智芯业务延续稳健发展态势，已形成SoC与MCU双轮驱动的产品矩阵，SoC与MCU两大核心产品线在 技术创新、客户拓展及生态构建等维度取得关键突破，为业务持续增长注入新动能。报告期内，杰发科 技通过国际公认的测试、检验和认证机构SGS关于ISO/SAE 21434汽车网络安全管理体系认证。 来源：环球网 8月21日，北京四维图新科技股份有限公司发布2025年半年度报告。2025上半年公司营收总计17.61亿 元，智芯板块收入为2.59亿元。 截至目前，芯片累计出货量超3亿颗，其中SoC累计出货量9000万套片，MCU累计出货量8000万颗。 ...

Semiconductor Industry Research Summary Industry Overview - The semiconductor industry is driven by Moore's Law, which states that the number of components on integrated circuits doubles approximately every 18 to 24 months, leading to reduced costs and expanded application scenarios, including IoT and brain-machine interfaces [1][6] - The global semiconductor market is expected to exceed $1 trillion by 2030, with integrated circuits being the main driver, accounting for 80% of the market, and digital chips making up 80% of integrated circuits [1][15] Key Points on Semiconductor Chips - Semiconductor chips are categorized into five functional types: information acquisition, transmission, processing, storage, and output [1][7] - Integrated circuits represent 80% of the semiconductor industry's value, with digital chips resembling the human brain, responsible for logic and information storage [1][8] - Digital chips include various types such as CPU, MCU, FPGA, GPU, DRAM/Flash, and ASIC/SoC, while analog chips manage signal chains and power distribution [1][10][12] Market Dynamics - The semiconductor market is primarily driven by consumer electronics, which account for 60%-70% of downstream applications, with mobile phones representing about 30% [1][16] - AI development is rapidly changing the market landscape, with NVIDIA's data center revenue nearing 25% of the semiconductor market, and AI-related semiconductors approaching 30% [1][16] Manufacturing and Design Processes - Semiconductor manufacturing involves design, fabrication, and testing, with critical processes including photolithography, etching, deposition, and ion implantation [1][4][17] - The semiconductor industry operates in a triangular structure, with product layers at the bottom, manufacturing layers vertically, and equipment and materials on the sides [1][20] Financial Aspects and Valuation - Chip design companies generate revenue based on sales volume multiplied by unit price, while wafer manufacturers rely on capacity, utilization rates, and pricing [1][22][23] - Valuation methods differ across semiconductor sectors, with design companies typically evaluated on PE ratios based on growth expectations, while wafer and testing companies are often assessed using PB ratios [1][26] Innovation and Growth Opportunities - Innovation cycles are crucial in the semiconductor industry, as they drive value growth across various applications, particularly in AI [1][28] - Identifying high-quality semiconductor companies involves analyzing end-user growth rates and changes in chip value, particularly in emerging sectors like electric vehicles and photovoltaics [1][29] Investment Considerations - Key investment points in the semiconductor industry include innovation, new directions, and understanding the flow from downstream to terminal products and from manufacturing to testing [1][30] - The semiconductor industry is characterized by cycles, including long-term innovation cycles, capacity expansion cycles, and short-term inventory cycles, which are influenced by product launches and market demand [1][32][33] Domestic and International Trends - The trend towards domestic production in the semiconductor industry is progressing, with many segments achieving initial domestic production and beginning to internationalize [1][34]

Core Insights - The global automotive market is expected to grow at a compound annual growth rate (CAGR) of 2% from 2024 to 2030, with China remaining vibrant while the US and European markets are stable or declining [2] - The automotive semiconductor market is projected to grow five times faster, with the market size expected to increase from $68 billion in 2024 to $132 billion by 2030 [2] - The average value of semiconductor devices per vehicle is anticipated to rise from $759 in 2024 to approximately $1,332 by 2030, with the number of semiconductor devices per vehicle increasing from about 824 to 1,158 [2] Market Dynamics - The shift from internal combustion engines to hybrid and fully electric vehicles is driving demand for power electronics, particularly wide-bandgap switches like SiC and GaN [3] - New safety regulations in Europe and the US are necessitating additional sensors and controllers in even entry-level vehicles, leading to increased adoption of affordable SoCs and image sensors [3] - The evolution of E/E architecture towards more centralized systems and 48V power grids will require advanced MCUs and new PMICs [3] Competitive Landscape - Five companies dominate 50% of the automotive semiconductor market, with Infineon leading at over $8 billion in automotive sales, followed by NXP and STMicroelectronics [6] - The Chinese Ministry of Industry and Information Technology aims for 25% localization of semiconductors by 2025, with companies like Horizon Robotics and BYD Semiconductor filling market gaps [6] - Vertical integration is no longer unique to Tesla, as companies like NIO and BYD are adopting advanced manufacturing processes and designing their own semiconductors [6] Production Capacity - SMIC is building four 12-inch wafer fabs targeting automotive and power customers, while Europe, Japan, and the US are expanding 200mm analog production lines [7] - The competition in advanced nodes below 16nm is dominated by TSMC and Samsung, with significant demand from companies like NVIDIA and Qualcomm for automotive components [7] Technological Advancements - The penetration rate of battery electric vehicles (BEVs) is slowing, but the European market is pushing for more BEVs due to revised emissions regulations [10] - The application of SiC MOSFETs in inverters is increasing, driven by the rapid decline in N-type SiC substrate prices, with BYD launching a 1000V+ automotive platform [10] - Next-generation vehicles are expected to feature advanced SoCs with 5nm technology, enabling high processing capabilities for autonomous driving applications [11][12]

