Core Viewpoint - TSMC is advancing its 2nm technology with the installation of equipment at its second factory in Kaohsiung, aiming for trial production by the end of the year, while the first factory has already reached mass production [4][5][6]. Group 1: TSMC's 2nm Technology Development - TSMC's second 2nm factory (P2) has begun equipment installation, with expectations to join trial production within 3-4 months [5][6]. - The first factory (P1) has achieved a monthly production capacity of 10,000 wafers, with a combined target of 35,000 wafers per month for both factories this year [4][5]. - TSMC's 2nm process utilizes nanosheet architecture, reportedly achieving a trial yield of 65%, surpassing competitors like Intel and Samsung [7][8]. Group 2: Market Dynamics and Competitors - TSMC's growth is driven by increasing demand from AI-related customers, with expectations to generate $2.5 trillion in terminal product value globally within five years [7][8]. - Competitors such as Intel and Samsung are also making strides in 2nm technology, with Intel focusing on customer commitments for its 14A process [9][10]. - Tesla has signed a $16.5 billion contract with Samsung for its next-generation AI chip, indicating a competitive landscape where TSMC was initially considered for the contract [9][10]. Group 3: Emerging Players and Industry Trends - Japanese chip manufacturer Rapidus has successfully trial-produced 2nm chips and plans to enter mass production by 2027, potentially disrupting the market dominance of TSMC and Samsung [11][12]. - Rapidus's advancements are attributed to its collaboration with IBM, which has provided essential technology and patents for 2nm chip production [11][12]. - The semiconductor industry is witnessing a shift towards self-sufficiency, with Chinese companies like SMIC making significant progress in their own technology development [12][14]. Group 4: TSMC's Future Growth Potential - TSMC's market capitalization is currently around $1.25 trillion, with projections suggesting it could reach $3 trillion, driven by its innovative technologies and strong customer base [15][16]. - The upcoming N2 chip node is expected to significantly improve energy efficiency, with a reduction in power consumption by 25% to 30% compared to 3nm chips [16][17]. - Management anticipates a compound annual growth rate of nearly 20% over the next five years, which could lead to substantial revenue growth and stock price appreciation [17].

公众号记得加星标⭐️，第一时间看推送不会错过。 来源：内容综合自快科技等 。 作为当前全球最先进的芯片生产企业，台积电成为半导体竞争的核心，原本台积电计划把尖端工艺留 在本土生产，但是这两年形势变化很大，被当作杀手锏的2nm及1.6nm工艺也要转向美国生产。 随着全球半导体格局转变，原本无意在美国建厂的台积电在2020年首次宣布赴美生产，在美国亚利桑 那州建设了第一座晶圆厂，工艺水平在4nm级别，目前已经投产，AMD等多家客户表态要使用美国 工厂生产。 相比本土生产，台积电美国工厂的成本会更高，AMD CEO苏姿丰最近提到成本会高出5%到20%左 右。 台积电营收恐无法再创高 美国对等关税冲击景气，消费应用下半年转趋保守，PC、智慧机等终端产品年底耶诞旺季买气恐不 如预期，相关半导体需求同步转淡，台积电相关应用接单也跟着转弱。法人忧心，台积电虽有AI等高 速运算（HPC）订单支撑，第4季美元与新台币营收都恐从第3季历史高点下滑，无法再创单季新高。 对于法人预估的数据，台积电一贯不评论，至昨（3）日截稿前也无进一步评论。法人指出，若台积 电今年第4季营运较第3季衰退，将是近十年首度出现第4季旺季表现不如第3季的 ...

