Workflow
半导体封测
icon
Search documents
揭秘涨停丨先进封装龙头股封单资金超19亿元
(原标题:揭秘涨停丨先进封装龙头股封单资金超19亿元) 今日(10月9日)A股市场收盘共100股涨停,剔除掉11只ST板块个股后89股涨停,40股封板未遂,整体封板率为71.43%。 涨停战场: 通富微电封单资金超19亿元 据证券时报·数据宝统计,从收盘涨停板封单量来看,山子高科封单量最高,有79.53万手;其次是上海电气、通富微电、浙富控股,涨停板封单量 分别为61.88万手、44.47万手、38.37万手。 从连续涨停天数来看,天际股份4连板,山子高科、*ST东易、冠中生态3连板,江西铜业、深科技、河钢资源等5股2连板。 以封单金额计算,29股封单资金均超1亿元,通富微电、上海电气、北方稀土封单资金居前,分别为19.65亿元、6.42亿元、6.09亿元。 通富微电具有先进封装概念,公司在投资者调研活动中表示,公司在多个先进封装技术领域积极开展国内外专利布局。截至2025年6月30日,集团 累计专利申请量突破1700件,其中发明专利占比近70%;同时,公司先后从富士通、卡西欧、AMD获得技术许可,使公司快速切入高端封测领 域,为公司进一步向高阶封测迈进,奠定坚实的技术基础。 龙头点睛: 黄金概念多股涨停 1 ...
全都在扩产先进封装
半导体行业观察· 2025-10-04 02:14
公众号记得加星标⭐️,第一时间看推送不会错过。 在摩尔定律趋缓、AI/HPC需求爆发的背景下,先进封装已成为晶圆代工厂与封测企业的必争之 地。全球范围内,从台积电到三星,从日月光到安靠,以及国内的长电科技、通富微电、华天科 技,几乎所有龙头厂商都在加快扩产,力争抢占这一未来数年最关键的产业高地。 据 Coherent Market Insights (CMI) 数 据 , 全 球 先 进 芯 片 封 装 市 场 规 模 预 计 将 从 2025 年 的 503.8 亿美元增长至 2032 年的 798.5 亿美元,复合年增长率达 6.8%。这一趋势背后,是 AI 大模型、自动驾驶、云计算与边缘计算对高性能、低功耗封装解决方案的迫切需求。 台积电:全力冲刺, 3DFabric架构统合前后端 在台积电的版图中,先进封装地位正快速上升。据伯恩斯坦预测,随着 CoWoS 需求井喷,台积电 2024 年先进封装营收占比有望突破 10%,首次超越日月光,跃升为全球最大封装供应商。 在 9 月的 TSMC OIP 生态论坛上,台积电强调 3DFabric平台的战略意义:通过晶圆级工艺 + 3D 堆 叠 (SoIC) + 先 ...
日月光高雄新厂动土
Jing Ji Ri Bao· 2025-10-03 23:24
Group 1 - The core viewpoint of the articles highlights the increasing demand for AI-driven advanced packaging and testing in the semiconductor industry, with significant investments being made to meet this demand [1][2] - The global packaging leader, ASE Technology Holding Co., is investing NT$17.6 billion (approximately US$576 million) in a new facility in Kaohsiung, expected to be completed in Q1 2028, creating nearly 2,000 job opportunities [1] - ASE's revenue forecast for advanced packaging and testing is projected to increase from US$600 million in 2024 to US$1.6 billion (approximately NT$48.63 billion) by 2028, with advanced packaging accounting for about 75% of this revenue [1] Group 2 - According to Yole Group's latest report, the advanced packaging market is expected to reach approximately US$46 billion in 2024, growing at a rate of 19% annually, and is projected to reach US$79.4 billion by 2030 [2] - The demand for advanced packaging technologies such as fan-out architectures, System-in-Package (SiP), Flip Chip Ball Grid Array (FC-BGA), and advanced substrates is increasing due to the influence of AI and High-Performance Computing (HPC) [2]
研报掘金丨华鑫证券:维持通富微电“买入”评级,AMD各业务营业额实现迅猛增长
Ge Long Hui A P P· 2025-09-28 02:46
