经过四年多的迅猛发展，元视芯已快速成长为行业内营收破亿速度最快的图像传感器设计企业之一，营 收规模从2023年的数百万元跃升至2025年近2亿元，累计出货量突破7500万颗，规模化交付能力获得市 场高度认可。 针对公司未来发展，元视芯创始人兼董事长刘参易表示："此次A+轮融资的完成，以及即将推出的高端 智驾汽车8M CIS，是元视芯发展历程中的重要里程碑。新一轮资本的注入也为元视芯开启了发展新篇 章。未来元视芯将持续加大研发投入，深化双轮驱动，坚持极致的产品创新发展战略，为客户和行业提 供价值。" 经济观察网近日，国内高动态视频CMOS图像传感器(CIS)设计企业——深圳市元视芯智能科技股份有 限公司(以下简称"元视芯")正式宣布，于2025年底顺利完成A+轮融资并于近日完成工商变更登记。本轮 融资总额超3亿元人民币，由策源资本、无锡产投及一汽红旗私募基金联合领投，创新工场、知守投 资、中信建投（601066）资本、华天科技（002185）、弘芯投资、福田资本、亿合资本等多家知名机构 跟投，老股东GRC富华资本继续追投。 ...

科创芯片设计ETF天弘（589070）紧密跟踪上证科创板芯片设计主题指数，指数聚焦半导体中游设计环 节，含量接近95%！相较于同类科创芯片指数更加"纯粹"，行业集中度极高！ 盘面上，两市低开低走，芯片设计概念下跌。相关ETF方面，科创芯片设计ETF天弘（589070）标的指 数盘中跌3.82%，成交额达8326.09万元。成分股中，聚辰股份、中微半导、普冉股份、联芸科技、佰维 存储跌超5%，成都华微、芯原股份、恒玄科技等多股跟跌。 华创证券指出，市场正投入海量资源推进NAND芯片与控制器设计的技术革新。推理需求带动数据中心 存储芯片激增，相关设计研发已进入与客户深度探讨阶段，未来将持续发展。 （文章来源：每日经济新闻） 消息面上，据中国基金报报道，行业正迎来库存周期反转与AI创新周期深化的双重驱动。① 据科创板 日报等多家媒体消息，芯片设计环节涨价预期明确，联发科已表态将适度调价，亚德诺自2月1日起全线 涨价10%-15%。② 同时，存储芯片"超级周期"持续，Counterpoint Research预测一季度价格还将上涨 40%-50%。③ 政策面上，广州开发区等地出台专项补贴措施，财政部等部委的税收支持政 ...

Core Insights - Cadence Design Systems Inc. (CDNS) has launched the first LPDDR5X 9600Mbps memory IP system for enterprise and data center applications, in partnership with Microsoft, marking a significant advancement in memory architecture [2][9] - The new solution integrates Cadence's LPDDR5X IP with Microsoft's RAIDDR error correction code (ECC) technology, providing high performance, low power consumption, and enhanced reliability [2][3] Product Development - The LPDDR5X system supports 40-bit channels and delivers 9600 Mbps performance while maintaining low power usage and enterprise-grade reliability features similar to DDR5 [5] - Microsoft's RAIDDR ECC technology enhances the reliability of the LPDDR5X system, enabling data center architects to deploy this memory solution at scale without compromising performance or power efficiency [4][3] Market Trends - The demand for LPDDR5X is increasing in data centers due to its energy efficiency and performance in AI and high-performance computing (HPC) workloads [3][8] - Long-term trends such as 5G, hyperscale computing, and autonomous driving are driving design wins for Cadence, while the rise of Generative, Agentic, and Physical AI is increasing computing needs [8] Competitive Landscape - Cadence faces competitive pressure from rivals like Synopsys and Siemens, which may impact pricing power and margins [11] - The company's focus on AI solutions increases exposure to competition and the cyclical nature of AI infrastructure spending [11] Strategic Initiatives - Cadence is expanding its portfolio with next-generation memory IP, including LPDDR6 memory IP expected to operate at 14.4Gbps by July 2025, positioning itself as a key player in future memory subsystems [7] - Collaborations with major players like Qualcomm and NVIDIA are aimed at developing next-generation AI chips for training and inference [8][10]

Group 1 - The core point of the article is that Jiewa Technology Co., Ltd. has submitted an application for listing on the Hong Kong Stock Exchange, with CITIC Securities as its sole sponsor [1] - Jiewa is a manufacturer operating under a virtual integrated device model, focusing on the research and development of analog integrated circuits [1] - The company previously submitted a listing application to the Hong Kong Stock Exchange on May 30, 2025 [1]

