博敏电子面向AI时代建设的首座高端PCB工厂"创芯智造园"今日投产。智通财经记者现场获悉，该园区 总投资30亿元，规划产能360万平方米/年。目前，创芯智造园的第一座专业化智造工厂，即聚焦于AI服 务器、网络通信、汽车电子三大领域的高速及高可靠性PCB产品的M4工厂开始投产，具备52层、厚径 比30:1的通孔能力和7阶HDI能力，高阶产品产出能力36万平方米/年。（智通财经记者 陆婷婷） 博敏电子创芯智造园今投产 M4工厂高阶产品年产能达36万平方米 ...

本公司董事会及全体董事保证本公告内容不存在任何虚假记载、误导性陈述或者重大遗漏，并对其内容 的真实性、准确性和完整性承担法律责任。 重要内容提示： ● 本次会议是否有否决议案：无 一、会议召开和出席情况 (一)股东大会召开的时间：2025年5月23日 (二)股东大会召开的地点：广东省梅州市经济开发试验区东升工业园B区公司一楼会议室 (三)出席会议的普通股股东和恢复表决权的优先股股东及其持有股份情况： ■ 二、议案审议情况 表决情况： (四)表决方式是否符合《公司法》及《公司章程》的规定，大会主持情况等。 本次股东大会由公司董事会召集，董事长徐缓先生主持，会议以现场投票与网络投票相结合的方式进行 表决，会议的召集、召开和表决方式符合《公司法》《公司章程》等有关规定。 (五)公司董事、监事和董事会秘书的出席情况 1、公司在任董事6人，出席6人； 2、公司在任监事3人，出席3人； 3、董事会秘书黄晓丹女士出席本次股东大会；除副总经理王强先生请假外，公司其他高级管理人员列 席本次股东大会。 (一)非累积投票议案 1、议案名称：关于公司《2024年年度报告及摘要》的议案 审议结果：通过 ■ 2、议案名称：关于公司《20 ...

Group 1: Company Overview - The main business of the company is the research, development, production, and sales of printed circuit boards (PCBs) [6] - As of March 31, 2025, the number of shareholders is 27,571 [5] Group 2: Financial Performance - In 2024, the company achieved an operating income of RMB 1.559 billion, a year-on-year decrease of 3.70% [3] - The net profit attributable to shareholders was RMB 11.384 million, a significant decline of 88.91% year-on-year [3] - The net cash flow from operating activities was RMB 156 million [3] Group 3: Market Challenges - The decline in foreign sales revenue was influenced by market conditions in Europe and the United States, leading to a decrease in export business [3] - The company faced pressure from rising raw material prices and intensified industry competition, resulting in a decrease in gross margin [7] - New product lines are still in the capacity ramp-up phase, contributing to losses in related business areas [7] Group 4: Strategic Focus - In 2025, the company will focus on high-precision, high-density, and high-reliability PCB technologies, including advanced packaging and thermal management [3] - The company aims to enhance its manufacturing capabilities for high-tech, high-value-added products to strategically upgrade its product structure [3] Group 5: Share Buyback Plan - The company announced a share buyback plan on May 14, 2025, intending to repurchase shares using between RMB 15 million and RMB 25 million of its own or raised funds [2]

