Core Viewpoint - The company Guangpu Co., Ltd. (300632) has highlighted its 3D stacked die packaging products, which are primarily used in various high-tech fields such as smartphones, smart wearables, drones, robots, and AR/VR applications, indicating a strong market presence and technological relevance [1] Group 1 - The company's 3D stacked die packaging products are based on technology similar to high bandwidth memory (HBM) but are differentiated by their specific applications [1]

Core Viewpoint - The company is focusing on the development of its 3D stacked packaging products for various applications, while currently not having a presence in the high bandwidth memory (HBM) sector [1] Group 1 - The company's light integration sensor 3D stacked die packaging products are primarily used in smartphones, smart wearables, drones, robots, and AR/VR fields [1] - The technology used in these products is similar to that found in high bandwidth memory (HBM) 3D stacking technology, but the application areas differ [1] - The company has not yet entered the HBM sector but plans to monitor developments in this area based on technological advancements and industry trends [1]

格隆汇11月20日丨光莆股份(300632.SZ)在互动平台表示，公司的光集成传感3D叠Die封装产品主要应用 在智能手机、智能穿戴、无人机、机器人、AR/VR 等领域，与高带宽内存（HBM）中的3D堆叠技术同 源，又有差异，且应用领域不同。目前公司尚未布局该领域，未来将根据技术沉淀和产业趋势关注该领 域发展。 ...

Group 1 - The core viewpoint of the article highlights that Guangpu Co., Ltd. (300632) is actively engaging with investors regarding its 3D stacked die packaging products, which are primarily used in various advanced technologies such as smartphones, smart wearables, drones, robots, and AR/VR devices [1] - The company's 3D stacked packaging technology is derived from high bandwidth memory (HBM) technology, indicating a potential for technological synergy and expanded applications in the market [1]