Core Viewpoint - Shenzhen Huada Beidou Technology Co., Ltd. is reapplying for an IPO on the Hong Kong Stock Exchange, having previously submitted a prospectus six months ago, with updated financial data showing a revenue of 403 million yuan and a net loss of 64 million yuan for the first half of 2025, indicating a 20% year-on-year revenue growth but a 16% increase in net loss [1][3]. Group 1: Financial Performance - The company reported a revenue of 403 million yuan for the first half of 2025, a 20% increase year-on-year, while the net loss was 64 million yuan, which is a 16% increase compared to the previous year [1]. - Cumulative net losses over the past three and a half years amount to 588 million yuan, with losses of 93 million yuan in 2022, 289 million yuan in 2023, and projected losses of 141 million yuan in 2024 [3][4]. - Research and development costs have exceeded 330 million yuan over the past three years, consistently accounting for more than 14% of revenue [4]. Group 2: Market Position and Product Application - Huada Beidou's GNSS chips dominate the shared bicycle market in China, holding over 60% market share and covering major platforms like Meituan, Qinjie, and Hello [2][3]. - The company is positioned as the sixth largest GNSS service provider globally, with a 4.8% market share, and ranks second among domestic companies [3]. - The company is expanding its GNSS chip applications to electric bicycles, which are expected to become a major revenue source in the coming years [6]. Group 3: Future Growth Strategies - Huada Beidou is focusing on smart driving and low-altitude economy sectors, with the latter projected to have a compound annual growth rate of 34.5% from 2024 to 2029 [7]. - The company is developing multi-frequency SoC chips that support various GNSS signals, suitable for drones and eVTOL applications, and is in discussions with leading drone manufacturers [7]. - Collaborations with major automotive companies like BYD and SAIC have been established to support smart driving technologies [7]. Group 4: Competitive Landscape - The company faces significant competition in the smart driving and low-altitude economy sectors from established players like Beidou Star and Huace Navigation, which have maintained strong market shares in traditional fields [8]. - The average selling price of standard precision chips has decreased from 7.4 yuan to 4.8 yuan from 2022 to 2024, while sales and marketing expenses have increased by 27.7% [8]. Group 5: Financial Health and IPO Rationale - As of June 2025, the company has cash and cash equivalents of 244 million yuan, which is below its projected R&D expenditure for 2024 [9]. - The capital liability ratio has increased from 2.3% in 2022 to 9.3% in 2023, indicating rising financial pressure [9]. - The funds raised from the IPO are intended to enhance R&D capabilities, expand product offerings, and develop sales networks [9].

IT之家 12 月 12 日消息，豪威集团今日公告，公司正在进行申请发行境外上市外资股（H 股）并在香港 联交所主板上市的相关工作。香港联交所上市委员会于 2025 年 12 月 11 日举行上市聆讯，审议公司本 次发行上市的申请。 公告称，公司本次发行上市的联席保荐人已于 2025 年 12 月 12 日收到香港联交所向其发出的信函，其 中指出香港联交所上市委员会已审阅公司的上市申请，但该信函不构成正式的上市批准，香港联交所仍 有对公司的上市申请提出进一步意见的权力。 | 证券代码:603501 | 证券简称:豪威集团 公告编号:2025-121 | | --- | --- | | 转债代码:113616 | 转债简称:韦尔转债 | IT之家注意到，中国证监会网站 12 月 9 日发布多个境外发行上市备案通知书，其中就包括豪威集团。 公开资料显示，豪威集团创立于 1994 年 11 月，是全球排名前列的中国半导体设计公司，于 2017 年 5 月 4 日在上海证券交易所成功挂牌上市，是国内少数兼具半导体研发设计和半导体分销能力的企业，旗 下拥有豪威科技 (OmniVision)、韦尔半导体（Will Sem ...

Profitability Holding Steady Revenue Breakdown by Region The North America region accounted for nearly three quarts of Alchip Technologies’ third quarter 2025 revenue. Taipei, Taiwan, Dec. 02, 2025 (GLOBE NEWSWIRE) -- Alchip Technologies reported that third quarter profits held steady on a quarter-by-quarter basis despite a decline quarterly revenue. Third quarter 2025 net income of $44.3 million is 3.1% over 2025 second quarter net income of $42.9 million. Pre-tax profit for the third quarter of 2025 re ...