Group 1: PCB Business Overview - The company's PCB business focuses on communication equipment, particularly in data centers and automotive electronics, with a slight recovery in wireless communication orders compared to Q4 2024 [1] - The demand for wired communication orders remains strong, with a higher proportion than wireless communication [1] - The data center sector continues to see growth in orders, driven by the demand for AI acceleration cards and servers [1] Group 2: Packaging Substrate Business - The packaging substrate products cover a wide range, including module packaging substrates and storage packaging substrates, primarily used in mobile smart terminals and servers [2] - There has been a noticeable improvement in demand for packaging substrates in Q1 2025 compared to Q4 2024, mainly due to increased demand for storage products [2] Group 3: Production Capacity and Utilization - The overall production capacity utilization remains high, particularly in the PCB business due to sustained demand in computing power and automotive electronics [3] - The packaging substrate business has also seen an increase in capacity utilization due to improved demand in the storage sector compared to Q4 2024 [3] Group 4: FC-BGA Packaging Substrate Technology - The company has achieved batch production capability for FC-BGA packaging substrates with 20 layers or fewer, while R&D for products with more than 20 layers is progressing on schedule [4] - The Guangzhou packaging substrate project is in the early stages of ramping up production, with a reduction in losses in Q1 2025 compared to previous quarters [4] Group 5: Expansion Plans - The company has PCB factories in Shenzhen, Wuxi, Nantong, and a factory under construction in Thailand, focusing on technological upgrades to enhance capacity [5] - The Nantong Phase IV project is underway to establish an HDI technology platform and capacity [5] Group 6: Thailand Factory Investment - The total investment for the Thailand factory is 1.274 billion RMB, with construction progressing on schedule [6] - The factory will have capabilities for high-layer and HDI PCB technologies, aiding in the expansion of overseas markets [6] Group 7: Raw Material Price Changes - Key raw materials include copper-clad laminates and gold salts, with prices increasing year-on-year and compared to Q4 2024 due to commodity price fluctuations [7][8] - The company is monitoring international commodity prices and maintaining communication with suppliers and customers [8]

Group 1: Business Overview - The company focuses on PCB business applications primarily in communication equipment, with a significant emphasis on data centers and automotive electronics [1] - In Q1 2025, the wireless communication orders slightly rebounded compared to Q4 2024, while the demand for wired communication remains strong [1] - The data center orders continued to grow, driven by the demand for AI accelerator cards and servers [1] Group 2: Packaging Substrate Business - The company offers a wide range of packaging substrate products, including module packaging substrates and storage packaging substrates, mainly used in mobile smart terminals and servers [2] - In Q1 2025, the demand for packaging substrates improved compared to Q4 2024, primarily due to increased demand for storage products [2] Group 3: Production Capacity and Utilization - The overall production capacity utilization remains high, with PCB business benefiting from sustained demand in computing and automotive electronics [3] - The packaging substrate business has seen an increase in capacity utilization due to improved demand in the storage sector compared to Q4 2024 [3] Group 4: U.S. Sales and Tariff Impact - Direct sales to the U.S. accounted for a low percentage of total revenue, indicating minimal impact from U.S. tariff policies [4] - The company is closely monitoring the evolving international trade environment and maintaining communication with industry stakeholders [4] Group 5: FC-BGA Packaging Substrate Development - The company has achieved mass production capability for FC-BGA packaging substrates with up to 20 layers, while R&D for products with more than 20 layers is progressing on schedule [5] - The Guangzhou packaging substrate project is in the early stages of ramping up production, with a reduction in losses observed in Q1 2025 compared to previous quarters [5] Group 6: Expansion Plans - The company has factories in Shenzhen, Wuxi, Nantong, and a project under construction in Thailand, focusing on upgrading existing facilities to enhance capacity [6] - The total investment in the Thailand factory is approximately 1.274 billion RMB, aimed at expanding overseas market reach and improving global supply capabilities [7][8] Group 7: Raw Material Price Trends - In Q1 2025, prices for certain raw materials, such as gold salt, increased compared to both Q1 2024 and Q4 2024, influenced by commodity price fluctuations [8] - The company is actively monitoring raw material price changes and maintaining communication with suppliers and customers [8] Group 8: AI and PCB Business - The demand for high-performance PCBs is increasing due to the rapid evolution of AI technology and the need for high-speed networks [8] - The company's PCB business has benefited from trends in high-speed communication networks and data center applications since 2024 [8]

Group 1 - The company held its 2024 annual and Q1 2025 performance briefing on May 9, 2025, via an online interactive format [2] - Key executives, including the chairman and financial director, participated in the briefing to address investor inquiries [2] Group 2 - The company reported a revenue of 1,293,004,000.87 yuan for 2024, a year-on-year increase of 19.45%, and a net profit of 141,498,579.04 yuan, up 6.45% from the previous year [4] - For Q1 2025, the company achieved a revenue of 338,048,302.63 yuan, representing a 23.17% increase year-on-year, with a net profit of 36,618,662.83 yuan, up 17.25% [5] Group 3 - The company plans to invest 135 million yuan in a project to upgrade "high-density interconnect substrate" production technology, with trial production expected in Q1 2026 [5] - The company aims to enhance its competitiveness in traditional sectors while expanding into emerging fields such as electric vehicles and AI computing centers [3][4]

