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Core Viewpoint - The company, Northern Huachuang, has responded on an interactive platform that the demand for storage market is growing, and the HBM technology is accelerating its penetration, leading to a continuous increase in the demand for related process equipment [1] Group 1: Company Capabilities - The company provides core process equipment for storage chip manufacturing, including etching, thin film deposition, cleaning, thermal treatment, ion implantation, and coating development, covering mainstream storage categories such as DRAM and NAND [1] - In the HBM field, the company offers multiple core equipment and process solutions, including TSV etching, debonding, wet cleaning, ALD, PVD, electroplating, and annealing [1] Group 2: Market Position - The company's related products have been delivered in bulk to mainstream storage and HBM customers, with several products becoming the baseline production machines on customer production lines [1]

Group 1 - The company is a leading semiconductor equipment manufacturer in China, ranked first in the domestic market and sixth globally, with a product portfolio covering key front-end equipment such as etching, thin film deposition, cleaning, oxidation/diffusion, epitaxy, and photoresist removal [1] - The global semiconductor equipment market is expected to recover from 2024 to 2027, growing from $125.5 billion to $150.5 billion, with a CAGR of 11.3%. The Chinese mainland market is projected to increase from $49.1 billion to $66.2 billion during the same period [1] - The company is expected to benefit from the ongoing expansion of domestic wafer fabs and the push for domestic substitution, leading to an increase in market share as the penetration rate of domestic semiconductor equipment rises [1] Group 2 - Key assumptions include increased investment in semiconductor self-sufficiency in China, with local special funds likely to provide policy and financial support for domestic equipment substitution [2] - The value structure of equipment in the mainland market from 2025 to 2027 is projected to be 26% for etching, 27% for thin film deposition, 6% for cleaning, 6% for oxidation/diffusion, 7% for epitaxy, 5% for thermal processing, 4% for photoresist removal, and 2% for other auxiliary processes [2] - The company is expected to achieve higher performance potential and growth space through horizontal expansion of equipment categories and vertical integration of process flows, contrary to market perceptions of a slowdown in wafer fab expansion [2] Group 3 - Catalysts for the company's stock performance include successful domestic substitution validation of advanced process equipment, increased capital expenditure from major Chinese wafer fabs, rising investments driven by AI, and the company's efforts in industry consolidation and external acquisitions [3]