Core Viewpoint - The company is actively monitoring and engaging with advanced packaging technology trends, particularly HBF, and is developing materials that can be applied in HBF manufacturing processes [1] Group 1: Company Developments - The company has stable mass production capabilities for functional wet electronic chemicals, solder balls, and EMC epoxy encapsulants, which are applicable in HBF manufacturing processes [1] - The company is currently in the verification and introduction phase for temporary bonding materials, LMC liquid encapsulation materials, and GMC particle encapsulation materials that are compatible with HBF process conditions [1] - The company is collaborating closely with relevant manufacturers to develop and test related materials, aiming to enhance the maturity and reliability of the HBF process [1] Group 2: Future Outlook - The company plans to leverage its existing collaboration foundation to continuously iterate and innovate its material technologies [1] - The goal is to establish a solid technical advantage and enhance market influence in advanced packaging fields such as HBF [1]

Core Viewpoint - Feikai Materials (300398) is actively involved in the semiconductor advanced packaging sector, focusing on the production of functional wet electronic chemicals, solder balls, and EMC epoxy encapsulants, which are applicable in HBF and HBM manufacturing processes [1] Group 1: Product Development - The company has achieved stable mass production of functional wet electronic chemicals, solder balls, and EMC epoxy encapsulants for HBF and HBM manufacturing processes [1] - The packaging processes for HBF and HBM involve wafer thinning, stacking, and encapsulation, for which the company has developed temporary bonding materials, LMC liquid encapsulation materials, and GMC particle encapsulation materials [1] - Currently, these materials are in the verification and introduction stage and have not yet generated scaled revenue [1] Group 2: Collaboration and Innovation - The company is closely collaborating with relevant manufacturers to develop and test related materials, aiming to enhance the maturity and reliability of HBF and HBM process technologies [1] - Future efforts will continue to focus on customer cutting-edge demands, driving the iteration and innovation of material technologies [1]