Core Insights - TSMC is expected to dominate the high-end chip manufacturing market in the U.S., posing challenges for Intel and SMIC [2][3] - TSMC's expansion plans include significant investments in the U.S. and Taiwan, with a focus on advanced manufacturing processes [4][9] Global Capacity Layout - TSMC's wafer fabrication capacity will remain primarily in Taiwan, but additional capacity in the U.S. and Europe will provide a buffer against disruptions in Taiwan [3] - TSMC plans to build 11 new fabs and 4 packaging plants in Taiwan, potentially requiring more investment than the $165 billion planned for U.S. facilities [9] U.S. Expansion Plans - TSMC has committed to investing $165 billion in six chip fabs, two advanced packaging plants, and a research center in Phoenix, Arizona [4] - The first Arizona fab is already operational, while the second fab focusing on 3nm technology is completed and expected to ramp up production [6] Advanced Process Developments - TSMC anticipates that 2nm technology will see higher initial tape-out numbers compared to 3nm and 5nm, driven by demand from smartphones and high-performance computing (HPC) applications [11] - The A16 process is set to begin mass production in the second half of 2026, offering significant improvements in transistor density and energy efficiency [11] Financial Performance - TSMC reported record revenue of $30.07 billion for Q2, a 44.4% year-over-year increase, with net profit reaching $12.8 billion [14] - The company has a substantial cash reserve of $90.36 billion, supporting its ambitious capital expenditure plans in the U.S. and Taiwan [14] AI Chip Revenue Contribution - TSMC's HPC devices generated approximately $18 billion in sales, a 66.6% increase year-over-year, indicating a shift in revenue drivers from smartphones to AI-related products [16][19] - AI chip manufacturing and packaging contributed $8.78 billion in revenue, suggesting that AI could soon account for half of TSMC's total sales [19]

Core Viewpoint - TSMC's chairman highlighted strong demand for AI chips despite some impact from US tariffs, with the company maintaining a market cap above $1 trillion [1][3]. Group 1: Company Performance and Market Position - TSMC's stock price increased by approximately 1% following the shareholder meeting, recovering from earlier declines this year [1]. - The company is the leading advanced semiconductor manufacturer globally, serving major clients like Apple, AMD, and NVIDIA [1]. - TSMC's capital expenditure is projected to exceed $40 billion this year, reflecting a long-term focus on AI-driven chip manufacturing demand [3]. Group 2: Impact of Tariffs and Pricing - Although tariffs have had some effect, TSMC has not observed significant changes in customer behavior due to tariff uncertainties [1][2]. - The tariffs may lead to a slight increase in wafer prices, potentially affecting demand [2]. - The cost of TSMC's 2nm process has surged to $30,000 per wafer, indicating rising foundry prices driven by substantial R&D investments [4]. Group 3: Technological Advancements - TSMC is set to launch its 2nm process, with AMD's next-generation Zen 6 processor being the first to utilize this technology [2]. - The company announced plans for the next-generation A14 chip manufacturing technology, expected to be operational by 2028 [3]. Group 4: Competitive Landscape - TSMC remains the only reliable supplier for its advanced N2 manufacturing process, holding significant pricing power in the market [4]. - Major clients like NVIDIA are exploring alternatives to TSMC's N2 process from other foundries, indicating competitive pressures [4]. - Intel is actively expanding its foundry business, aiming to surpass TSMC in manufacturing the fastest chips [5].

Group 1: Core Insights - TSMC's recent conference highlighted the rapid expansion of the semiconductor industry, projecting a market size of $1 trillion by 2030, driven primarily by high-performance computing (HPC) and artificial intelligence (AI) applications [2][4] - By 2030, HPC/AI is expected to dominate the semiconductor market, accounting for 45%, while smartphones will represent 25%, automotive electronics 15%, IoT 10%, and other sectors 5% [4][6] - The demand for semiconductors is accelerating due to AI-driven applications, including AI accelerators in data centers, AI PCs, AI smartphones, and long-term applications like robotic taxis and humanoid robots [4][6] Group 2: Advanced Process Technologies - TSMC's N3 series (3nm process) includes N3, N3E, and upcoming versions like N3P, which will enhance performance by 5% while reducing power consumption by 5% to 10% [7][9] - The N2 process (2nm) is expected to achieve a 10%-15% speed improvement or a 20%-30% power reduction compared to previous technologies, with transistor density increasing by 15% [12][18] - A16 technology, set for production in 2026, will utilize a super power rail architecture to improve logic density and efficiency, achieving an 8%-10% performance boost and a 15%-20% power reduction compared to N2P [19][20] Group 3: Advanced Packaging and System Integration Innovations - TSMC introduced the 3DFabric platform, which includes 2.5D and 3D integration technologies to overcome traditional design limitations and support high-density memory integration [24][30] - The CoWoS technology supports high-density interconnects and has been successfully applied in advanced products like Tesla's Dojo supercomputer [28][33] - Future applications, such as augmented reality glasses and humanoid robots, will require advanced packaging technologies to integrate numerous high-performance chips efficiently [37][40]