Core Viewpoint - Tongfu Microelectronics achieved a net profit attributable to shareholders of 412 million yuan in the first half of 2025, representing a year-on-year increase of 27.72% [1] - The company reported a net profit of 311 million yuan in Q2, marking a year-on-year growth of 38.60% and a quarter-on-quarter increase of 206.45% [1] Group 1 - The rapid growth in the company's performance is primarily due to seizing domestic opportunities and increasing market share in various application fields such as mobile phones, home appliances, and automotive [1] - The collaboration with key clients, particularly AMD, has continued to show growth momentum, benefiting from strong market demand and significant revenue increases across AMD's business segments [1] - The company's diversified layout is expected to capture favorable market opportunities by deepening cooperation in high-growth sectors like AI and automotive electronics, while actively expanding domestic substitution demand [1] Group 2 - The company is well-positioned to benefit from the rapid growth of AMD's performance, the increasing demand in AI and other fields, and the broader trend of domestic substitution [1] - The leading packaging and testing technology and good progress in cutting-edge research are expected to support the company's growth trajectory [1] - The investment rating is maintained at "Buy" based on the company's strong fundamentals and growth prospects [1]
1H’25中国大陆龙头封测代工厂营收同比涨幅超10%
CINNO Research· 2025-09-26 07:40
主题: 1H'25 中国大陆龙头封测代工厂营收同比涨幅超 10% 概要: 内容包含 1H'25 全球 TOP 10 OSAT 营收排名及区域占比,中国大陆 TOP3 封测代 工厂的主要财务指标情况及国内主要 OSAT 的营收毛利率状况。 大纲: 1. 1H'25 全球 TOP10 OSAT 营收排名 2. 全球 TOP 10 OSAT 营收区域占比 3. 中国大陆 TOP3 OSAT 季度毛利率 4. 中国大陆 TOP3 OSAT 季度库存周转天数 5. 中国大陆 TOP3 OSAT 季度资本开支 6. 长电科技营收及毛利率 7. 通富微电营收及毛利率 8. 华天科技营收及毛利率 9. 晶方科技营收及毛利率 10. 汇成科技营收及毛利率 11. 甬矽电子营收及毛利率 温馨提示: * 请 会 员 单 位 通 过 会 员 登 陆 平 台 下 载 或 邮 件 接 收 此 份 报 告 。 * 如 需 了 解 更 多 相 关 信 息 , 请 订 阅 C I N N O Re s e a r c h 《 季 度 全 球 显 示 面 板 产 业 分 析 报 告 》 。 期数: 2025 年 9 月刊 分类: 会员服务 — ...
华天科技收购华羿微电,能否真的实现“1+1>2”?
势银芯链· 2025-09-26 06:02
"宁波膜智信息科技有限公司"为势银(TrendBank)唯一工商注册实体及收款账户 重要会议: 11 月 17-19 日,2025势银异质异构集成年会(浙江·宁波) 点此报名 11月19日-21日,2025势银显示技术与供应链产业年会(四川·成都) 点此报名 添加文末微信,加 异质异构集成产业 群 近日 , 华天科技发布公告称正在筹划发行股份及支付现金购买资产并募集配套资金暨关联交易事项 。本次交易预计不构成重大资产重组,不 构成重组上市,但构成关联交易。 本次交易的标的公司为 华羿微电子股份有限公司 (以下简称华羿微电),为华天科技控股股东天水华天电子集团股份有限公司的控股子公司。 截至公告日,华天科技已与本次交易的主要交易对方签署了《股权收购意向协议》。 | 企业名称 | 华梁微电子股份有限公司 | | --- | --- | | 注册地址 | 西安经济技术开发区草滩生态产业园尚稷路8928号 | | 企业类型 | 其他股份有限公司(非上市) | | 注册资本 | 41.509.5832万元人民币 | | 统一社会信用代码 | 91610132MA6U621506 | | 法定代表人 | 肖智成 | | ...
中国产业叙事:通富微电
新财富· 2025-09-25 08:55
20世纪90年代,石明达临危受命担任南通市晶体管厂厂长。 面对南通市十五家特困企业之一的绝境,他毅然决然地将重心转向刚兴起的集成电路领域,进而四处奔走筹措资金,于1994年成功建成一条年封装超千 万块的集成电路生产线。 正如石明达当初所言:"毛主席教导我们要自力更生。别人靠不住,力量的支点要放在自己身上"。 2024年,通富微电凭借超238亿元营收和稳居全球前四的委外封测市场份额,进而成为中国重塑全球半导体市场竞争格局的关键节点——从1990年濒临 破产的南通晶体管厂,再到如今屹立于全球半导体封测行业市场前列的跨国企业,通富微电用三十余年时间,成功走出一条极具中国特色的生存发展之 路。 0 1 通富微电的奠基时代 20世纪90年代,中国国企正在经历改革开放的阵痛期——面对这个"特困企业",石明达展现了超越时代的视野和生存的决心,进而深刻意识到,在传统 的晶体管领域已无出路,企业唯一的生机就在于向技术含量更高的集成电路产业进行转型。 如今回望,这一决策在当时无疑极具风险——集成电路产业技术门槛高、投资规模巨大,进而对于一家营收匮乏的地方国企而言,无异于一场豪赌。彼 时,石明达凭借其深厚的半导体专业背景和对产业趋 ...
