Core Viewpoint - The company Guangpu Co., Ltd. (300632) has highlighted its 3D stacked die packaging products, which are primarily used in various high-tech fields such as smartphones, smart wearables, drones, robots, and AR/VR applications, indicating a strong market presence and technological relevance [1] Group 1 - The company's 3D stacked die packaging products are based on technology similar to high bandwidth memory (HBM) but are differentiated by their specific applications [1]

Core Viewpoint - The company is focusing on the development of its 3D stacked packaging products for various applications, while currently not having a presence in the high bandwidth memory (HBM) sector [1] Group 1 - The company's light integration sensor 3D stacked die packaging products are primarily used in smartphones, smart wearables, drones, robots, and AR/VR fields [1] - The technology used in these products is similar to that found in high bandwidth memory (HBM) 3D stacking technology, but the application areas differ [1] - The company has not yet entered the HBM sector but plans to monitor developments in this area based on technological advancements and industry trends [1]

Core Viewpoint - The company, Guangpu Co., Ltd. (300632.SZ), is exploring the development of its optical integrated sensor 3D stacked die packaging products, which are primarily applicable in fields such as smartphones, smart wearables, drones, robotics, and AR/VR [1] Group 1 - The company's 3D stacked die packaging products share a common origin with high bandwidth memory (HBM) technology but differ in application fields [1] - Currently, the company has not yet entered this sector but plans to monitor developments based on technological advancements and industry trends [1]

Group 1 - The core viewpoint of the article highlights that Guangpu Co., Ltd. (300632) is actively engaging with investors regarding its 3D stacked die packaging products, which are primarily used in various advanced technologies such as smartphones, smart wearables, drones, robots, and AR/VR devices [1] - The company's 3D stacked packaging technology is derived from high bandwidth memory (HBM) technology, indicating a potential for technological synergy and expanded applications in the market [1]