如果您希望可以时常见面，欢迎标星收藏哦~ 来源：内容 编译自 wccftech ，谢谢 。 在半导体新元素的采用方面，台积电多年来一直是先驱，并经常引领潮流。但现在，该公司似乎将 放弃在其 A14 工艺中使用高数值孔径 EUV 光刻设备，而是采用更传统的 0.33 数值孔径 EUV 技 术。这一消息是在数值孔径技术研讨会上透露的，台积电高级副总裁Kevin Zhang在会上宣布了这 一进展。由此可以肯定地说，英特尔代工厂和几家 DRAM 制造商现在在"技术"上比台积电更具优 势。 Kevin 表示，台积电将不会使用High NA EUV光刻技术来对A14芯片进行图案化，该芯片的生产 计划于2028年开始。从2纳米到A14，我们不必使用High NA，但我们可以在处理步骤方面继续保 持类似的复杂性。他指出，每一代技术，我们都尽量减少掩模数量的增加。这对于提供经济高效的 解决方案至关重要。 台积电认为高数值孔径 (NA) 对 A14 工艺无关紧要的主要原因是，使用相关的光刻工具，这家台 湾巨头的成本可能会比传统的 EUV 方法高出 2.5 倍，这最终将使 A14 节点的生产成本大大提 高，这意味着其在消费产品中的 ...

Investment Rating - The report maintains a "Recommended" rating for the new materials industry [1]. Core Insights - The new materials sector is identified as a crucial direction for the chemical industry, currently experiencing rapid growth in downstream demand. With policy support and technological breakthroughs, domestic new materials are expected to enter a phase of accelerated growth. The report emphasizes that "one generation of materials leads to one generation of industries," highlighting the foundational role of the new materials industry in supporting other sectors [1]. Summary by Sections 1) Electronic Information Sector - Focus areas include semiconductor materials, display materials, and 5G materials [4]. - As of April 22, 2025, TSMC announced plans to start producing A14 chips by 2028, aiming to maintain its leadership in the semiconductor industry. This technology will surpass the current 3nm process and the upcoming 2nm process, with the A16 process expected to launch by the end of 2026 [5][32]. 2) Aerospace Sector - Key materials of interest are PI films, precision ceramics, and carbon fibers [7]. 3) New Energy Sector - Focus areas include photovoltaics, lithium-ion batteries, proton exchange membranes, and hydrogen storage materials [9]. 4) Biotechnology Sector - Key areas of interest are synthetic biology and scientific services [10]. 5) Energy Conservation and Environmental Protection Sector - Focus areas include adsorption resins, membrane materials, and biodegradable plastics [12]. Investment Strategy - The new materials sector is expected to benefit from the catalytic effects of downstream application sectors, gradually entering a prosperous cycle. The report maintains a "Recommended" rating for the new materials industry [13]. Key Companies and Earnings Forecast - The report lists several key companies with their respective earnings per share (EPS) and price-to-earnings (PE) ratios, indicating a positive outlook for many of them [14].

Group 1 - TSMC's advanced A14 chip technology is set to begin production in 2028 [1]

Group 1 - TSMC has established its first overseas advanced factory in Arizona, which began production at the end of last year, employing approximately 3,000 workers [1] - TSMC is currently installing cleanroom facilities for its second, more advanced factory in Arizona, set to begin trial production next year, with a third factory planned to start construction this year [1] - The construction of TSMC's first factory in the U.S. took nearly five years due to labor shortages, rising material costs, and cultural challenges, but the company expects future factories to be built closer to its typical "Taiwan speed" of about two years [1] Group 2 - TSMC plans to produce 3nm chips at its second Arizona factory by 2028 and aims to produce 2nm and more advanced chips at the third factory by the end of this century [1] - In Taiwan, TSMC engineers and suppliers are rapidly expanding the capacity of multiple 2nm advanced process factories, expected to begin production this year in Hsinchu and Kaohsiung [1] - TSMC is also expanding its 3nm factory in Tainan and developing next-generation A14 and A10 chips near its headquarters in Hsinchu, marking the entry into the angstrom-level semiconductor era [2]