Key Features of Unified Selective Device Installer (USDI) - AMD Vivado 2025.1 introduces the Unified Selective Device Installer (USDI) for efficient FPGA and SoC design [1][3] - USDI allows users to download only necessary device files, streamlining installation and workflow [3] - USDI consolidates Vivado, Vitis, and related tools into a single installer with selective device file downloads [4] - The Filter Device section streamlines device selection by allowing users to search by device name or series [6] - Users can select specific devices within a series, further reducing download size and enabling tailored selection [8] Benefits of USDI - USDI reduces download size and disk space usage by up to 60% [4][11] - Installation times are faster, and valuable disk space is saved, improving setup efficiency and system performance [6] - Tailoring the install speeds up the process, optimizes storage, and saves bandwidth [5] Specific Device Support and Examples - Selective installation currently applies to AMD Versal devices, allowing users to choose specific parts [4] - Downloading all devices from the Versal AI Edge Series in AMD Vivado 2024.2 required approximately 83 GB download size and 212 GB disk space [5] - With USDI, selecting all devices from the Versal AI Edge Series reduces the download size to 22 GB and disk space to 77 GB, a 60% reduction in download size [5] Offline Installation - USDI allows users to select specific devices for offline installation by downloading an image from the Web Installer [9] - Users can select "Download Image (Install Separately)" from the web installer setup and choose the required Versal devices [10]

Summary of Semiconductor Industry Conference Call Industry Overview - The semiconductor supply chain is accelerating towards self-sufficiency, with significant growth in equipment and materials manufacturers' orders and performance in Q2 2025 [1][2][3] - Key sectors such as storage, analog, and MCU are showing signs of recovery, with strong performance guidance from SoC companies indicating robust demand [1][2] Market Performance - In June 2025, global semiconductor stocks performed well, with the Shenzhen Composite Index rising nearly 6% [2] - Demand for mobile phones, PCs, and wearable devices remains stable, with Xiaomi's AI glasses receiving positive market feedback [1][2] - The automotive market is experiencing steady growth, with Xiaomi's new car sales exceeding expectations [1][2] Inventory and Supply Chain Dynamics - The inventory situation for mobile phones is stable, while PC inventory adjustment space is narrowing [1][3] - Power semiconductor manufacturers are gradually improving their inventory levels [1][3] - TSMC maintains its capital expenditure guidance, while SMIC and Hua Hong are steadily expanding production [1][3] Pricing Trends - After a rapid increase, DDR4 prices are losing momentum, with some models even trading below DDR5 prices, which is expected to drive DDR5 adoption [1][3] - In April 2025, global semiconductor sales increased by over 20% year-on-year, with significant growth in China and the Americas [1][3] Company Developments - Domestic GPU manufacturers such as Muxi and Moer Thread are making progress, while Loongson has released a fully autonomous server CPU [1][2] - Companies like Rockchip and Espressif are showing stable performance, and the MCU market is recovering across multiple sectors [1][2] Financial Performance - Micron's latest financial report shows a nearly 50% increase in HBM revenue, with expectations for Q3 revenue growth of 38% year-on-year and 15% quarter-on-quarter [3][22] - Analog chip companies are experiencing significant revenue growth, with companies like Ti and AD expected to see a 10%-20% increase in Q2 2025 [4][25] Investment Recommendations - Investment suggestions focus on two main areas: self-sufficiency and marginal changes in the economic cycle, with recommended sectors including upstream equipment and materials, storage chip modules, manufacturing and advanced packaging, and AI-related chips [13] Challenges and Opportunities - The RF industry faces competitive pressures, but opportunities for domestic substitution are noteworthy, particularly in the automotive sector [6][28] - The power semiconductor market remains stable, with good demand in the new energy vehicle sector, although price competition persists [7][29] Conclusion - The semiconductor industry is showing signs of recovery and growth across various sectors, with strong demand and improving financial performance expected in the coming quarters. The focus on self-sufficiency and technological advancements will be crucial for future developments [1][2][3][13]

