Core Viewpoint - Chinese automotive companies are accelerating the localization of automotive chips, aiming for 100% domestic production by 2027, driven by policy guidance and market awareness, significantly impacting the global chip landscape [1]. Group 1: Chip Classification and Current Status - Automotive chips are essential for the "soft and hard integration" architecture of modern vehicles, with a single vehicle typically requiring hundreds of chips across various functions [5]. - Chips can be categorized into five types: main control (e.g., MCU, SoC), communication (e.g., CAN/LIN/Ethernet transceivers), power (e.g., IGBT drivers), sensor (e.g., millimeter-wave radar front-end), and functional safety chips (e.g., TPM) [6]. - Chinese chip manufacturers have made breakthroughs primarily in main control and communication chip products [6][8]. Group 2: Current Developments in Domestic Chip Production - Companies like Neusoft Carrier, Jiefa Technology, and Huada Semiconductor have launched automotive-grade MCU products that meet AEC-Q100 certification, supporting ISO 26262 safety standards [8]. - In the communication chip sector, companies such as Xingyu Technology and Xinyi Information have achieved small-scale production of domestic CAN and Ethernet PHY chips, with some products entering the vehicle development cycle [8]. - High-performance intelligent driving SoC chips are still dominated by a few companies, with examples like Horizon's Journey series and Huawei's Kirin series, which are being deployed in various vehicle models [9]. Group 3: Trends in Chip Research and Development - Chinese automotive companies are transitioning from being "chip purchasers" to "chip architecture participants" and even "definers," with firms like XPeng leading the way in self-developed AI chip strategies [10]. - The evolution of hardware architecture is moving towards SoC integration platforms that emphasize multi-domain collaboration, requiring chip companies to possess both hardware design capabilities and a complete software SDK stack [12]. - Collaborations between automotive and chip companies are increasing, with examples including Geely's partnership with Hezhima for intelligent driving platforms and BYD's full-stack self-research model for core modules [13][15].

申请入围"中国IC独角兽" 半导体高质量发展创新成果征集 在当下中国汽车智驾产业的发展进程中，自研芯片成为一股不可忽视的力量。从市场份额数据来看，不同企业的自研芯片各有表现。盖世汽车研究院数据 显示，2024年上半年，英伟达Orin-X以近73万颗的装机量，占据35.9%市场份额，在国内智驾芯片市场仍占据重要地位。但中国本土企业也在奋力追赶， 不断抢占市场份额。其中，地平线、华为、黑芝麻智能、蔚来汽车等企业已推出多款具备国际竞争力的产品。这些芯片在算力、能效比、量产进度及生态 布局方面展现出差异化优势，逐步挑战英伟达Orin的统治地位。 地平线作为国内智驾科技领域的佼佼者，根据高工智能汽车研究院数据，2024年上半年凭借征程系列计算方案，以28.65%的份额位居市场第一，在自主 品牌乘用车前视一体机计算方案市场（L2ADAS）更是以33.73%的市场份额跃居首位。其征程家族产品覆盖低、中、高阶全场景智驾量产需求，累计出货 量已超600万套，并且已经赋能超80家生态伙伴推出成熟产品，超40家投入主机厂定点及量产项目，强大的市场影响力和广泛的客户基础，使其在市场竞 争中优势明显。 黑芝麻智能同样表现不俗，2022 ...