早上起来，市场已经炸锅了，英伟达要投1000亿美元给OpenAI。 越来越卷的AI行业 下面这个国外大厂的AI芯片的Roadmap，比国内还要激进，基本都是一年会出一到两个新的产品。 英伟达与OpenAI的这项高达1000亿美元的投资协议并非单纯的资金注入，而是通过逐步部署10吉瓦 AI数据中心的方式实现，首阶段将于2026年下半年上线，使用英伟达的Vera Rubin平台。 英伟达的投资动机 1、锁定客户需求与供应链主导权，OpenAI作为AI领域的领军者，英伟达通过投资确保OpenAI优先 使用其芯片，形成"资金循环"：英伟达提供资金，OpenAI用于购买英伟达硬件。这不仅保证了英伟 达的销售需求，还防止OpenAI转向竞争对手，如Google的TPU或AMD的MI系列芯片。 这里的"资金闭环"，网上有多种解释，无论是通过Oracle，还是通过微软和Coreweave，对英伟达和 OpenAI来说，都是有利的。 THE INFINITE MONEY GLITCH OpenAl $100 billion voilla oo ta 8100 billion NVIDIA. 2、这一合作标志着英伟达从芯片供应商 ...

Core Viewpoint - The article discusses the recent high interest in NVIDIA's new liquid cooling solution, specifically the microchannel lid, and its implications for the semiconductor industry [2][4]. Group 1: Investment Bank Perspectives - JP Morgan and Morgan Stanley provided detailed analyses of the microchannel lid, highlighting its efficiency in heat dissipation compared to traditional cooling methods [5]. - The microchannel lid integrates a heat spreader and cold plate, allowing for efficient heat transfer and cooling, which is crucial as chip power requirements increase [8][11]. - The adoption of the microchannel lid could increase the number of quick disconnects (QD) in VR series compute trays to at least 12, compared to 8 in the existing GB300 compute trays [12]. - In the short term, the impact on liquid cooling suppliers is limited, as a significant portion of NVIDIA's GPU shipments will still use traditional cold plates [13]. - Currently, ODMs are in the testing phase for the microchannel lid, with a decision expected in one to two months [14]. Group 2: Industry Perspectives - The microchannel lid concept was discussed in the industry as early as late August, with market speculation about its potential use in NVIDIA's Rubin GPU [15]. - Jentech, a key supplier for NVIDIA's lid products, is closely tied to NVIDIA's technology iterations and order fluctuations, which can influence its stock performance [16]. - The maturity of different cooling technologies ranks single-phase cold plates as significantly ahead, followed by dual-phase cold plates and immersion cooling, with microchannel lids lagging behind [18]. - Cold plate suppliers like AVC indicated that the microchannel lid may not be adopted until the release of the Rubin Ultra model, as current production timelines do not support its implementation [18]. - Companies are currently sending samples for the microchannel lid, but sample approval does not guarantee immediate procurement [19]. - Key players in the lid and cold plate sectors, such as Jentech and AVC, are conducting advanced research on microchannel lids, but it remains uncertain which company will dominate the market [21]. - Besides microchannel lids, 3D printing is also emerging as a cutting-edge research direction in the cooling field, offering high precision and customization capabilities [21].