Core Viewpoint - Advanced packaging is becoming a key differentiator in the high-end mobile market, offering higher performance, greater flexibility, and faster time-to-market compared to System on Chip (SoC) solutions [2][5]. Group 1: Market Trends - Advanced packaging technologies, such as multi-chip components, are essential for AI inference and adapting to rapid changes in AI models and communication standards [2][5]. - The high-end mobile market is increasingly adopting multi-chip assembly, moving beyond single-chip SoC solutions due to the need for enhanced performance and flexibility [5][8]. - The transition from single-chip SoCs to 2.5D systems is driven by the demand for higher computational capabilities and the limitations of traditional scaling methods [5][6]. Group 2: Technical Insights - Single-chip SoCs are efficient and cost-effective for low-end devices, integrating all necessary components on a single silicon die [3][10]. - Multi-chip components allow for greater diversity in processing units, including combinations of CPUs, GPUs, and specialized accelerators, enhancing performance for high-end applications [5][6]. - The use of advanced 3D and 2.5D packaging technologies enables vertical stacking of chips, increasing interconnect bandwidth and processing capabilities [5][6]. Group 3: AI Integration - AI capabilities are increasingly being integrated at the silicon level in high-end mobile devices, with companies like NVIDIA and Arm developing specialized hardware for AI workloads [14][15]. - The design of chips is influenced by the need to support evolving AI functionalities and communication standards, requiring flexibility in silicon design [11][18]. - Companies are exploring various configurations for AI accelerators, either integrating them into a single chip or using separate chips to optimize performance [10][14]. Group 4: Power and Efficiency - Power consumption remains a critical concern, with the need for efficient processing to extend battery life and manage heat dissipation in mobile devices [12][16]. - Innovations in chip design, such as lightweight pipelines and local data reuse, are aimed at improving power efficiency while maintaining high performance [15][16]. - The introduction of eSIM technology is an example of how companies are reducing power consumption and enhancing design flexibility in mobile devices [16].

Core Viewpoint - Chinese automotive companies are accelerating the localization of automotive chips, aiming for 100% domestic production by 2027, driven by policy guidance and market awareness, significantly impacting the global chip landscape [1]. Group 1: Chip Classification and Current Status - Automotive chips are essential for the "soft and hard integration" architecture of modern vehicles, with a single vehicle typically requiring hundreds of chips across various functions [5]. - Chips can be categorized into five types: main control (e.g., MCU, SoC), communication (e.g., CAN/LIN/Ethernet transceivers), power (e.g., IGBT drivers), sensor (e.g., millimeter-wave radar front-end), and functional safety chips (e.g., TPM) [6]. - Chinese chip manufacturers have made breakthroughs primarily in main control and communication chip products [6][8]. Group 2: Current Developments in Domestic Chip Production - Companies like Neusoft Carrier, Jiefa Technology, and Huada Semiconductor have launched automotive-grade MCU products that meet AEC-Q100 certification, supporting ISO 26262 safety standards [8]. - In the communication chip sector, companies such as Xingyu Technology and Xinyi Information have achieved small-scale production of domestic CAN and Ethernet PHY chips, with some products entering the vehicle development cycle [8]. - High-performance intelligent driving SoC chips are still dominated by a few companies, with examples like Horizon's Journey series and Huawei's Kirin series, which are being deployed in various vehicle models [9]. Group 3: Trends in Chip Research and Development - Chinese automotive companies are transitioning from being "chip purchasers" to "chip architecture participants" and even "definers," with firms like XPeng leading the way in self-developed AI chip strategies [10]. - The evolution of hardware architecture is moving towards SoC integration platforms that emphasize multi-domain collaboration, requiring chip companies to possess both hardware design capabilities and a complete software SDK stack [12]. - Collaborations between automotive and chip companies are increasing, with examples including Geely's partnership with Hezhima for intelligent driving platforms and BYD's full-stack self-research model for core modules [13][15].

