerators to improve the efficiency and cost-effectiveness of EUV lithography systems [16][18]. - The article emphasizes that while current EUV technology is advancing, there are ongoing efforts globally to explore and develop alternative methods that could redefine semiconductor manufacturing [19].

Core Viewpoint - The article emphasizes the significance of EUV lithography in advanced chip manufacturing, highlighting ASML as the sole supplier of EUV lithography machines and discussing the increasing investments and developments in the US semiconductor industry to enhance its capabilities in this area [1][4][6]. Group 1: US Investments in EUV Technology - The US has announced a $10 billion partnership to establish a next-generation semiconductor research center in Albany, New York, focusing on High NA EUV technology [4][6]. - New York State has invested $1 billion to expand the Albany NanoTech Complex, which includes the purchase of ASML's EXE:5200 high-NA EUV scanner [6]. - The EUV accelerator aims to support the development of advanced semiconductor technologies and enhance the US's technological leadership [7][8]. Group 2: Alternative Technologies to EUV - US companies are exploring alternative technologies to EUV lithography, such as xLight's particle accelerator-driven free electron lasers (FEL) that could potentially replace current EUV light sources [9][10]. - Inversion Semiconductor is developing a compact particle accelerator to produce high-power light, aiming to significantly reduce the size and cost of traditional particle accelerators [12][13][14]. - European and Japanese entities are also investigating new opportunities in lithography, with companies like Lace Lithography AS and KEK researching atomic lithography and free electron lasers, respectively, to enhance chip manufacturing capabilities [15][16][19]. Group 3: Future of Lithography Technology - The article suggests that while EUV technology is currently critical for producing chips with smaller transistors, ongoing research into alternative methods may lead to breakthroughs that could further enhance semiconductor manufacturing [21][22]. - The continuous improvement in chip performance is expected, but the path forward may depend on the evolution of EUV technology or the adoption of new techniques [22].

如果您希望可以时常见面，欢迎标星收藏哦~ 来源：内容 编译自 wccftech ，谢谢 。 在半导体新元素的采用方面，台积电多年来一直是先驱，并经常引领潮流。但现在，该公司似乎将 放弃在其 A14 工艺中使用高数值孔径 EUV 光刻设备，而是采用更传统的 0.33 数值孔径 EUV 技 术。这一消息是在数值孔径技术研讨会上透露的，台积电高级副总裁Kevin Zhang在会上宣布了这 一进展。由此可以肯定地说，英特尔代工厂和几家 DRAM 制造商现在在"技术"上比台积电更具优 势。 Kevin 表示，台积电将不会使用High NA EUV光刻技术来对A14芯片进行图案化，该芯片的生产 计划于2028年开始。从2纳米到A14，我们不必使用High NA，但我们可以在处理步骤方面继续保 持类似的复杂性。他指出，每一代技术，我们都尽量减少掩模数量的增加。这对于提供经济高效的 解决方案至关重要。 台积电认为高数值孔径 (NA) 对 A14 工艺无关紧要的主要原因是，使用相关的光刻工具，这家台 湾巨头的成本可能会比传统的 EUV 方法高出 2.5 倍，这最终将使 A14 节点的生产成本大大提 高，这意味着其在消费产品中的 ...