帮主郑重:5.15亿抢筹通富微电!龙虎榜揭示主力三大布局方向
Sou Hu Cai Jing· 2025-09-24 17:13
老铁们,我是帮主郑重,二十年财经老记者,专攻中长线投资。今天龙虎榜数据一出来,真是暗流汹涌——通富微电被5.15亿资金疯抢,机构却悄悄狂买汇 成股份!市场表面波澜不惊,主力资金却已兵分三路,悄悄布下棋局。 今日最大看点在于机构与北向资金的博弈: · 机构偏爱"小而美":汇成股份获机构净买入1.52亿元,该公司聚焦显示驱动芯片封测,受益于面板行业复苏; 一、半导体封测龙头成"香饽饽",硬逻辑支撑抢筹潮 通富微电今日龙虎榜净买入高达5.15亿元,背后是实打实的产业逻辑。公司上半年净利润增长27.72%,大客户AMD的数据中心业务需求爆发,Zen 5架构处 理器销量同比激增67%。更关键的是,其大尺寸FCBGA封装已进入量产,CPO光电合封技术突破可靠性测试——这些高端工艺正是AI算力芯片的核心需 求。涪陵广场路游资重仓2.5亿元,深股通同步加仓,说明资金看中的是国产替代+技术壁垒的双重护城河。 二、机构与北向现分歧:汇成股份获埋伏,北方华创遭甩卖 一句话总结:龙虎榜是观察资金的窗口,但中长线赢家永远属于那些"拿得住硬核资产、躲得开概念陷阱"的人。我是帮主郑重,咱们稳扎稳打,赚看得懂的 钱! (数据来源:沪深交易所 ...
国星光电:公司已实现氮化镓与碳化硅封测能力
Zheng Quan Ri Bao· 2025-09-22 09:41
Group 1 - The company, Guoxing Optoelectronics, announced on September 22 that it has achieved packaging and testing capabilities for Gallium Nitride (GaN) and Silicon Carbide (SiC) [2] - The company has secured industrialization orders for delivery, indicating a successful transition to commercial operations [2] - Guoxing Optoelectronics is now fully capable of accepting customized product orders from clients, showcasing its flexibility in meeting market demands [2]
帮主郑重:长电科技存储业务暴增150%!三筛铁律挖出封测龙头的黄金买点
Sou Hu Cai Jing· 2025-09-21 02:15
Core Insights - Longji Technology's storage business revenue surged over 150% year-on-year in the first half of the year, significantly outperforming the industry average, raising questions about the sustainability of this growth [1] Group 1: Market Trends - The storage chip supercycle has begun, driven by three main factors: 1. Explosive demand for AI servers leading to a surge in high bandwidth memory (HBM) demand, with a projected market growth rate of 80% by 2025 [3] 2. Acceleration of domestic substitution as local chip leaders like Yangtze Memory and Changxin Memory ramp up production, with domestic orders for Longji Technology reaching 40% in the first half of 2025 [3] 3. Technological upgrades from DDR4 to DDR5, increasing packaging prices by over 30%, and advancements in 3D NAND stacking from 128 layers to over 200 layers [3] Group 2: Fundamental Analysis - Longji Technology has three strengths and three weaknesses: - Strengths: 1. Strong technical barriers, being one of only three global companies capable of HBM packaging [4] 2. Deep customer relationships with major clients like Apple, Qualcomm, and domestic leaders [4] 3. Leading capacity layout with a monthly production capacity of 82,000 chips and an industry-leading yield rate of 99.5% [4] - Weaknesses: 1. A 24% year-on-year decline in net profit for the first half of 2025 due to increased financial costs from the acquisition of a semiconductor company [5] 2. Operating cash flow decreased by 22.7% year-on-year, indicating pressure from significant expansion investments [5] 3. High valuation with a dynamic PE of 35.3 times for 2025, above the industry average of 28 times [5] Group 3: Valuation Assessment - Short-term valuation is under pressure with a projected PE of 35.3 times for 2025 and 29.0 times for 2026, while long-term valuation could be reasonable if storage business growth continues, potentially lowering PE to 24.3 times by 2027 [6] - If the storage business share increases from the current "mid-teens" to over 30%, the valuation could shift from "packaging factory" to "high-end manufacturing," targeting a PE of 40 times [6] Group 4: Investment Strategy - Ideal buying point is at or below 35 yuan, with current price at 38.73 yuan being slightly high [7] - Position management suggests limiting single stock positions to 8% and total positions in the packaging sector to 15% [7] - Key indicators for monitoring include monthly capacity utilization rates and HBM packaging yield rates [7]