Group 1: Semiconductor Manufacturing Trends - Manufacturing utilization rates continue to improve year-on-year, with downstream manufacturers focusing on Chiplet and advanced packaging technologies[1] - The storage market is showing signs of a price turning point, with an upward trend expected to continue until Q3 2025, driven by AI-related demand[1] - Design companies are experiencing differentiated downstream demand, with power and analog companies reporting a recovery in industrial and automotive sectors[1] Group 2: Equipment and Domestic Production - Global WFE is projected to reach $100 billion in 2025, with a year-on-year growth of 4%-5%[3] - Domestic equipment manufacturers are seeing significant growth in new orders, benefiting from downstream expansion and increased localization rates[3] - The verification speed of core new equipment by domestic companies is accelerating, indicating a positive trend for advanced node domestic equipment breakthroughs[3] Group 3: Storage Market Dynamics - The storage market is expected to see price increases, with predictions of 18-23% and 13-18% growth for Server and PC DDR4 modules respectively in Q2 2025[4] - The enterprise storage market is projected to grow from $23.4 billion in 2024 to $49 billion by 2028, reflecting a compound annual growth rate (CAGR) of 16%[25] - Domestic manufacturers are positioned to benefit from the increasing demand for enterprise-level storage driven by AI infrastructure investments[25] Group 4: Design Sector Insights - The power semiconductor sector in China is entering a mild upward cycle, with a 14.5% year-on-year increase in domestic passenger car production from January to April 2025[38] - The demand for SoC and MCU products is significantly driven by national subsidies and export opportunities, with performance expected to vary across companies in Q2 2025[26] - The analog chip sector is recovering, with industrial and communication sectors seeing a return to inventory restocking[29]

Core Viewpoint - Modern automobiles are evolving into "data centers on wheels," necessitating high-performance computing that can operate reliably under harsh conditions for 10-15 years [1][2]. Group 1: Automotive Computing Needs - The automotive industry requires not only mobility but also autonomy, safety, and continuous software updates, leading to a sustained demand for high-performance computing [1]. - The environment in which automotive systems operate is fundamentally different from that of data centers or smartphones, necessitating robust design [1]. Group 2: Role of imec - imec is positioned at the forefront of integrating mobility and microelectronics, leveraging Europe's strong automotive tradition and semiconductor strategy [2]. - The organization is conducting cutting-edge research to prepare for automotive-grade industrial applications, focusing on advanced packaging, chip architecture, and system integration [2]. Group 3: Chiplet Technology - Chiplet technology, which consists of small modular processing units, is being considered for automotive applications to meet the performance demands of autonomous and connected vehicles [3]. - The advantages of Chiplet include higher yield, cost-effectiveness, architectural flexibility, and heterogeneous integration, although challenges remain regarding long-term reliability in harsh environments [3]. Group 4: Sensor Development - imec's SENSAI project is advancing next-generation sensor technologies, including CMOS cameras and solid-state LiDAR, to enhance vehicle intelligence [4][5]. - A digital twin framework is being developed to simulate sensor configurations, helping to reduce costs and accelerate development without the need for physical prototypes [4]. Group 5: Collaborative Ecosystem - A collaborative ecosystem is essential for the successful integration of chips and sensors in vehicles, as highlighted by imec's STAR program, which aims to standardize interfaces and protocols among automotive manufacturers and semiconductor companies [5]. - The STAR program is focused on establishing consensus through workshops and forums to lay the groundwork for economies of scale in the automotive sector [5].

Core Viewpoint - Leading smartphone manufacturers are facing challenges related to local generative AI, standard smartphone functionalities, and increasing data interactions between mobile devices and the cloud, which put pressure on computing and power consumption [1][3]. Group 1: Mobile SoC Design Challenges - High-end smartphones utilize heterogeneous architectures in their System on Chip (SoC) designs, where multiple modules perform different tasks collaboratively [3]. - The rapid evolution of AI networks and diverse AI model requirements complicate mobile SoC design, necessitating support for both large-scale cloud models and efficient local models [3][4]. - The integration of AI capabilities into chips is becoming less challenging due to advancements in tools and processes over the past five to ten years [6]. Group 2: AI Processing and Architecture - The design focus is shifting towards optimizing power consumption in parallel processing of graphics, general computing, and AI operations [5]. - AI accelerators in mobile SoCs may include GPUs, NPUs, or high-end ASICs, with NPU becoming central for low-power tasks [7][8]. - The rise of multimodal models and generative AI tools adds complexity to design, requiring flexible and efficient computing structures [10]. Group 3: Local vs. Cloud Processing - Local processing of AI applications, such as facial recognition and photo editing, is preferred to reduce latency and enhance data privacy [13]. - Despite the increase in local AI processing, some tasks still need to be executed in the cloud due to battery and power limitations [13]. - The balance between local and cloud processing will be an ongoing challenge as AI models become more efficient [13]. Group 4: Key Trends in Mobile SoC Design - Three key trends driving changes in mobile SoC design include rising analog demands, the proliferation of visual and AI applications, and the high-performance computing requirements of modern applications [15]. - Designers must consider both hardware and software perspectives to remain competitive, emphasizing the need for collaborative efforts across disciplines [15].