Core Viewpoint - The stock price of Xidi Micro has been declining for four consecutive days, with a total drop of 8.27% during this period, currently trading at 15.08 CNY per share, with a market capitalization of 6.198 billion CNY [1] Company Overview - Xidi Microelectronics Group Co., Ltd. is a leading semiconductor and integrated circuit design company in China, established on September 11, 2012, and listed on January 21, 2022 [1] - The company specializes in the research, design, and sales of analog integrated circuit products, including power management chips and signal chain chips, with applications in mobile phones, laptops, and wearable devices [1] Fund Holdings - Penghua Fund has a significant holding in Xidi Micro, with the Penghua Smart Investment Digital Economy Mixed A Fund (020086) holding 39,400 shares, representing 0.59% of the fund's net value, making it the sixth-largest holding [2] - The fund has experienced a floating loss of approximately 47,252.4 CNY today, with a total floating loss of 53,600 CNY during the four-day decline [2] Fund Manager Performance - The fund manager of Penghua Smart Investment Digital Economy Mixed A Fund is Su Junjie, who has been in the position for 7 years and 281 days, managing assets totaling 24.924 billion CNY [3] - Under his management, the fund has achieved a best return of 84.19% and a worst return of -21.6% [3]

Core Insights - The article emphasizes the emergence of 3D IC technology as a crucial development direction in the integrated circuit industry, addressing the limitations of traditional 2D IC technology due to the approaching physical limits of Moore's Law [2][11]. Group 1: Design Complexity and Solutions - 3D IC design complexity surpasses that of traditional planar ICs, requiring integration of chips with different functions and processes, which complicates cross-system connection planning and coordination [4][5]. - Siemens EDA's Innovator3D IC™ solution, launched in 2024, aids IC designers in efficiently creating, simulating, and managing heterogeneous integrated 2.5D/3D IC designs, allowing for effective data management and problem avoidance [5][6]. - The Innovator3D IC suite, released in June 2025, supports designs with over 5 million pins, featuring multi-threading and multi-core processing capabilities, enhancing performance for complex designs [5][7]. Group 2: Verification and Reliability - The verification of 3D IC systems is critical, particularly in ensuring correct connections between stacked chips, which involves design rule checks (DRC) and layout versus schematic (LVS) validations [8][9]. - Siemens EDA has expanded its Calibre® platform to address verification challenges, with tools like Calibre 3DStack automating checks for die alignment and LVS, ensuring correct inter-chip connections [9][10]. - The Calibre 3DPERC and mPower tools validate reliability issues post-die stacking, addressing concerns such as electrostatic discharge (ESD) and electromagnetic interference (EMI) [9][10]. Group 3: Thermal and Stress Analysis - Effective heat dissipation in 3D stacked structures is a significant challenge, as accumulated heat can adversely affect chip performance [10][11]. - Siemens EDA's Calibre 3DThermal software analyzes thermal effects in 3D ICs, enabling designers to model and visualize heat distribution, thus optimizing layout and packaging designs [10][11]. - The Calibre 3DStress tool addresses thermal-mechanical stress and warpage, allowing for transistor-level analysis to evaluate the impact of packaging interactions on design functionality [11]. Group 4: Future Prospects - 3D IC technology is positioned as a vital future direction for the integrated circuit industry, with significant application potential across various fields [11]. - Siemens EDA aims to lead technological innovation in 3D IC design, providing comprehensive solutions for design collaboration, verification, thermal management, and stress analysis, thereby facilitating breakthroughs in the industry [11].

Core Viewpoint - The company plans to acquire 100% equity of Rongpai Semiconductor through a combination of share issuance and cash payment, which is expected to enhance its asset scale, operating income, and net profit, thereby improving sustainable development and profitability for investors [1][2] Group 1: Acquisition Details - The payment structure for the acquisition will be finalized after the completion of auditing and evaluation of the target company [1] - Upon completion of the transaction, Rongpai Semiconductor will become a wholly-owned subsidiary of the company [1] Group 2: Target Company Overview - Rongpai Semiconductor specializes in the design, research, and sales of high-performance, high-quality analog chips, with products including digital isolators, isolation interfaces, isolation drivers, isolation sampling, and optical MOS [1] - The target company's products are applied in various fields such as automotive electronics, industrial control, new energy, smart meters, and smart home appliances [1] - Rongpai Semiconductor has achieved breakthroughs in domestic isolation chips through its proprietary iDivider technology, holding multiple invention patents in the isolation field [1] Group 3: Strategic Implications - The acquisition is a key strategy for growth in the analog chip design industry, allowing the company to quickly expand its product offerings in the isolator category [2] - The company aims to leverage Rongpai's mature patented technologies and R&D resources to upgrade its product matrix and enhance competitive advantages [2] - The rich customer resources accumulated by Rongpai in automotive electronics and industrial control will benefit the company's customer structure, enabling it to provide a more comprehensive range of high-performance analog chip products [2]