Group 1: Financial Performance - In 2024, the company's operating revenue increased by 11.75% year-on-year, primarily driven by growth in the HDI segment and the introduction of global renowned terminal customers [1] - The net profit attributable to shareholders for 2024 was -87,433,652.40 CNY, indicating a reduction in losses compared to previous periods [2] - The company achieved profitability in Q4 2024 and Q1 2025, marking two consecutive quarters of profit [3] Group 2: Product Development and Market Position - The main products, including high-layer PCB, mid-to-high-end HDI, and flexible circuits (FPC), showed stable growth in 2024 [1] - The company is actively developing new technologies and products in AI, high-speed storage, high-frequency communication, smart driving, low-altitude flying vehicles, and robotics [1] - The company has enhanced its product structure by focusing on high-layer boards and high-end HDI boards, with an increasing proportion of products with 8 layers or more [7] Group 3: Capacity and Operational Efficiency - The new factory in Zhuhai is gradually increasing its capacity utilization, with expectations for steady growth in output [2] - The company is implementing strategies to optimize asset structure and cost control, which have improved operational quality and profitability [3] - The company plans to enhance manufacturing and operational efficiency, focusing on high-end products and emerging markets [8] Group 4: Strategic Initiatives and Market Expansion - The company is seeking advantageous mergers and acquisitions to enhance product structure, technology, and expand the value chain [2] - The company has established offices or subsidiaries in Taiwan, Hong Kong, Singapore, and Thailand to expand overseas marketing channels [4] - The company anticipates that the global PCB market will exceed $100 billion by 2027, driven by smart upgrades and emerging applications [6] Group 5: Research and Development - R&D expenses are increasing, focusing on new energy vehicles, smart driving, AI, and high-frequency communication [5] - The company is recognized as a high-tech enterprise and has established provincial and national-level research centers, indicating strong R&D capabilities [5] - The demand for PCBs is expected to grow significantly due to the increasing requirements for computing power and AI applications [6]

Group 1: Financial Performance - In Q1 2025, the company achieved revenue of 4.91 billion RMB, a year-on-year increase of 20.75% [1] - The net profit attributable to shareholders was 0.47 billion RMB, up 29.47% year-on-year [1] - The net profit excluding non-recurring gains and losses was 0.48 billion RMB, reflecting a growth of 44.64% [1] Group 2: PCB Business Development - The PCB business focuses on communication equipment, particularly in data centers and automotive electronics, with a slight recovery in wireless orders and continued growth in wired demand [2] - Orders in the data center sector continued to grow, driven by demand for AI accelerator cards and servers [2] - The automotive electronics sector is experiencing stable growth, particularly in new energy and ADAS directions [2] Group 3: Packaging Substrate Business - The company offers a wide range of packaging substrate products, including module packaging substrates and storage packaging substrates, primarily used in mobile smart terminals and servers [3] - Demand for packaging substrates improved in Q1 2025, mainly due to increased demand for storage products [3] Group 4: Production Capacity and Utilization - The overall production capacity utilization remains high, particularly in the PCB business due to sustained demand in computing power and automotive electronics [4] - The packaging substrate business has seen an increase in capacity utilization compared to Q4 2024 due to improved demand in the storage sector [4] Group 5: Impact of U.S. Sales and Tariff Policies - Direct sales to the U.S. accounted for a low proportion of total revenue, indicating limited impact from U.S. tariff policies [5] - The company is closely monitoring the evolving international trade environment and maintaining communication with industry stakeholders [5] Group 6: HDI Process Capability - The company possesses HDI process capabilities, applicable in communication, data centers, industrial control, medical, and automotive electronics sectors [6] Group 7: FC-BGA Packaging Substrate Development - The company has achieved batch production capability for FC-BGA packaging substrates with up to 20 layers, with ongoing development for products exceeding 20 layers [7] - The Guangzhou packaging substrate project is in the early stages of ramping up production, with some cost impacts on profits [7] Group 8: Expansion Plans - The PCB business is expanding with factories in Shenzhen, Wuxi, Nantong, and a project in Thailand, focusing on technology upgrades and capacity enhancement [8] - The Nantong Phase IV project is under construction to establish an HDI technology platform [8] Group 9: Thailand Factory Investment - The total investment for the Thailand factory is 1.274 billion RMB, aimed at enhancing overseas market reach and meeting international customer demands [9] Group 10: Raw Material Price Changes - Key raw materials have seen price increases in Q1 2025 due to commodity price fluctuations, impacting costs [10] - The company is actively monitoring raw material prices and maintaining communication with suppliers and customers [10]

