格隆汇1月21日丨联得装备(300545.SZ)在投资者互动平台表示，公司目前在半导体行业领域的设备主要 集中在芯片封装测试设备领域，主要有显示驱动芯片ILB倒装机、半导体倒装机、软焊料固晶机、共晶 固晶机、贴膜机、引线框架检测机等高速高精的半导体装备。在先进封装制程和第三代半导体相关设备 领域，在市场和技术等方面，公司也正在布局拓展。公司将持续加大对半导体的研发投入，进一步完善 新业务板块产业布局，推动公司半导体设备业务板块的发展。 ...

Core Viewpoint - The company is focusing on the semiconductor industry, particularly in the field of chip packaging and testing equipment, and is committed to increasing R&D investment in this area [1] Group 1: Company Focus - The company's equipment in the semiconductor sector primarily includes advanced packaging and testing devices such as display driver chip COF flip chip machines, semiconductor flip chip machines, soft solder die bonding machines, eutectic die bonding machines, film laminating machines, and lead frame inspection machines [1] - The company is actively expanding its presence in advanced packaging processes and third-generation semiconductor-related equipment, addressing both market and technological aspects [1] Group 2: R&D and Business Development - The company plans to continuously increase its R&D investment in semiconductors to enhance its new business segment's industrial layout [1] - The goal is to promote the development of the company's semiconductor equipment business segment [1]

Company Overview - Shenzhen LianDe Automation Equipment Co., Ltd. has over 20 years of experience in the semiconductor display equipment industry, achieving significant technological integration and product quality [2][3] - The company has established long-term partnerships with renowned clients such as Bosch, Apple, and Foxconn, enhancing its reputation in the industry [2] Competitive Advantages - The company possesses advantages in industry experience, R&D innovation, brand recognition, comprehensive service, and customer resources, leading to stable growth in operational scale and performance [3] Product Applications - The company's flexible AMOLED bonding equipment is widely used in the mass production of foldable screens for major smartphone brands, with ongoing collaborations for innovative flexible screen applications [4] - In the solid-state battery sector, the company is increasing R&D investment in various automation equipment, achieving product breakthroughs and generating sales orders [5] Semiconductor Equipment Progress - The company focuses on chip packaging and testing equipment, including advanced devices like COF flip chip machines and high-precision semiconductor equipment, with plans to expand its R&D investment in this area [6] VR/AR/MR Display Sector - The company has developed equipment for the VR/AR/MR display field, gaining recognition from clients in this emerging market and establishing partnerships with leading international manufacturers [7]

Company Overview - Shenzhen LianDe Automation Equipment Co., Ltd. has a strong focus on innovation and technology, leading to rapid and stable growth in recent years [2] - The company emphasizes optimizing product structure and achieving domestic substitution [2] - It has successfully expanded into overseas markets, particularly in Europe, Southeast Asia, and North America, gaining recognition from major clients due to superior equipment performance and service [2] Key Business Areas - The company provides comprehensive solutions for the folding screen supply chain, establishing sales orders and shipments in this segment [3] - In the VR/AR/MR display sector, it has developed equipment that meets the needs of clients, forming partnerships with leading companies in the industry [4] - The semiconductor equipment segment focuses on chip packaging and testing, with products like COF flip chip machines and high-precision semiconductor equipment [5] - In the Mini/Micro LED display field, the company has launched various equipment including chip sorting and transfer devices [6] Market Expansion - The company has built a strong client base in the overseas market, including partnerships with Fortune 500 companies such as Continental Automotive Electronics and Bosch [7]