Core Insights - The 2025 World Artificial Intelligence Conference (WAIC) highlighted the significance of "super nodes" in AI computing infrastructure, with Huawei showcasing its Ascend 384 super node, which boasts a computing power of 300 PFLOPs, nearly double that of NVIDIA's GB200 NVL72 system [1][3] - Domestic AI chip manufacturers are increasingly embracing the super node trend, moving beyond mere parameter comparisons to collaborative efforts, as seen in a rare joint appearance of executives from four domestic AI chip companies [2][11] - The demand for AI computing power is rapidly increasing, leading to the emergence of the "super node" concept as a recognized solution to meet the needs of large-scale AI models [3][4] Super Node Development - The super node concept, proposed by NVIDIA, involves connecting multiple high-performance AI servers to form a larger, more powerful computing node, specifically designed for complex AI model calculations [3][4] - Current super node implementations are characterized by high-performance GPUs interconnected within a single node, with a focus on maintaining consistent bandwidth and latency [4][5] - The future of domestic super node solutions will involve maximizing computing power within individual cabinets and connecting multiple cabinets through optical interconnects [6] Industry Collaboration and Innovation - The WAIC showcased various super node products from multiple vendors, including high-density liquid cooling systems and innovative interconnect technologies, indicating a competitive landscape among domestic manufacturers [7][8] - The emergence of the "AI factory" concept by domestic GPU manufacturers aims to address the efficiency bottlenecks in training large models, emphasizing the need for a comprehensive AI training infrastructure [9][10] - The establishment of the "Model-Chip Ecological Innovation Alliance" signifies a deeper integration between domestic AI models and chips, promoting collaboration among various stakeholders in the industry [11][12]

（原标题：【WAIC2025】 AI算力创新竞速，国产化实践走出超节点等新路） 在世博展览馆内，为应用提供底座能力的AI芯片、服务器、智算中心等厂商，展示了在芯片底层架构的自主研发，软件、整机的国产化适配，以 及针对应用场景的解决方案等方面的创新尝试。 AI算力创新 在H1核心技术馆内，阶跃星辰、月之暗面、智谱等大模型厂商的展台人流攒动。与这些模型厂商展台错落有致搭配的是沐曦、无问芯穹、摩尔线 程、燧原科技等算力厂商的展台。 伴随模型的迭代演进，人们对算力的需求也呈指数级增长。 正处于上市辅导备案中的沐曦展示了基于曦云C500系列芯片的服务器以及解决方案。展台人员介绍，服务器从编译、驱动到互联等全链路均已实 现国产化。 沐曦还首次展出了曦云C600通用GPU——一颗基于国产供应链设计、制造，自主可控的训推一体自研芯片。 经济观察报记者在展台未发现C600的性能、参数等内容。展台人员介绍，该芯片配置了业内前沿的显存，能强力支撑大模型训练、推理期间的海 量数据吞吐，主要用于云端AI训练与推理、通用计算、AI for Science等计算任务。 国内端边大模型AI芯片企业后摩智能是第二次参加WAIC，首发并展示了自 ...