（来源：中国航空报） 美国国防高级研究计划局（DARPA）于1月14日发布了"可扩展系统目标光子集成电路架构"（PICASSO）项目的招标 书。PICASSO旨在革新光子电路架构，其应用范围涵盖从计算到光探测和测距等各个领域，通过从单个组件扩展到集 成微电子系统，并在系统层面衡量性能。 尽管光子集成系统有助于提升计算、模拟信号处理和传感领域的带宽、延迟和能效，但如今的光子电路仍存在局限 性，难以超越传统电子器件的性能。电路尺寸和功能扩展主要受两大限制：一是保持光信号完整性并最大限度降低噪 声；二是杂散波相互作用限制了电路的可预测性。 （逸文） 美国军方研究人员正与业界接洽，寻求开发用于计算、模拟信号处理和传感等领域的新型超大规模光子电路。 目前，系统设计人员通过电子方式转换和重构光信号来应对这些挑战，但大量使用电子器件阻碍了系统级延迟、效率 和带宽的提升，而光子器件本身就能解决这些问题。寻找性能理想的组件并不能解决扩展性受限的问题。 PICASSO项目将着重强调四大支柱：通过测试不同的应用场景并排除单一解决方案来提高通用性；通过定义和强制执 行接口边界条件并将其记录在接口控制文档中来提高互操作性；通过要求交付 ...

Core Insights - The article discusses the advancements and commercialization efforts of micro-transfer printing (μTP) technology, which is crucial for the integration of III-V materials on silicon substrates, enhancing photonic integrated circuits [2][5][6]. Group 1: μTP Technology Overview - μTP technology was developed by researchers at the University of Illinois in 2004 and has seen significant advancements, including the ability to transfer individual devices onto target photonic chips [2]. - The process involves using a PDMS stamp to pick and transfer devices, ensuring high alignment accuracy and allowing for large-scale parallel integration [3]. - μTP enables the integration of different materials on a common substrate without modifying the backend processes of silicon photonics [3]. Group 2: Commercialization Efforts - The INSPIRE project, running from 2021 to March 2025, focuses on commercializing wafer-level μTP technology, aiming to combine InP and SiN photonics on a single platform [5]. - Key partners in the INSPIRE project include Eindhoven University of Technology, imec, Smart Photonics, and Cambridge University, among others [5]. Group 3: Integration Challenges - The integration of III-V materials on silicon faces challenges due to lattice mismatch, which can lead to defects affecting the reliability of semiconductor lasers [6]. - Successful applications of single-chip methods in quantum dot devices have been reported, indicating potential for improved laser reliability [6]. Group 4: Upcoming Conference - TrendBank plans to host a conference from November 17-19, 2025, focusing on heterogeneous integration technologies, aiming to foster collaboration between industry and academia [9]. - The conference will cover advanced packaging technologies, including multi-material integration and photonic-electronic co-packaging [9].

Core Viewpoint - AMD's acquisition of Enosemi aims to accelerate the development of co-packaged optical devices for AI systems, enhancing its position as a full-stack AI provider [1][2][3]. Group 1: Acquisition Details - AMD announced the acquisition of Enosemi, a startup focused on photonic integrated circuits, to boost its capabilities in optical device development for AI [1]. - The financial terms of the acquisition have not been disclosed, and Enosemi was founded in 2023 with 16 employees and 11 investors [1]. - Enosemi's products include integrated photodetectors and custom silicon chips, indicating a strong product portfolio that complements AMD's existing technologies [1]. Group 2: Technological Implications - Photonic integrated circuits utilize photons for data transmission, offering high speed and low power consumption, which is crucial for applications in healthcare, automotive, and communications [1]. - The demand for faster data transmission is increasing with the complexity of AI models, making co-packaged optical devices essential for next-generation AI systems [2][4]. - AMD's strategy includes integrating its leading CPU, GPU, and SoC technologies with enhanced networking, software, and system integration expertise to support advanced AI workloads [2][4]. Group 3: Future Outlook - The acquisition is expected to enhance AMD's capabilities in supporting various photonic and co-packaged optical solutions for AI systems [3][4]. - AMD aims to provide a comprehensive innovation stack that encompasses computing, networking, system architecture, and software, positioning itself uniquely in the AI market [4].