Core Points - The company has approved the use of up to RMB 300 million of idle raised funds for cash management, with specific allocations for "Jing 20 Convertible Bonds" and "Jing 23 Convertible Bonds" [1][16] - The purpose of this cash management is to enhance the efficiency of fund usage while ensuring the safety of the raised funds and not affecting the implementation of investment projects [1][14] - The funds for this investment are entirely sourced from temporarily idle raised funds [2] Summary by Sections 1. Overview of the Financial Management - The company and its subsidiary, Zhuhai Jingwang, will use up to RMB 30 million of idle raised funds for cash management, with a maximum of RMB 5 million from "Jing 20 Convertible Bonds" and RMB 25 million from "Jing 23 Convertible Bonds" [1][16] - The usage period is valid for 12 months from the date of board approval, allowing for rolling use of funds within the specified limits [1][16] 2. Source of Funds - The funds for the financial management are entirely from temporarily idle raised funds [2] 3. Basic Information on Raised Funds - The company issued "Jing 20 Convertible Bonds" on August 24, 2020, raising a total of RMB 178 million, with a net amount of RMB 176.02 million after expenses [2] - The company also issued "Jing 23 Convertible Bonds" on April 4, 2023, raising a total of RMB 115.4 million, with a net amount of RMB 113.96 million after expenses [3] 4. Details of the Financial Products - The company has subscribed to structured deposit products from Bank of China, with a total investment of RMB 160 million [5] - The structured deposits have varying terms of 35 days and 37 days, with expected annualized returns ranging from 0.84% to 2.08% depending on market conditions [8][12] 5. Risk Control Measures - The company adheres to prudent investment principles, selecting reputable and capable institutions for investment products [6] - An internal audit department will oversee the use and custody of funds, ensuring compliance and timely reporting to the board [6][7] 6. Impact on Investment Projects - The cash management of idle raised funds will not affect the normal operation of investment projects or the use of raised funds, ensuring compliance with regulations [14][17] 7. Trustee Information - Bank of China, a publicly listed company, serves as the trustee for the structured deposits, with no related party relationships with the company [15]

Group 1 - The convertible bond of Fushi closed at 124.097 yuan per share, with a trading volume of 32.6581 million yuan and a conversion premium of 30.7% [1] - The credit rating of Fushi's convertible bond is "AA-", with a maturity of 6 years and a coupon rate that increases from 0.30% in the first year to 2.00% in the sixth year [1] - The conversion price for the bond is set at 29.68 yuan, with the conversion period starting on February 19, 2024 [1] Group 2 - Si Hui Fushi Electronic Technology Co., Ltd. is a private national high-tech enterprise focused on high-quality PCB manufacturing, serving industries such as industrial control, automotive, transportation, communication, and medical [2] - The company was listed on the Shenzhen Stock Exchange's Growth Enterprise Market on July 13, 2020, with the stock code 300852 [2] - For the first quarter of 2025, Si Hui Fushi reported a revenue of 406.2 million yuan, a year-on-year increase of 26.23%, while the net profit attributable to shareholders decreased by 38.08% to 28.6926 million yuan [2] - As of March 2025, the concentration of shareholding is high, with the top ten shareholders holding a combined 68.51% and the top ten circulating shareholders holding 67.23% [2]